Semiconductor apparatus and method for manufacturing the same

Claim 1

In a method for manufacturing a semiconductor apparatus comprising the steps of: taking two electrode substrate plate members and subjecting at least a part of said plate members, excepting that part which is to contact electrodes of a semiconductor element, to a surface treatment in order to increase the adhesion of adhesive applied thereto; arranging said two plate members substantially in parallel while positioning a plurality of laminated electrically insulating layer members between said plate members so that said layer members will be mounted to each other and to the plate members by adhesive preimpregnated in said insulating layer members, at least one of said plate and layer members having recesses formed therein for receiving semiconductor elements, and, meanwhile, juxtapositioning semiconductor elements having at least two electrodes with regard to said recesses so that said semiconductor element electrodes shall contact said non-treated parts of said plate members while being sealed between said plate and layer members in said recesses when said plate and layer members are pressed together, and, pressing said plate and layer members together to form a unitary structure; the improvement therein, wherein at least one of said layer member defines an envelope having a lower fin section for holding the semiconductor element at a prescribed position, and including the additional steps of superposing on said defined envelope another laminated electrode substrate containing a conductive plate provided with grooves to define conductive passageways, sealing by heat and pressure the semiconductor elements between one of said plate members superposed on said envelope and said other laminated electrode substrate, and, electrically connecting said other laminated electrode substrate and said plate member to the electrodes of the semiconductor elements.