US3210182A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Selective removal of excess solder
Assignee: International Business Machines Corp
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Filing: 1962-08-13
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Granted: 1965-10-05
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Expires: 1982-08-13
Abstract
No abstract record available.
Inventors
- 👤 Funari Joseph
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 04:26
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; B; B23; B23K; B23K1/00; B23K1/018; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/264; C; C22; C22C; C22C28/00; C23; C23F; C23F1/00; C23F1/44; B23K2101/00; B23K2101/36; B23K2101/42; H05K3/346; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49751; Y10T29/49755; Y10T29/49757
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
177 words
THE METHOD OF REMOVING EXCESS TIN-LEAD SOLDER PROJECTING BEYOND A DESIRED PLANE SPACED FROM ONE SURFACE OF A PRINTED CIRCUIT BOARD ON WHICH THE SOLDER IS DEPOSITED AND FROM WHICH EXCESS SOLDER IS TO REMOVED, THE DESIRED PLANE BEING LOCATED AT THE SAME SIDE OF THE CIRCUIT BOARD AS SAID ONE SURFACE, COMPRISING THE STEPS OF SKIMMING SAID ONE SURFACE OF THE CIRCUIT BOARD ABOVE THE SURFACE OF A LIQUID BATH OF LOW-MELTING QUATERNARY ALLOY OF BISMUTH, LEAD, TIN AND CADMIUM HEATED TO A TEMPERATRURE OF ABOUT 200*F., THE LOW-MELTING ALLOY COMPRISING BETWEEN 48% AND 55% OF BISMUTH, LESS THAN 33% LEAD, AND HAVING A MELTING TEMPERATURE BELOW ABOUT 185*F., THE DISTANCE OF SAID ONE SURFACE OF THE BOARD ABOVE THE SURFACE OF THE LIQUID BATH BEING SUCH THAT ONLY THE EXCESS SOLDER PROJECTING BEYOND THE DESIRED PLANE DIPS INTO THE LIQUID BATH AND IS DISSOLVED THEREIN WHILE THAT PORTION OF THE SOLDER BETWEEN THE DESIRED PLANE AND SAID ONE SURFACE OF THE BOARD IS UNAFFECTED, AND REMOVING THE CIRCUIT BOARD FROM THE PROXIMITY OF THE BATH.
Claim 2
Independent Claim
177 words
THE METHOD OF REMOVING EXCESS TIN-LEAD SOLDER PROJECTING BEYOND A DESIRED PLANE SPACED FROM ONE SURFACE OF A PRINTED CIRCUIT BOARD ON WHICH THE SOLDER IS DEPOSITED AND FROM WHICH EXCESS SOLDER IS TO REMOVED, THE DESIRED PLANE BEING LOCATED AT THE SAME SIDE OF THE CIRCUIT BOARD AS SAID ONE SURFACE, COMPRISING THE STEPS OF SKIMMING SAID ONE SURFACE OF THE CIRCUIT BOARD ABOVE THE SURFACE OF A LIQUID BATH OF LOW-MELTING QUATERNARY ALLOY OF BISMUTH, LEAD, TIN AND CADMIUM HEATED TO A TEMPERATRURE OF ABOUT 200*F., THE LOW-MELTING ALLOY COMPRISING BETWEEN 48% AND 55% OF BISMUTH, LESS THAN 33% LEAD, AND HAVING A MELTING TEMPERATURE BELOW ABOUT 185*F., THE DISTANCE OF SAID ONE SURFACE OF THE BOARD ABOVE THE SURFACE OF THE LIQUID BATH BEING SUCH THAT ONLY THE EXCESS SOLDER PROJECTING BEYOND THE DESIRED PLANE DIPS INTO THE LIQUID BATH AND IS DISSOLVED THEREIN WHILE THAT PORTION OF THE SOLDER BETWEEN THE DESIRED PLANE AND SAID ONE SURFACE OF THE BOARD IS UNAFFECTED, AND REMOVING THE CIRCUIT BOARD FROM THE PROXIMITY OF THE BATH.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1968-10-04 | 1969-04-05 | 1969-10-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1972-10-04 | 1973-04-05 | 1973-10-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1976-10-04 | 1977-04-05 | 1977-10-05 | $7700.00 | Window Closed / Lapsed |