Patent US3261728A successfully refreshed from Google Patents.
US3261728A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of alloying electrodes to a semiconductor body
Assignee: US Philips Corp
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Filing: 1962-05-23
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Granted: 1966-07-19
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Expires: 1982-05-23
Abstract
No abstract record available.
Inventors
- 👤 Kramp Carl Heinrich
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 02:56
CPC Classifications
H; H10; H10P; H10P95/00; H10P95/50; F; F24; F24C; F24C7/00; H10D; H10D62/00; H10D62/10; Y; Y10; Y10T; Y10T29/00; Y10T29/53; Y10T29/5313; Y10T29/53265
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
128 words
IN THE MANUFACTURE OF A SEMICONDUCTOR DEVICE, THE METHOD OF ALLOYING A SMALL ELECTRODE MASS TO A THIN, WAFERLIKE, SEMICONDUCTOR BODY, COMPRISING THE STEPS OF PROVIDING IN A PROTECTIVE GAS ATMOSPHERE AN ALLOYING JIG FOR HOLDING THE SEMICONDUCTOR BODY AND ELECTRODE MATERIAL WHILE THEY ARE ALLOYING TOGETHER AT AN ELEVATED ALLOYING TEMPERATURE, SAID ALLOYING JIG HAVING A LARGE HEAT CAPACITY COMPARED WITH THAT OF THE SEMICONDUCTOR BODY AND ELECTRODE, PREHEATING SAID JIG TO AT LEAST THE ALLOYING TEMPERATURE PRIOR TO SUPPLYING THE SEMICONDUCTOR BODY AND ELECTRODE MATERIAL THERETO, THEREAFTER SUPPLYING THE SEMICONDUCTOR BODY AND ELECTRODE MATERIAL TO THE PREHEATED JIG AND HOLDING THE BODY AND MTERIAL IN CONTACT WITH ONE ANOTHER AND IN RELEASABLE ENGAGEMENT WITH THE JIG UNTIL THEY ASSUME THE ALLOYING TEMPERATURE AND ALLOY TOGETHER, AND
Claim 2
Dependent Claim
128 words
IN THE MANUFACTURE OF A SEMICONDUCTOR DEVICE, THE METHOD OF ALLOYING A SMALL ELECTRODE MASS TO A THIN, WAFERLIKE, SEMICONDUCTOR BODY, COMPRISING THE STEPS OF PROVIDING IN A PROTECTIVE GAS ATMOSPHERE AN ALLOYING JIG FOR HOLDING THE SEMICONDUCTOR BODY AND ELECTRODE MATERIAL WHILE THEY ARE ALLOYING TOGETHER AT AN ELEVATED ALLOYING TEMPERATURE, SAID ALLOYING JIG HAVING A LARGE HEAT CAPACITY COMPARED WITH THAT OF THE SEMICONDUCTOR BODY AND ELECTRODE, PREHEATING SAID JIG TO AT LEAST THE ALLOYING TEMPERATURE PRIOR TO SUPPLYING THE SEMICONDUCTOR BODY AND ELECTRODE MATERIAL THERETO, THEREAFTER SUPPLYING THE SEMICONDUCTOR BODY AND ELECTRODE MATERIAL TO THE PREHEATED JIG AND HOLDING THE BODY AND MTERIAL IN CONTACT WITH ONE ANOTHER AND IN RELEASABLE ENGAGEMENT WITH THE JIG UNTIL THEY ASSUME THE ALLOYING TEMPERATURE AND ALLOY TOGETHER, AND
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-07-18 | 1970-01-17 | 1970-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-07-18 | 1974-01-17 | 1974-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-07-18 | 1978-01-17 | 1978-07-19 | $7700.00 | Window Closed / Lapsed |