Abstract A method of manufacturing semi-conductor devices includes the steps of forming a wafer with at least one P-N zone and at least one N-N zone and with the wafer positioned on a support, dividing the wafer into a plurality of parts each of which is to constitute a device. Channels are defined between the devices and P-N junctions are exposed in the channels. A curable compound capable of protecting the P-N junctions is then poured into the channels, and the compound is cured so as to form a membrane adhering to the devices and interconnecting the devices to facilitate handling thereof. The adhesion of the membrane to the devices is arranged to be substantially greater than the cohesive properties of the membrane so that, in use, the devices can be separated from the membrane by peeling the membrane from the devices. Then after the devices have been separated from the membrane, a portion of the membrane adheres to the exposed parts of the P-N junctions of the devices to provide protection of the P-N junctions.
A method as claimed in claim 1 wherein said curable compound is a silicone elastomer.
Claim 2
Dependent Claim
127 words
A method as claimed in claim 1 including the further steps of providing a further curable compound on the membrane so as to cover the membrane, and curing said further compound so as to form a layer of material on the membrane adhering to the membrane, the adhesion of said layer of material to the membrane and the cohesive properties of the material being arranged to be substantially greater than the cohesive properties of the membrane, so that, in use, when said layer of material is peeled from the membrane said membrane is peeled from the devices to separate the devices from the membrane, whereafter portions of the membrane adhere to the exposed parts of the P-N junctions of the devices to provide protection of said junctions.
Claim 3
Dependent Claim
66 words
A method as claimed in claim 3 wherein said further curable compound is applied to the membrane so as to define, on curing, a tongue integral with said layer of material covering the membrane, the tongue projecting from the membrane and being gripped, in use, when it is required to remove said layer of material from the membrane and thereby separate the devices from the membrane.