US20040067006A1 — Transmitter photonic integrated circuit ( TxPIC) …

Claim 1

Independent Claim 187 words

1 . A monolithic transmitter photonic integrated circuit (TxPIC) chip comprising: an array of N laser devices, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength and providing a respective light output; an array of N electro-optic modulator devices integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser device to provide a modulated output comprising a channel signal, all of said channel signals together representative of a plurality of wavelengths on a predetermined wavelength grid; an arrayed waveguide grating integrated on said chip, said arrayed waveguide grating coupled to each of said optical waveguides of said waveguide array to receive said channel signals from said modulator devices and combined into a multiplexed channel signal on an optical waveguide output from the chip; characterized by at least one additional set or individual of said devices formed in at least some of said optical waveguides for redundancy so that if one set or individual of said devices fails, another thereof may be utilized in its place.

Claim 2

Dependent Claim 187 words

1 . A monolithic transmitter photonic integrated circuit (TxPIC) chip comprising: an array of N laser devices, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength and providing a respective light output; an array of N electro-optic modulator devices integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser device to provide a modulated output comprising a channel signal, all of said channel signals together representative of a plurality of wavelengths on a predetermined wavelength grid; an arrayed waveguide grating integrated on said chip, said arrayed waveguide grating coupled to each of said optical waveguides of said waveguide array to receive said channel signals from said modulator devices and combined into a multiplexed channel signal on an optical waveguide output from the chip; characterized by at least one additional set or individual of said devices formed in at least some of said optical waveguides for redundancy so that if one set or individual of said devices fails, another thereof may be utilized in its place.

Claim 3

Dependent Claim 35 words

2 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 1 further comprising an optical amplifier optically coupled to receive the multiplexed channel signal from said arrayed waveguide grating to amplify the signal.

Claim 4

Dependent Claim 39 words

3 . The monolithic transmitter photonic integrated circuit (TXPIC) chip of claim 1 wherein all of the non-utilized devices formed in each of said optical waveguides of said optical array are transparent to the output from said N devices.

Claim 5

Dependent Claim 53 words

4 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 1 further comprising a plurality of semiconductor optical amplifiers integrated on said chip, one each in an optical waveguide between each of said electro-optic modulator devices and said arrayed waveguide grating to amplify the channel signal output from said modulator devices.

Claim 6

Dependent Claim 57 words

5 . The monolithic transmitter photonic integrated circuit (TXPIC) chip of claim 1 wherein redundant modulator devices are placed serially in each channel and one of said electro-optic modulator devices in each of said optical waveguides is not utilized for modulation of the laser device output but is instead utilized as a photodetector or saturation absorber (SA).

Claim 7

Dependent Claim 65 words

6 . The monolithic transmitter photonic integrated circuit (TXPIC) chip of claim 1 further comprising a plurality of photodiodes integrated on said chip, said photodiodes one each formed in said optical waveguides of waveguide array either between each output from said electro-optic modulator devices and the input to said arrayed waveguide grating or adjacent to a rear facet of a corresponding laser device, or both.

Claim 8

Dependent Claim 23 words

7 . The monolithic transmitter photonic integrated circuit (TXPIC) chip of claim 6 wherein said photodiodes are PIN photodiodes or avalanche photodiodes (APDs).

Claim 9

Dependent Claim 32 words

8 . The monolithic transmitter photonic integrated circuit (TXPIC) chip of claim 1 wherein said laser devices are DFB laser sources and said electro-optic modulator devices are Mach-Zehnder modulators or electro-absorption modulators.

Claim 10

Dependent Claim 185 words

9 . A monolithic transmitter photonic integrated circuit (TxPIC) chip comprising: an array of semiconductor laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength and providing a respective light output; an array of electro-optic modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source to provide a modulated output comprising a channel signal, all of said channel signals together representative of a plurality of designated wavelengths on a predetermined wavelength grid; an arrayed waveguide grating integrated on said chip, said arrayed waveguide grating coupled to each of said optical waveguides of said waveguide array to receive, said channel signal from said modulators and combined into a multiplexed signal on at least one optical output waveguide from said chip; and isolation means formed in said chip between said arrays of laser sources and electro-optic modulators and said one output waveguide to prevent unguided light emanating from said arrays from optically interfering with said multiplexed signal in said one output waveguide.

