Patent US3262269A successfully refreshed from Google Patents.
Patent US3240684A successfully refreshed from Google Patents.
US3240684A
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Method of etching rhodium plated metal layers and of making rhodium plated printed circuit boards
Assignee: Unisys Corp
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Filing: 1962-02-21
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Granted: 1966-03-15
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Expires: 1982-02-21
Abstract
No abstract record available.
Inventors
- 👤 Ross L Martin
- 👤 Charles J Williams
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:13
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; C; C23; C23F; C23F1/00; C23F1/02; H01; H01B; H01B1/00; H05K3/02; H05K3/06; H05K3/061; H05K3/064; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0338; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/062; H05K3/38; H05K3/382; H05K3/384
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
100 words
A METHOD OF ETCHING A RHODIUM PLATED CONDUCTIVE LAYER COMPRISING: APPLYING A LAYER OF A METAL SELECTED FROM THE GROUP CONSISTING OF CADMIUM, ZINC, TIN AND COPPER OVER THE RHODIUM PLATED CONDUCTIVE LAYER; APPLYING A MASKING MATERIAL TO THE PORTIONS OF SAID LAYER OF METAL OVERLYING THE AREA OF THE RHODIUM PLATED CONDUCTIVE LAYER TO BE RETAINED; SAID METAL LAYER COMPLETELY UNDERLYING SAID MASKING MATERIAL AND PROMOTING THE ADHERENCE THEREOF TO THE RHODIUM PLATING; AND REMOVING THE SAID METAL LAYER AND THE UNDERLYING RHODIUM PLATING AND CONDUCTIVE LAYER EXPOSED BY SAID MASKING MATERIAL BY SUBJECTING SAME TO A CHEMICAL ETCHANT.
Claim 2
Independent Claim
100 words
A METHOD OF ETCHING A RHODIUM PLATED CONDUCTIVE LAYER COMPRISING: APPLYING A LAYER OF A METAL SELECTED FROM THE GROUP CONSISTING OF CADMIUM, ZINC, TIN AND COPPER OVER THE RHODIUM PLATED CONDUCTIVE LAYER; APPLYING A MASKING MATERIAL TO THE PORTIONS OF SAID LAYER OF METAL OVERLYING THE AREA OF THE RHODIUM PLATED CONDUCTIVE LAYER TO BE RETAINED; SAID METAL LAYER COMPLETELY UNDERLYING SAID MASKING MATERIAL AND PROMOTING THE ADHERENCE THEREOF TO THE RHODIUM PLATING; AND REMOVING THE SAID METAL LAYER AND THE UNDERLYING RHODIUM PLATING AND CONDUCTIVE LAYER EXPOSED BY SAID MASKING MATERIAL BY SUBJECTING SAME TO A CHEMICAL ETCHANT.
References Cited (Backward Citations)
US2984595A
Cited
US3013956A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-03-14 | 1969-09-13 | 1970-03-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-03-14 | 1973-09-13 | 1974-03-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-03-14 | 1977-09-13 | 1978-03-15 | $7700.00 | Window Closed / Lapsed |