Electronically-conducting semi-conductor devices having a soldered joint with the terminal conductor of a point contact electrode thereof

Claim 1

IN A SEMI-CONDUCTOR DEVICE, A SEMI-CONDUCTOR BODY PORTION HAVING AN EXPOSED SEMI-CONDUCTOR SURFACE; AN ELONGATED METALLIC ELECTRODE HAVING A CONTACT POINT AT A FIRST END THEREOF IN POINT CONTACT WITH SAID EXPOSED SEMICONDUCTOR SURFACE; AN INSULATING CASING HAVING A HOLLOW INTERIOR FOR RECEIVING SAID SEMI-CONDUCTOR BODY PORTION AND SAID METALLIC ELECTRODE; SAID CASING HAVING AN OPENING AT ONE END THEREOF; A METALLIC SUPPORT CONDUCTOR HAVING A FIRST END EXTENDING INTO SAID OPENING AND ELECTRICALLY JOINED TO THE SECOND END OF SAID METALLIC ELECTRODE; AN ELONGATED HOLLOW METALLIC SLEEVE; A FIRST END OF SAID SLEEVE BEING JOINED TO SAID INSULATING CASING WITHIN SAID ONE OPENING; THE SECOND END OF SAID SUPPORT CONDUCTOR EXTENDING INTO SAID HOLLOW SLEEVE; METALLIC SOLDER ELECTRICALLY JOINING THE SECOND END OF SAID SUPPORT CONDUCTOR TO THE INTERIOR OF SAID HOLLOW SLEEVE NEAR THE SECOND END THEREOF; SAID ELONGATED METALLIC ELECTRODE BEING IN ALIGNMENT WITH SAID SUPPORT CONDUCTOR AND SAID METALLIC SLEEVE; SAID METALLIC SOLDER BEING PLACED IN SAID HOLLOW SLEEVE TO COMPLETELY SEAL THE SECOND END OF SAID SLEEVE; SAID METALLIC SOLDER BEING COMPRISED OF A METALLIC COMPOSITION HAVING A NEGATIVE COEFFICIENT OF EXPANSION SUCH AS TO EXPAND UPON COOLING THEREOF FOR URGING SAID SUPPORT CONDUCTOR AND SAID METALLIC ELECTRODE TOWARD SAID SEMI-CONDUCTOR SURFACE.