Patent US3427554A successfully refreshed from Google Patents.
US3433686A
Expired / Lapsed
US
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Process of bonding chips in a substrate recess by epitaxial growth of the bonding material
Assignee: International Business Machines Corp
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Filing: 1966-01-06
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Granted: 1969-03-18
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Expires: 1986-01-06
Abstract
No abstract record available.
Inventors
- 👤 John C Marinace
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 01:59
CPC Classifications
H; H10; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/019; H10W10/10; Y; Y10; Y10S; Y10S148/00; Y10S148/026; Y10S148/029; Y10S148/043; Y10S148/049; Y10S148/05; Y10S148/085; Y10S148/15
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
US3150299A
Cited
US3316128A
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US3300832A
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US3320485A
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US3312879A
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US3332137A
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US3381182A
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US3325882A
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US3372070A
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US3383760A
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US3322581A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1972-03-17 | 1972-09-16 | 1973-03-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1976-03-17 | 1976-09-16 | 1977-03-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1980-03-17 | 1980-09-16 | 1981-03-18 | $7700.00 | Window Closed / Lapsed |