Claim 11

Dependent Claim 185 words

9 . A monolithic transmitter photonic integrated circuit (TxPIC) chip comprising: an array of semiconductor laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength and providing a respective light output; an array of electro-optic modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source to provide a modulated output comprising a channel signal, all of said channel signals together representative of a plurality of designated wavelengths on a predetermined wavelength grid; an arrayed waveguide grating integrated on said chip, said arrayed waveguide grating coupled to each of said optical waveguides of said waveguide array to receive, said channel signal from said modulators and combined into a multiplexed signal on at least one optical output waveguide from said chip; and isolation means formed in said chip between said arrays of laser sources and electro-optic modulators and said one output waveguide to prevent unguided light emanating from said arrays from optically interfering with said multiplexed signal in said one output waveguide.

Claim 12

Dependent Claim 24 words

10 . The monolithic transmitter photonic integrated circuit (TXPIC) chip of claim 9 wherein said isolation means comprises a trench formed in said chip.

Claim 13

Dependent Claim 26 words

11 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 10 wherein said isolation means includes a low index medium formed in said trench.

Claim 14

Dependent Claim 42 words

12 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 9 further comprising a plurality of vernier output waveguides formed from an output of said AWG for selection of one output possessing an optimized output of said predetermined wavelength grid.

Claim 15

Dependent Claim 23 words

13 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 9 wherein said electro-optic modulators are Mach-Zehnder modulators or electro-absorption modulators.

Claim 16

Dependent Claim 24 words

14 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 9 wherein said semiconductor laser sources are DFB lasers or DFB lasers.

Claim 17

Dependent Claim 220 words

15 . A multiple wavelength division multiplexing optical transmitter system comprising: at least two monolithic transmitter photonic integrated circuit (TxPIC) chips each comprising: an array of N laser sources, each formed in an optical waveguide of an array of optical waveguides and each having a respective light output and operating at a different wavelength and together forming a first grid of wavelengths on a predetermined wavelength grid; an array of N electro-optic modulators integrated on said chips, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and provide a modulated output comprising a channel signal; a combiner integrated on said chip, said combiner coupled to each of said optical waveguides to receive a channel signal from each said N modulators and combine N channel signals into a combined channel signal of all N channel signals on an optical waveguide output from each of said at least two chips; and tuning means applied to at least one of said monolithic transmitter photonic integrated circuit (TxPIC) chips to change said first grid of wavelengths on a predetermined wavelength grid of said chip to a second grid of wavelengths on the predetermined wavelength grid so that said at least two chips together form two times N signal channels on the predetermined grid.

Claim 18

Dependent Claim 220 words

15 . A multiple wavelength division multiplexing optical transmitter system comprising: at least two monolithic transmitter photonic integrated circuit (TxPIC) chips each comprising: an array of N laser sources, each formed in an optical waveguide of an array of optical waveguides and each having a respective light output and operating at a different wavelength and together forming a first grid of wavelengths on a predetermined wavelength grid; an array of N electro-optic modulators integrated on said chips, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and provide a modulated output comprising a channel signal; a combiner integrated on said chip, said combiner coupled to each of said optical waveguides to receive a channel signal from each said N modulators and combine N channel signals into a combined channel signal of all N channel signals on an optical waveguide output from each of said at least two chips; and tuning means applied to at least one of said monolithic transmitter photonic integrated circuit (TxPIC) chips to change said first grid of wavelengths on a predetermined wavelength grid of said chip to a second grid of wavelengths on the predetermined wavelength grid so that said at least two chips together form two times N signal channels on the predetermined grid.

Claim 19

Dependent Claim 44 words

16 . The multiple wavelength division multiplexing optical transmitter system of claim 15 wherein said tuning means is a change in voltage bias or applied drive current to laser sources of said at least one of said monolithic transmitter photonic integrated circuit (TXPIC) chips.

Claim 20

Dependent Claim 38 words

17 . The multiple wavelength division multiplexing optical transmitter system of claim 15 wherein said tuning means is a change to an ambient temperature of said at least one of said monolithic transmitter photonic integrated circuit (TXPIC) chips.

Claim 21

Dependent Claim 39 words

18 . The multiple wavelength division multiplexing optical transmitter system of claim 17 wherein said temperature tuning means is a thermal electric cooler (TEC) applied to said at least one of said monolithic transmitter photonic integrated circuit (TxPIC) chips.

Claim 22

Dependent Claim 43 words

19 . The multiple wavelength division multiplexing optical transmitter system of claim 17 wherein said temperature tuning means is an integrated local heater, one each for each laser source for said at least one of said monolithic transmitter photonic integrated circuit (TXPIC) chips.

