Glass sealed ceramic housings for semiconductor devices

Claim 1

A SEMICONDUCTOR DEVICE COMPRISING A FIRST CERAMIC MEMBER AND A SECOND CERAMIC MEMBER FOR FORMING AN ENEVELOPE AROUND A SEMICONDUCTOR ELEMENT, EACH OF SAID MEMBERS HAVING MATING SURFACE PORTIONS FACING ONE ANOTHER, AT LEAST ONE OF SAID MEMBERS HAVING A RECESS THEREIN, A SEMICONDUCTOR ELEMENT PROVIDED IN SAID RECESS, A PLURALITY OF THIN METALLIZED LAYER STRIPS DEPOSITED ON THE SURFACE OF ONE OF SAID MEMBERS IN THE REGION BETWEEN SAID MATING PORTIONS, EACH ELECTRODE OF SAID SEMICONDUCTOR ELEMENT BEING ELECTRICALLY CONNECTED TO A DIFFERENT ONE OF SAID METALLIZED STRIPS, SAID MEMBER, HAVING A SEAL SECURING THE SAME TOGETHER AT SAID MATING PORTIONS, SAID SEAL COMPRISING A GLAZE MATERIAL FOR FORMING A HERMETIC SEAL WITH THE SURFACES OF SAID MATING PORTIONS AND WITH SAID METALLIZED STRIPS, SAID SEAL FURTHER BEING FORMED FROM A FIRST LAYER OF GLAZE MATERIAL PROVIDED ON ONE MATING PORTION SURFACE AND A SECOND LAYER OF GLAZE MATERIAL PROVIDED ON THE OTHER MATING PORTION SURFACE PRIOR TO THE FORMATION OF SAID SEAL, AND THE RESULTING DEVICE BEING OF GENERALLY PLANAR SHAPE.