US3583561A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Die sorting system
Assignee: Transistor Automation Corp
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Filing: 1968-12-19
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Granted: 1971-06-08
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Expires: 1988-12-19
Abstract
Abstract A wafer of semiconductor devices is tested to determine the quality of each device. The test data with respect to each die is electro-optically encoded and photographically recorded in a pattern corresponding to the die pattern on the wafer. Upon completion of the testing and recording operations the wafer is scored, mounted on a flexible pressure-sensitive adhesive web and broken so as to separate the dies from one another while maintaining their original orientation. The dice and their respective test record are then mounted on a common frame, sideby-side, so that each die and its test data are readily matched. The frame is then mounted on a die-sorting mechanism comprised of an XY indexing table which indexes the wafer die by die through a removal station and the film indexed through an electro-optical reader where the test data is read out to designate the die to a selected delivery station.
Inventors
- 👤 Mordechai Wiesler
- 👤 Virgil Martinonis
- 👤 John S Macintyre
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 22:49
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/06; H10P72/0611; B; B07; B07C; B07C5/00; B07C5/34; B07C5/3412; B07C5/344; G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2893; G01R31/302; G01R31/308; G01R31/311; Y; Y10; Y10S; Y10S209/00; Y10S209/905; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49789; Y10T29/4979
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
101 words
The method of sorting semiconductor devices from a monolithic wafer of said devices, comprising the steps of a. testing each of said devices and obtaining data specifying the characteristics of said devices, b. electro-optically encoding said data on a recording stratum as coded images, one each of said coded images denoting the characteristics of one eacH of said devices, said coded images arranged in an array related to said monolithic wafer, c. dividing said devices from one another while maintaining their orientation, and then d. sorting said devices from one another according to said characteristics as presented by said coded images.
Claim 2
Independent Claim
101 words
The method of sorting semiconductor devices from a monolithic wafer of said devices, comprising the steps of a. testing each of said devices and obtaining data specifying the characteristics of said devices, b. electro-optically encoding said data on a recording stratum as coded images, one each of said coded images denoting the characteristics of one eacH of said devices, said coded images arranged in an array related to said monolithic wafer, c. dividing said devices from one another while maintaining their orientation, and then d. sorting said devices from one another according to said characteristics as presented by said coded images.
Claim 3
Dependent Claim
36 words
The method of claim 1 wherein said dividing step includes scoring said wafer, mounting said wafer on the adhesive face of a flexible web, and bending said wafer along the scorelines to break said devices apart.
Claim 4
Dependent Claim
49 words
The method of claim 2 wherein said devices are removed from said web by first displacing a device from the plane of said wafer in a direction away from said web by pressure on said web opposite said device and then pulling said device free of said adhesive face.
Claim 5
Dependent Claim
17 words
The method of claim 1 including the step of packaging like devices after they have been sorted.
Claim 6
Dependent Claim
21 words
The method of claim 1 wherein said encoding steps includes producing projectable coded images corresponding in positional arrangement with said devices.
Claim 7
Dependent Claim
21 words
The method of claim 5 wherein said sorting step includes projecting said coded images and converting said images into electrical signals.
Claim 8
Dependent Claim
20 words
The method of claim 5 including the step of mounting said projectable images and the divided devices in side-by-side relation.
Claim 9
Independent Claim
106 words
A system for sorting semiconductor devices from a monolithic wafer of devices, comprising a. a test station for testing each device to determine its characteristics, b. an electro-optical encoder operatively connected to said test station for producing on a single sheet coded images containing test data of said devices, c. a dividing station for dividing said devices while maintaining their orientation, d. a reading station including an electro-optical decoder for reading the images on said sheet and producing electrical signals thereby and, e. a sorting station responsive to said reading station for separating said devices from said wafer and delivering to collection stations of like devices.
Claim 10
Independent Claim
106 words
A system for sorting semiconductor devices from a monolithic wafer of devices, comprising a. a test station for testing each device to determine its characteristics, b. an electro-optical encoder operatively connected to said test station for producing on a single sheet coded images containing test data of said devices, c. a dividing station for dividing said devices while maintaining their orientation, d. a reading station including an electro-optical decoder for reading the images on said sheet and producing electrical signals thereby and, e. a sorting station responsive to said reading station for separating said devices from said wafer and delivering to collection stations of like devices.
Claim 11
Dependent Claim
25 words
A system according to claim 8 including a mounting station for mounting said sheet and the divided wafer in side-by-side relation to a common frame.
Claim 12
Independent Claim
85 words
The method of sorting semiconductor devices from a monolithic wafer of said devices, comprising the steps of a. testing each of said devices and obtaining characteristics signals thereby, b. electro-optically encoding said signals into recorded instructions and producing projectable coded images corresponding in positional arrangement with said devices, c. dividing said devices from one another while maintaining their orientation, d. mounting said projectable images and the divided devices in side-by-side relation, and e. sorting said devices from one another in accordance with said recorded instructions.
Claim 13
Independent Claim
85 words
The method of sorting semiconductor devices from a monolithic wafer of said devices, comprising the steps of a. testing each of said devices and obtaining characteristics signals thereby, b. electro-optically encoding said signals into recorded instructions and producing projectable coded images corresponding in positional arrangement with said devices, c. dividing said devices from one another while maintaining their orientation, d. mounting said projectable images and the divided devices in side-by-side relation, and e. sorting said devices from one another in accordance with said recorded instructions.
Claim 14
Independent Claim
123 words
A system for sorting semiconductor devices from a monolithic wafer of devices, comprising a. a test station for testing each device to determine its characteristics, b. an electro-optical encoder operatively connected to said test station for producing on a sheet-coded images containing test data of said devices, c. a dividing station for dividing said devices while maintaining their orientation, d. a reading station including an electro-optical decoder for reading the images on said sheet and producing electrical signals thereby, e. a mounting station for mounting said sheet and the divided wafer in side-by-side relation to a common frame, and f. a sorting station responsive to said reading station for separating said devices from said wafer and delivering to collection stations of like devices.
Claim 15
Independent Claim
123 words
A system for sorting semiconductor devices from a monolithic wafer of devices, comprising a. a test station for testing each device to determine its characteristics, b. an electro-optical encoder operatively connected to said test station for producing on a sheet-coded images containing test data of said devices, c. a dividing station for dividing said devices while maintaining their orientation, d. a reading station including an electro-optical decoder for reading the images on said sheet and producing electrical signals thereby, e. a mounting station for mounting said sheet and the divided wafer in side-by-side relation to a common frame, and f. a sorting station responsive to said reading station for separating said devices from said wafer and delivering to collection stations of like devices.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-06-07 | 1974-12-07 | 1975-06-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-06-07 | 1978-12-07 | 1979-06-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-06-07 | 1982-12-07 | 1983-06-08 | $7700.00 | Window Closed / Lapsed |