Claim 23

Dependent Claim 27 words

20 . The multiple wavelength division multiplexing optical transmitter system of claim 17 wherein said temperature tuning means comprises stress tuning of said laser sources employing bi-metals.

Claim 24

Dependent Claim 31 words

21 . The multiple wavelength division multiplexing optical transmitter system of claim 15 wherein said combiner for said chips is a power coupler, star coupler or a multi-mode interference (MMI) coupler.

Claim 25

Dependent Claim 24 words

22 . The multiple wavelength division multiplexing optical transmitter system of claim 15 wherein said combiner for said chips is a wavelength selective multiplexer.

Claim 26

Dependent Claim 28 words

23 . The multiple wavelength division multiplexing optical transmitter system of claim 22 wherein said wavelength selective multiplexer is an arrayed waveguide grating (AWG) or an Echelle grating.

Claim 27

Dependent Claim 23 words

24 . The multiple wavelength division multiplexing optical transmitter system of claim 15 wherein said laser sources are DFB lasers or DBR lasers.

Claim 28

Dependent Claim 23 words

25 . The multiple wavelength division multiplexing optical transmitter system of claim 15 wherein said electro-optic modulators are electro-absorption modulators or Mach-Zehnder modulators.

Claim 29

Dependent Claim 33 words

26 . The multiple wavelength division multiplexing optical transmitter system of claim 15 wherein said chips are fabricated employing alloys of InGaAsP/InP or InAlGaAs/InP with growth accomplished by metalorganic chemical vapor deposition (MOCVD).

Claim 30

Dependent Claim 197 words

27 . A multiple wavelength division multiplexing optical transmitter system comprising: at least two monolithic transmitter photonic integrated circuit (TXPIC) chips each comprising: an array of N laser sources, each formed in an optical waveguide of an array of optical waveguides and each having a respective light output and operating at a different wavelength and together forming a first grid of wavelengths on a predetermined wavelength grid; each of said N laser sources modulated to provide a modulated output comprising a channel signal; a combiner integrated on said chip, said combiner coupled to each of said optical waveguides to receive a channel signal from each said N modulators and combine N channel signals into a combined channel signal of all N channel signals on an optical waveguide output from each of said at least two chips; and tuning means applied to at least one of said monolithic transmitter photonic integrated circuit (TxPIC) chips to change said first grid of wavelengths on a predetermined wavelength grid of said chip to a second grid of wavelengths on the predetermined wavelength grid so that said at least two chips together form two times N signal channels on the predetermined grid.

Claim 31

Dependent Claim 197 words

27 . A multiple wavelength division multiplexing optical transmitter system comprising: at least two monolithic transmitter photonic integrated circuit (TXPIC) chips each comprising: an array of N laser sources, each formed in an optical waveguide of an array of optical waveguides and each having a respective light output and operating at a different wavelength and together forming a first grid of wavelengths on a predetermined wavelength grid; each of said N laser sources modulated to provide a modulated output comprising a channel signal; a combiner integrated on said chip, said combiner coupled to each of said optical waveguides to receive a channel signal from each said N modulators and combine N channel signals into a combined channel signal of all N channel signals on an optical waveguide output from each of said at least two chips; and tuning means applied to at least one of said monolithic transmitter photonic integrated circuit (TxPIC) chips to change said first grid of wavelengths on a predetermined wavelength grid of said chip to a second grid of wavelengths on the predetermined wavelength grid so that said at least two chips together form two times N signal channels on the predetermined grid.

Claim 32

Dependent Claim 44 words

28 . The multiple wavelength division multiplexing optical transmitter system of claim 27 wherein said tuning means is a change in voltage bias or applied drive current to laser sources of said at least one of said monolithic transmitter photonic integrated circuit (TxPIC) chips.

Claim 33

Dependent Claim 38 words

29 . The multiple wavelength division multiplexing optical transmitter system of claim 27 wherein said tuning means is a change to an ambient temperature of said at least one of said monolithic transmitter photonic integrated circuit (TxPIC) chips.

Claim 34

Dependent Claim 39 words

30 . The multiple wavelength division multiplexing optical transmitter system of claim 29 wherein said temperature tuning means is a thermal electric cooler (TEC) applied to said at least one of said monolithic transmitter photonic integrated circuit (TxPIC) chips.

Claim 35

Dependent Claim 43 words

31 . The multiple wavelength division multiplexing optical transmitter system of claim 29 wherein said temperature tuning means is an integrated local heater, one each for each laser source for said at least one of said monolithic transmitter photonic integrated circuit (TXPIC) chips.

