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US3108359A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for fabricating transistors

Assignee: Fairchild Semiconductor Corp
•
Filing: 1959-06-30
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Granted: 1963-10-29
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Expires: 1979-06-30
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Abstract

No abstract record available.

Inventors

  • 👤 Gordon E Moore
  • 👤 Robert N Noyce

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 23:47
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10D; H10D99/00; H10P; H10P32/00; H10P32/10; H10P32/14; H10P32/1404; H10P32/17; H10P32/171; H10P95/00; H10W74/00; H10W74/40; H10W74/43; Y; Y10; Y10S; Y10S148/00; Y10S148/033

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 146 words
THE METHOD OF FABRICATING SEMICONDUCTOR DEVICES, WHICH COMPRISES OXIDIZING THE SURFACE OF A WAFER OF SEMICONDUCTOR MATERIAL TO FORM AN OXIDE FILM THEREON, EXPOSING ISLANDS OF UNOXIDIZED SEMICONDUCTOR MATERIAL BY REMOVING PORTIONS OF SAID FILM BY PHOTOENGRAVING, FORMING P-N JUNCTIONS SEPARATING A SURFACE LAYER OF EACH ISLAND FROM THE SUBJACENT SEMICONDUCTOR MATERIAL BY DEPOSITING ONTO SAID ISLANDS A DIFFUSANT TO WHICH SAID FILM IS IMPERVIOUS AND DIFFUSING SUCH DIFFUSANT INTO SAID SEMICONDUCTOR MATERIAL AT AN ELEVATED TEMPERATURE IN AN OXIDIZING ATMOSPHERE WHEREBY THE SURFACE IS REOXIDIZED, DEOXIDING CONTACT AREAS ON SAID ISLANDS AND ON ADJACENT PORTIONS OF THE WAFER SURFACE, DEPOSITING AMETAL COATING ON THE SURFACE INCLUDING SAID CONTENT AREAS, AND REMOVING PORTIONS OF SAID COATING BY PHOTOENGRAVING, LEAVING SEPARATE METALLIC CONTACTS OF THE SAME METAL ON EACH OF SAID ISLANDS AND ON THE MATERIAL OF THE OPPOSITE CONDUCTIVITY TYPE ADJACENT TO EACH OF SAID ISLANDS.
Claim 2
Independent Claim 146 words
THE METHOD OF FABRICATING SEMICONDUCTOR DEVICES, WHICH COMPRISES OXIDIZING THE SURFACE OF A WAFER OF SEMICONDUCTOR MATERIAL TO FORM AN OXIDE FILM THEREON, EXPOSING ISLANDS OF UNOXIDIZED SEMICONDUCTOR MATERIAL BY REMOVING PORTIONS OF SAID FILM BY PHOTOENGRAVING, FORMING P-N JUNCTIONS SEPARATING A SURFACE LAYER OF EACH ISLAND FROM THE SUBJACENT SEMICONDUCTOR MATERIAL BY DEPOSITING ONTO SAID ISLANDS A DIFFUSANT TO WHICH SAID FILM IS IMPERVIOUS AND DIFFUSING SUCH DIFFUSANT INTO SAID SEMICONDUCTOR MATERIAL AT AN ELEVATED TEMPERATURE IN AN OXIDIZING ATMOSPHERE WHEREBY THE SURFACE IS REOXIDIZED, DEOXIDING CONTACT AREAS ON SAID ISLANDS AND ON ADJACENT PORTIONS OF THE WAFER SURFACE, DEPOSITING AMETAL COATING ON THE SURFACE INCLUDING SAID CONTENT AREAS, AND REMOVING PORTIONS OF SAID COATING BY PHOTOENGRAVING, LEAVING SEPARATE METALLIC CONTACTS OF THE SAME METAL ON EACH OF SAID ISLANDS AND ON THE MATERIAL OF THE OPPOSITE CONDUCTIVITY TYPE ADJACENT TO EACH OF SAID ISLANDS.

References Cited (Backward Citations)

US2680220A Cited
US2695852A Cited
US2793420A Cited
US2858489A Cited
US3025589A Cited
US2806983A Cited
US2845375A Cited
US2984775A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1966-10-28 1967-04-29 1967-10-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1970-10-28 1971-04-29 1971-10-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1974-10-28 1975-04-29 1975-10-29 $7700.00 Window Closed / Lapsed

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