Patent US3711081A successfully refreshed from Google Patents.
US3711081A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor wafer chuck
Assignee: International Business Machines Corp
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Filing: 1970-03-31
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Granted: 1973-01-16
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Expires: 1990-03-31
Abstract
Abstract This patent discloses apparatus for accurately aligning a semiconductor wafer to a photo mask, the apparatus disclosed comprising a base and a frame for the apparatus. The base portion includes a chamber in which is mounted a piston which is restrained from lateral movement while permitting vertical reciprocation thereof. In the upper portion of the piston is a socket which supports a gimbal, the gimbal including means for receiving a wafer thereon. Mounted on the frame is a carriage which includes means for positioning a mask in superimposed overlapping relation relative to the gimbal while clamping the mask to the frame. Also disclosed is fluid supply means which is connected to the socket so that the gimbal will float on a cushion, for example, of air. The piston is provided with elevating means to cause the piston to raise beyond the point of contact of a wafer mounted on the gimbal with the mask. Also disclosed is means responsive to the increase in fluid pressure which results from the contact of the wafer with the mask for stopping the elevating means and thus the piston. Thereafter the piston is lowered a preset and predetermined amount to thereby space the wafer from the mask permitting adjustment of the base relative to the frame. Also disclosed is a novel gimbal with a wafer alignment apparatus built in so as to automatically initially position the wafer in a desired predetermined position on the gimbal.
Inventors
- 👤 R Cachon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 11:42
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70691; H; H10; H10P; H10P72/00; H10P72/50; H10P72/57
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
75 words
A semiconductor wafer chuck comprising an element including at least one substantially planar surface for receiving a wafer thereon; means for applying a vacuum to said surface; guide means mounted peripherally of at least the portion of said surface intended for receipt of said wafer; and means for actuating said guide means between a first raised position above the plane of said surface for contact and guidance of said wafer, and a second recessed position.
Claim 2
Dependent Claim
75 words
A semiconductor wafer chuck comprising an element including at least one substantially planar surface for receiving a wafer thereon; means for applying a vacuum to said surface; guide means mounted peripherally of at least the portion of said surface intended for receipt of said wafer; and means for actuating said guide means between a first raised position above the plane of said surface for contact and guidance of said wafer, and a second recessed position.
Claim 3
Dependent Claim
31 words
A semiconductor wafer chuck in accordance with claim 1 wherein said second position is at least below the plane of the upper surface of a wafer mounted on said planar surface.
Claim 4
Dependent Claim
36 words
A semiconductor wafer chuck in accordance with claim 1 including locator means along one edge of said chuck and normally projecting above said planar surface; and means for recessing said locator means below said planar surface.
Claim 5
Dependent Claim
131 words
A semiconductor wafer chuck comprising an element including at least one substantially planar surface for receiving a wafer thereon; means for applying a vacuum to said surface, said means including a plurality of radially extending slots in said planar surface and piston means in said slots; means in said piston means to permit an application of vacuum to said slots through said pistons and to permit elevation of said pistons above said planar surface upon application of a positive pressure to said pistons; guide means mounted peripherally of at least a portion of said surface intended for receipt of said wafer; and means for actuating said guide means between a first raIsed position above the plane of said surface for contact and guidance of said wafer, and a second recessed position.
Claim 6
Dependent Claim
131 words
A semiconductor wafer chuck comprising an element including at least one substantially planar surface for receiving a wafer thereon; means for applying a vacuum to said surface, said means including a plurality of radially extending slots in said planar surface and piston means in said slots; means in said piston means to permit an application of vacuum to said slots through said pistons and to permit elevation of said pistons above said planar surface upon application of a positive pressure to said pistons; guide means mounted peripherally of at least a portion of said surface intended for receipt of said wafer; and means for actuating said guide means between a first raIsed position above the plane of said surface for contact and guidance of said wafer, and a second recessed position.
Claim 7
Dependent Claim
136 words
A semiconductor wafer chuck comprising an element including at least one substantially planar surface for receiving a wafer thereon; means for applying a vacuum to said surface; a slot extending transversely of said element and underlying said surface; guide means including a deflectable member disposed in said slot and including opposite terminal ends projecting from said element; cam means in said slot bearing against said member; piston means connected to said member; upstanding first and second flanges connected to opposite ends of said member, and means communicating with said piston means to cause movement of said piston and camming of said deflectable member against said cam means thereby effecting reciprocation of said flanges between a first raised position above the plane of said surface for contact and guidance of said wafer, and a second recessed position.
Claim 8
Dependent Claim
136 words
A semiconductor wafer chuck comprising an element including at least one substantially planar surface for receiving a wafer thereon; means for applying a vacuum to said surface; a slot extending transversely of said element and underlying said surface; guide means including a deflectable member disposed in said slot and including opposite terminal ends projecting from said element; cam means in said slot bearing against said member; piston means connected to said member; upstanding first and second flanges connected to opposite ends of said member, and means communicating with said piston means to cause movement of said piston and camming of said deflectable member against said cam means thereby effecting reciprocation of said flanges between a first raised position above the plane of said surface for contact and guidance of said wafer, and a second recessed position.
Claim 9
Dependent Claim
112 words
A semiconductor wafer chuck comprising an element including at least one substantially planar surface for receiving a wafer thereon; means for applying a vacuum to said surface; guide means mounted peripherally of said surface; and means for actuating said guide means between a first raised position above the plane of said surface for contact and guidance of said wafer and a second recessed position; locator means along one edge of said wafer chuck and normally projecting above said planar surface, a notch along the periphery of said planar surface, a post connected to said locator means and positionable in said notch; and means for recessing said locator means below said planar surface.
Claim 10
Dependent Claim
112 words
A semiconductor wafer chuck comprising an element including at least one substantially planar surface for receiving a wafer thereon; means for applying a vacuum to said surface; guide means mounted peripherally of said surface; and means for actuating said guide means between a first raised position above the plane of said surface for contact and guidance of said wafer and a second recessed position; locator means along one edge of said wafer chuck and normally projecting above said planar surface, a notch along the periphery of said planar surface, a post connected to said locator means and positionable in said notch; and means for recessing said locator means below said planar surface.
Claim 11
Dependent Claim
60 words
A semiconductor wafer chuck in accordance with claim 6 including a cavity in said element; a beam extending from said cavity through said element, said beam being connected to said post; piston means connected to said beam in said cavity, and means for effecting reciprocation of said piston in said cavity to thereby cause projection and recession of said post.
Claim 12
Dependent Claim
30 words
A semiconductor wafer chuck in accordance with claim 7 wherein said means to effect reciprocation of said piston in said cavity comprises means for applying a vacuum to said cavity.
References Cited (Backward Citations)
US2836242A
Cited
US3108791A
Cited
US3192844A
Cited
US3475097A
Cited
US3412991A
Cited
US3499714A
Cited
US3484093A
Cited
US3595555A
Cited
US3555936A
Cited
US3572736A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-01-16 | 1976-07-17 | 1977-01-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-01-16 | 1980-07-17 | 1981-01-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-01-16 | 1984-07-17 | 1985-01-16 | $7700.00 | Window Closed / Lapsed |