Patent US3644980A successfully refreshed from Google Patents.
US3644980A
Expired / Lapsed
US
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Component removal device
Assignee: Pace Inc
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Filing: 1969-06-25
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Granted: 1972-02-29
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Expires: 1989-06-25
Abstract
Abstract An apparatus to permit the removal of soldered components from a mounting surface. A molten solder bath is employed to heat the securing solder to its melting point. A spring loaded gripper device holds the component during the heating operation. When the securing solder becomes liquid the component is lifted from the mounting surface by the gripper device. During this removal process a vacuum is applied to the mounting area to remove the liquid solder from the mounting holes and the surrounding surface.
Inventors
- 👤 Charles A Class Jr
- 👤 Robert M Van Zyl
- 👤 Donald C Sedberry
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 17:14
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/04; H05K13/0486; H05K13/0491; Y; Y10; Y10T; Y10T29/00; Y10T29/53; Y10T29/53274
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
111 words
Apparatus for removing through the board mounted multilead electronic components from printed circuit boards comprising means for heating securing solder to the liquid state without damaging the printed circuit board, said means having a heat sink with an integral electrical thermal source, a trough conforming to a component mounting hole pattern and containing molten solder and a thermal switch to control the temperature of the heat sink; means for extracting a component from the circuit board; a tubular vacuum connection to permit vacuum to be applied to component mounting holes to remove securing solder in the liquid state from said mounting holes, through said heat sink and into a collector cup.
Claim 2
Dependent Claim
111 words
Apparatus for removing through the board mounted multilead electronic components from printed circuit boards comprising means for heating securing solder to the liquid state without damaging the printed circuit board, said means having a heat sink with an integral electrical thermal source, a trough conforming to a component mounting hole pattern and containing molten solder and a thermal switch to control the temperature of the heat sink; means for extracting a component from the circuit board; a tubular vacuum connection to permit vacuum to be applied to component mounting holes to remove securing solder in the liquid state from said mounting holes, through said heat sink and into a collector cup.
Claim 3
Dependent Claim
70 words
Apparatus according to claim 1 wherein said extracting means consists of a replaceable component gripper having a set of levered jaws that conform to and positively grip the component body, a mating sleeve with integral cam to actuate said jaws, a vertical shaft mounting said jaws over said trough and two springs in series and adjustment means mounted on said shaft to provide a variable extraction force on a component.
Claim 4
Dependent Claim
86 words
The apparatus according to claim 1 wherein said trough means holds the molten solder used for heat transfer to the securing solder and comprises a replaceable plate that is machined to conform to the component mounting hole pattern and is provided with a vacuum connection that permits the application of vacuum to the component holes, an insulator that protects the printed circuit board from contacting the plate, and also seals the bottom of the board so that the vacuum is directed through the component mounting holes.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-02-28 | 1975-08-30 | 1976-02-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-02-28 | 1979-08-30 | 1980-02-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-02-28 | 1983-08-30 | 1984-02-29 | $7700.00 | Window Closed / Lapsed |