Abstract A microwave transistor package is disclosed which utilizes a disc of beryllium oxide. One surface of the disc is metallized to form a symmetrical pattern of four contacts. These include a collector contact and a base contact oppositely disposed along one diameter of the disc. The remaining two contacts are oppositely disposed along a second diameter perpendicular to the first. They are substantially wider than the collector and base contacts and comprise double emitter contacts. The transistor is mounted on the collector contact and a wire connects its base to the base contact. An emitter wire connects both of the metallized emitter contacts and its midpoint is connected to the emitter of the transistor. The package is hermetically sealed by means of a beryllium oxide cap enclosing the transistor and ''''glassed'''' to the disc.
The package of claim 1 wherein: a collector lead strip is connected to said collector contact; a base lead strip is connected to said base contact; and first and second emitter lead strips are connected, respectively, to each of said pair of emitter contacts, all of said lead strips extending radially outward from said support member with their axes substantially 90* from one another.
Claim 2
Dependent Claim
22 words
The package of claim 2 wherein said transistor and wire means are enclosed by a cap hermetically sealed to said support member.
Claim 3
Dependent Claim
12 words
The package of claim 3 wherein said support member is a disc.
Claim 4
Dependent Claim
22 words
The package of claim 1 wherein said transistor and wire means are enclosed by a cap hermetically sealed to said support member.
Claim 5
Dependent Claim
20 words
The package of claim 5 wherein said sealing is effected by a glass medium between said cap and support member.
Claim 6
Dependent Claim
12 words
The package of claim 1 wherein said support member is a disc.
Claim 7
Dependent Claim
16 words
The package of claim 1 wherein said support member is mounted on a heat conductive stud.