Alloying method

Abstract

Abstract This application discloses a method of joining two materials together by alloying wherein only a portion of one of the materials is heated to a temperature less than its melting point but greater than the eutectic temperature of the two materials. After the portion of the material has been so heated, the second material is brought into contact with the heated portion. A cooling medium may be passed over the materials alloyed to aid in the cooling of the alloy junction. A preferred embodiment of the invention is disclosed wherein a semiconductor material or chip is alloyed to a support member by rapidly heating the area of the support to which the chip is to be alloyed to an alloying temperature which is above the eutectic temperature and below the melting point of the support, preheating the surface of the chip to be alloyed to the support, bringing the areas to be alloyed into contact with a following pressure to cause essentially instant melting and alloying of the contacted surfaces, and cooling the alloyed areas immediately following contact. The heating and cooling may be accomplished by any suitable means, but a hot or cold gas stream is preferred.

Inventors

• 👤 Clair A Johnson

Bibliographic Details