Patent US3720309A successfully refreshed from Google Patents.
US3720309A
Expired / Lapsed
US
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Method and apparatus for sorting semiconductor dice
Assignee: TDY Industries LLC
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Filing: 1971-12-07
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Granted: 1973-03-13
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Expires: 1991-12-07
Abstract
Abstract A method and apparatus therefor for sorting semiconductor dice from a monolithic wafer where after being data logged the wafer is placed on sticky tape located on an X,Y indexing table and a vacuum probe picks a single selected die from the wafer to a receiving table also having sticky tape. The receiving table is rotatable and also indexed along a radial line to allow matched pairs of semiconductor dice to be formed in adjacent concentric circles. A vacuum technique prevents damage to the individual dice while being picked. In addition, dice coordinate changes due to fracturing are compensated for.
Inventors
- 👤 B Weir
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 14:25
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/06; H10P72/0611; B; B07; B07C; B07C5/00; B07C5/34; B07C5/344; H10P72/70; H10P72/74; H10P72/7402; H10P72/7416; Y; Y10; Y10S; Y10S209/00; Y10S209/905; Y10S209/914; Y10S209/921; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/17; Y10T156/1702; Y10T156/1744; Y10T156/1776
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
70 words
A method of sorting semiconductor dice from a monolithic wafer of said dice, comprising the steps of, testing said dice and relating the test results to the coordinate position of each die on the wafer, fracturing said wafer to divide said dice, successively picking pairs of dice having related test results from said fractured wafer and placing said pairs in adjacent concentric circles on a receiving sheet of adhesive material.
Claim 2
Independent Claim
70 words
A method of sorting semiconductor dice from a monolithic wafer of said dice, comprising the steps of, testing said dice and relating the test results to the coordinate position of each die on the wafer, fracturing said wafer to divide said dice, successively picking pairs of dice having related test results from said fractured wafer and placing said pairs in adjacent concentric circles on a receiving sheet of adhesive material.
Claim 3
Independent Claim
70 words
A method of sorting semiconductor dice from a monolithic wafer of said dice, comprising the steps of, testing said dice and relating the test results to the coordinate position of each die on the wafer, fracturing said wafer to divide said dice, successively picking pairs of dice having related test results from said fractured wafer and placing said pairs in adjacent concentric circles on a receiving sheet of adhesive material.
Claim 4
Independent Claim
70 words
A method of sorting semiconductor dice from a monolithic wafer of said dice, comprising the steps of, testing said dice and relating the test results to the coordinate position of each die on the wafer, fracturing said wafer to divide said dice, successively picking pairs of dice having related test results from said fractured wafer and placing said pairs in adjacent concentric circles on a receiving sheet of adhesive material.
Claim 5
Dependent Claim
86 words
A method as in claim 1 where in said testing of said dice at least three X, Y coordinate points are located on said wafer and including the step after fracturing of said wafer obtaining new coordinate points, U, V, of said three X, Y reference points and relating said U, V points to said X, Y points by Ui AXi + BYi + C Vi DXi + EYi + F where A - F are constants, whereby stretching of the wafer during fracturing is compensated.
Claim 6
Dependent Claim
166 words
Apparatus for sorting semiconductor dice from a monolithic wafer comprising: a sheet of adhesive material to which said wafer is adhered; vacuum probe means positionable over the exposed side of a predetermined die; pusher means juxtaposed with said vacuum needle on the side of said material opposite the side to which said wafer is adhered including, a sharp pointed pusher needle operable from a rest position to an activateD position for piercing said material and freeing said predetermined die from said adhesive material; needle holder means in which said needle is slidable between said rest and activated positions, said holder means having a shaped end for contacting said opposite side of said material; vacuum means surrounding said holder means for forming a cavity which includes a portion of said opposite side of said material for causing said material to conform to said shaped end; means for drawing a vacuum in said cavity and means for sliding said needle from said rest position to said activated position.
Claim 7
Dependent Claim
166 words
Apparatus for sorting semiconductor dice from a monolithic wafer comprising: a sheet of adhesive material to which said wafer is adhered; vacuum probe means positionable over the exposed side of a predetermined die; pusher means juxtaposed with said vacuum needle on the side of said material opposite the side to which said wafer is adhered including, a sharp pointed pusher needle operable from a rest position to an activateD position for piercing said material and freeing said predetermined die from said adhesive material; needle holder means in which said needle is slidable between said rest and activated positions, said holder means having a shaped end for contacting said opposite side of said material; vacuum means surrounding said holder means for forming a cavity which includes a portion of said opposite side of said material for causing said material to conform to said shaped end; means for drawing a vacuum in said cavity and means for sliding said needle from said rest position to said activated position.
Claim 8
Dependent Claim
21 words
Apparatus as in claim 3 where said means for sliding said needle concurrently lowers said vacuum probe toward said predetermined die.
Claim 9
Dependent Claim
21 words
Apparatus as in claim 3 where said vacuum probe has an end diameter slightly greater than the diameter of said dice.
References Cited (Backward Citations)
US3503500A
Cited
US3583561A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-03-12 | 1976-09-11 | 1977-03-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-03-12 | 1980-09-11 | 1981-03-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-03-12 | 1984-09-11 | 1985-03-13 | $7700.00 | Window Closed / Lapsed |