Patent US3672047A successfully refreshed from Google Patents.
US3672047A
Expired / Lapsed
US
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Method for bonding a conductive wire to a metal electrode
Assignee: Hitachi Ltd
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Filing: 1970-12-29
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Granted: 1972-06-27
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Expires: 1990-12-29
Abstract
Abstract A connector wire is bonded to a solder electrode by pressing the end portion thereof to the solder electrode by using a capillary while the capillary is heated up to a temperature not less than the melting point of the solder, by melting the solder electrode and then by cooling the whole bonding area of the connector wire and the solder electrode, thereby the end portion of the connector wire is buried in the solder electrode and is firmly fixed thereto.
Inventors
- 👤 Yuzaburo Sakamoto
- 👤 Morio Toyooka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 16:33
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; B23K20/005; B23K20/007; H; H10; H10W; H10W70/00; H10W70/099; H10W72/00; H10W72/01; H10W72/019; B23K2101/00; B23K2101/36; B23K2101/38; B23K2101/40; H10W72/015; H10W72/01515; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07536; H10W72/07541; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/90; H10W72/931; H10W72/951; H10W72/952; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
21 words
A method as defined in claim 1, wherein said conductive wire consists essentially of silver and said metal layer is solder.
Claim 2
Dependent Claim
21 words
A method as defined in claim 1, wherein said conductive wire consists essentially of gold and said metal layer is solder.
Claim 3
Dependent Claim
38 words
A method as defined in claim 1, including the further step of heating said metal layer to a temperature close to but less than the melting point thereof prior to pressing the conductive wire into the metal layer.
Claim 4
Dependent Claim
24 words
A method as defined in claim 1, wherein said metal layer comprises a metal electrode having a solder layer disposed thereon facing said capillary.
Claim 5
Dependent Claim
49 words
A method as defined in claim 1, wherein a head is formed on said conductive wire at the free end thereof protruding from said capillary prior to pressing the conductive wire into the metal layer so that said capillary exerts a force on said wire during said pressing step.
Claim 6
Dependent Claim
50 words
A method as defined in claim 1, including the further steps of moving said capillary to another position over said metal layer after it is pulled up on said wire without cutting the wire, and then bonding a second portion of the wire to the metal layer by thermo-compression bonding.
Claim 7
Dependent Claim
38 words
A method as defined in claim 7, including the further step of heating said metal layer to a temperature close to but less than the melting point thereof prior to pressing the conductive wire into the metal layer.
Claim 8
Dependent Claim
24 words
A method as defined in claim 8, wherein said metal layer comprises a metal electrode having a solder layer disposed thereon facing said capillary.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-06-27 | 1975-12-27 | 1976-06-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-06-27 | 1979-12-27 | 1980-06-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-06-27 | 1983-12-27 | 1984-06-27 | $7700.00 | Window Closed / Lapsed |