Patent US3579817A successfully refreshed from Google Patents.
US3579817A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cover for coplanar walls of an open top circuit package
Assignee: Alpha Metals Ltd
•
Filing: 1969-05-21
•
Granted: 1971-05-25
•
Expires: 1989-05-21
Abstract
Abstract A cover for hermetically sealing the open end of a circuit package in which a solder border is applied to the marginal areas of the cover, and a dielectric dress is applied within the border; the dielectric dress is sufficiently thick to fit into the open end of a circuit package and to position the lid in exact registration with the circuit package.
Inventors
- 👤 Martin A Boyle
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 23:55
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
70 words
A cover for coplanar walls of an open top circuit package comprising: a. an electrically conductive lid generally dimensioned to cover the coplanar walls of an open top circuit package, b. a fusible alloy border on the lid disposed the dielectric in general correspondence with the walls of an open top circuit package and adapted to fuse therewith, and a dielectric dress applied to the lid within the alloy border.
Claim 2
Dependent Claim
70 words
A cover for coplanar walls of an open top circuit package comprising: a. an electrically conductive lid generally dimensioned to cover the coplanar walls of an open top circuit package, b. a fusible alloy border on the lid disposed the dielectric in general correspondence with the walls of an open top circuit package and adapted to fuse therewith, and a dielectric dress applied to the lid within the alloy border.
Claim 3
Dependent Claim
17 words
The device according to claim 1 in which the dielectric dress is thicker than the alloy border.
Claim 4
Dependent Claim
40 words
The device according to claim 1 in which the dielectric dress is thicker than the alloy border and tapers smaller from the interface with the lid to its top surface, and defines a positioning enlargement to automatically align the lid.
Claim 5
Dependent Claim
24 words
The device according to claim 1 in which the dielectric dress is fused to the lid within the marginal area defined by the alloy.
Claim 6
Dependent Claim
15 words
The device according to claim 1 in which the alloy is fused to the lid.
Claim 7
Dependent Claim
20 words
The device according to claim 1 in which both the dielectric dress and the alloy are fused to the lid.
Claim 8
Dependent Claim
13 words
The device according to claim 1 in which the dielectric dress is glass.
Claim 9
Dependent Claim
13 words
The device according to claim 1 in which the dielectric dRess is compressible.
Claim 10
Dependent Claim
17 words
The device according to claim 1 in which the dielectric dress is a compressible expanded plastic foam.
Claim 11
Dependent Claim
18 words
The device according to claim 1 in which the dielectric dress has a low coefficient of thermal condition.
Claim 12
Independent Claim
99 words
The method for positioning a lid in a circuit package including an electrical component therein and having a top opening comprising: a. forming a lid dimensioned to fit a circuit package, b. applying a dielectric dress to the lid, dimensioned to fit into a top opening of a circuit package when the lid is in registration with the top of the circuit package, c. inserting the dielectric dress on the lid into the circuit package, whereby the lid will automatically be positioned in registration with the top of the circuit package, and d. leading the lid to the package.
Claim 13
Independent Claim
99 words
The method for positioning a lid in a circuit package including an electrical component therein and having a top opening comprising: a. forming a lid dimensioned to fit a circuit package, b. applying a dielectric dress to the lid, dimensioned to fit into a top opening of a circuit package when the lid is in registration with the top of the circuit package, c. inserting the dielectric dress on the lid into the circuit package, whereby the lid will automatically be positioned in registration with the top of the circuit package, and d. leading the lid to the package.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-05-24 | 1974-11-23 | 1975-05-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-05-24 | 1978-11-23 | 1979-05-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-05-24 | 1982-11-23 | 1983-05-25 | $7700.00 | Window Closed / Lapsed |