Silicon rectifier encapsulation

Claim 1

IN RECTIFIER MEANS, A SEMICONDUCTOR RECTIFIER WAFER, A SHEET OF ELECTRICALLY CONDUCTIVE MATERIAL SECURED TO EACH OPPOSITE FACE OF SAID SEMICONDUCTOR RECTIFIER WAFER FORMING A SANDWICH, SAID ELECTRICALLY CONDUCTIVE MATERIAL HAVING SUBSTANTIALLY THE SAME COEFFICIENT OF EXPANSION AS THE SEMICONDUCTOR RECTIFER WAFER, A MULTI-PART HOUSING OF ELECTRICALLY CONDUCTIVE MATERIAL, SAID PARTS HAVING FLANGES FACING EACH OTHER, SAID SANDWICH OF THE SEMICONDUCTOR RECTIFIER WAFER AND THE TWO SHEETS OF ELECTRICALLY CONDUCTIVE MATERIAL BEING SECURED WITHIN ONE PART OF THE HOUSEING, A PARTIALLY COLLAPSED CONDUCTIVE RING SECURED TO THE AVAILABLE SURFACE OF THE ELECTRICALLY CONDUCTIVE MATERIAL IN THE ONE PART OF THE HOUSING, AND A TERMINAL INSULATABLY MOUNTED THROUGH THE OTHER PART OF THE HOUSING AND ADAPTED TO DEFORM THE CONDUCTIVE RING SUBSTANTIALLY ONLY IN ITS CONTACT AREA WITH SAID TERMINAL WHEN THE TWO PARTS ARE BROUGHT TOGETHER, SAID TERMINAL PROTRUDING INTO SAID DEFORMED AREA, SAID FLANGES BEING SEALED TOGETHER TO FORM A HERMETICALLY SEALED UNIT.