Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
186 words
A process for assembling a semiconductive chip bearing integrated circuitry, an array of conductor strips and a heatdissipating metallic member into a modular unit, comprising the steps of: providing said member with a platform and with a pair of upstanding bosses on opposite sides of said platform; forming said conductor strips as part of a coherent metal foil having a pair of lateral wings alignable with said bosses, said strips being integrally interconnected and joined to said wings by bridge portions coming to lie beyond the outline of said member upon emplacement of said wings on said bosses with said strips terminating in the vicinity of said platform; positively securing said wings to said bosses; depositing said chip on said platform in bonded relationship therewith; joining said strips to respective terminals of said chip; encasing a portion of said coil including said wings and parts of said strips together with said chip in a body of resinous material while leaving said bridge portions free, said body adhering to said member; and insulating said strips from one another and from said wings by severing said bridge portions.
Claim 2
Dependent Claim
186 words
A process for assembling a semiconductive chip bearing integrated circuitry, an array of conductor strips and a heatdissipating metallic member into a modular unit, comprising the steps of: providing said member with a platform and with a pair of upstanding bosses on opposite sides of said platform; forming said conductor strips as part of a coherent metal foil having a pair of lateral wings alignable with said bosses, said strips being integrally interconnected and joined to said wings by bridge portions coming to lie beyond the outline of said member upon emplacement of said wings on said bosses with said strips terminating in the vicinity of said platform; positively securing said wings to said bosses; depositing said chip on said platform in bonded relationship therewith; joining said strips to respective terminals of said chip; encasing a portion of said coil including said wings and parts of said strips together with said chip in a body of resinous material while leaving said bridge portions free, said body adhering to said member; and insulating said strips from one another and from said wings by severing said bridge portions.
Claim 3
Dependent Claim
35 words
A process as defined in claim 1 wherein said bosses are provided with reduced extensions fitting into perforations of said wings, the latter being fastened to said bosses by flattening said extensions into rivet heads.
Claim 4
Dependent Claim
21 words
A process as defined in claim 1 wherein said chip is simultaneously joined to said platform and said strips by soldering.
Claim 5
Dependent Claim
29 words
A process as defined in claim 1 wherein said body is molded partly around said member, leaving free a pair of mounting formations on opposite extremities of said member.
Claim 6
Dependent Claim
30 words
A process as defined in claim 1 wherein said strips are arrayed in two sets extending from opposite sides of said member upon emplacement of said wings on said bosses.
Claim 7
Dependent Claim
130 words
An intermediate product in the manufacture of a modular unit, comprising: a heat-dissipating metallic member provided with a platform and a pair of upstanding bosses flanking said platform; a semiconductive chip bearing integrated circuitry, said chip resting on said platform in bonded relationship therewith; an array of conductor strips connected to respective terminals of said chip, said strips forming part of a coherent metal foil also including a pair of wings resting on said bosses, said strips being spaced from said member and being integrally connected to one another and to said wings by bridge portions lying beyond the outline of said member; and a body of synthetic resin adhering to said member and encasing said chip, said wings and parts of said strip while leaving said bridge portions free.
Claim 8
Dependent Claim
130 words
An intermediate product in the manufacture of a modular unit, comprising: a heat-dissipating metallic member provided with a platform and a pair of upstanding bosses flanking said platform; a semiconductive chip bearing integrated circuitry, said chip resting on said platform in bonded relationship therewith; an array of conductor strips connected to respective terminals of said chip, said strips forming part of a coherent metal foil also including a pair of wings resting on said bosses, said strips being spaced from said member and being integrally connected to one another and to said wings by bridge portions lying beyond the outline of said member; and a body of synthetic resin adhering to said member and encasing said chip, said wings and parts of said strip while leaving said bridge portions free.
Claim 9
Dependent Claim
27 words
A product as defined in claim 6 wherein said bosses have upward extensions passing through perforations of said wings, said extensions forming rivet heads above said wings.
Claim 10
Dependent Claim
35 words
A product as defined in claim 6 wherein said member is a flat bar having two extremities projecting beyond said body, said extremities being provided with mounting formations for fastening said bar to a support.
Claim 11
Dependent Claim
16 words
A product as defined in claim 8 wherein said formations are cutouts surrounded by exposed lands.
Claim 12
Dependent Claim
28 words
A product as defined in claim 6 wherein said strips are arrayed in two sets projecting from opposite sides of said body at the level of said platform.