Probe and head assembly

Claim 1

A probe assembly for making contact with integrated circuit wafer under test, comprising: a. a unitary body portion, b. a slide portion movably mounted on said unitary body portion, said slide portion being formed with a cutaway section operating to divide said slide portion into two portions, one portion being a resilient hinged portion and the other portion being a relatively fixed portion, said slide portion also formed with a pair of lengthwise slots and a transverse slot; and c. means operatively engaging said lengthwise and transverse slots for selective adjustment of said slide portion with respect to said unitary body portion; and d. a probe mounted on said resilient portion said probe being formed with one opening defining a pair of parallel beam segments extending between a tip portion and the remaining part of said probe, said tip portion extending in a plane substantially perpendicular to said parallel beam segments which operate to deflect said tip portion in a plane perpendicular to the plane of said workpiece when said tip portion and workpiece are engaged whereby said tip portion will deflect with respect to the remaining part of said probe when said remaining part is restrained and said tip portion engages aid integrated circuit under test.