Claim 36

Dependent Claim 27 words

32 . The multiple wavelength division multiplexing optical transmitter system of claim 29 wherein said temperature tuning means comprises stress tuning of said laser sources employing bi-metals.

Claim 37

Dependent Claim 31 words

33 . The multiple wavelength division multiplexing optical transmitter system of claim 27 wherein said combiner for said chips is a power coupler, star coupler or an multi-mode interference (MMI) coupler.

Claim 38

Dependent Claim 24 words

34 . The multiple wavelength division multiplexing optical transmitter system of claim 27 wherein said combiner for said chips is a wavelength selective multiplexer.

Claim 39

Dependent Claim 28 words

35 . The multiple wavelength division multiplexing optical transmitter system of claim 34 wherein said wavelength selective multiplexer is an arrayed waveguide grating (AWG) or an Echelle grating.

Claim 40

Dependent Claim 20 words

36 . The multiple wavelength division multiplexing optical transmitter system of claim 27 wherein said laser sources are DFB lasers.

Claim 41

Dependent Claim 33 words

37 . The multiple wavelength division multiplexing optical transmitter system of claim 27 wherein said chips are fabricated employing alloys of InGaAsP/InP or InAlGaAs/InP with growth accomplished by metalorganic chemical vapor deposition (MOCVD).

Claim 42

Dependent Claim 166 words

38 . A monolithic photonic integrated circuit (PIC) chip comprising: an array of light sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength and providing a respective light output comprising a signal channel; an optical combiner integrated on said chip, said combiner having inputs coupled to each of said optical waveguides to receive channel signals and combine them as a combined channel signal on at least one optical output waveguide from said chip to an output facet thereof; and at least one photodiode integrated on said chip and optically coupled to an input of said optical combiner, said photodiode for checking an amount of internally reflected light from said output facet back through said optical combiner to said photodiode; and an antireflecting (AR) coating provided on said output facet, a desired thickness of said AR coating determined during its fabrication by checking the light intensity received by said photodiode until such light reaches a minimal value.

Claim 43

Dependent Claim 166 words

38 . A monolithic photonic integrated circuit (PIC) chip comprising: an array of light sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength and providing a respective light output comprising a signal channel; an optical combiner integrated on said chip, said combiner having inputs coupled to each of said optical waveguides to receive channel signals and combine them as a combined channel signal on at least one optical output waveguide from said chip to an output facet thereof; and at least one photodiode integrated on said chip and optically coupled to an input of said optical combiner, said photodiode for checking an amount of internally reflected light from said output facet back through said optical combiner to said photodiode; and an antireflecting (AR) coating provided on said output facet, a desired thickness of said AR coating determined during its fabrication by checking the light intensity received by said photodiode until such light reaches a minimal value.

Claim 44

Dependent Claim 91 words

39 . The monolithic photonic integrated circuit (PIC) chip of claim 38 wherein said light sources are either directly modulated to provide a modulated output comprising a channel signal from each of said light sources or an array of electro-optic modulators is integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output from a light source to provide a modulated output comprising a channel signal; all of said modulated channel signals representative of a designated wavelength on a predetermined wavelength grid.

Claim 45

Dependent Claim 22 words

40 . The monolithic photonic integrated circuit (PIC) chip of claim 39 wherein said electro-optic modulators are electro-absorption modulators or Mach-Zehnder modulators.

Claim 46

Dependent Claim 20 words

41 . The monolithic photonic integrated circuit (PIC) chip of claim 38 wherein said light sources are semiconductor laser sources.

Claim 47

Dependent Claim 22 words

42 . The monolithic photonic integrated circuit (PIC) chip of claim 41 wherein said laser sources are DFB lasers or DBR lasers.

Claim 48

Dependent Claim 30 words

43 . The monolithic photonic integrated circuit (PIC) chip of claim 38 wherein said combiner for said chip is a power coupler, star coupler or an multi-mode interference (MMI) coupler.

Claim 49

Dependent Claim 23 words

44 . The monolithic photonic integrated circuit (PIC) chip of claim 38 wherein said combiner for said chip is a wavelength selective multiplexer.

Claim 50

Dependent Claim 27 words

45 . The monolithic photonic integrated circuit (PIC) chip of claim 44 wherein said wavelength selective multiplexer is an arrayed waveguide grating (AWG) or an Echelle grating.

Claim 51

Dependent Claim 32 words

46 . The monolithic photonic integrated circuit (PIC) chip of claim 38 wherein said chip is fabricated employing alloys of InGaAsP/InP or InAlGaAs/InP with growth accomplished by metalorganic chemical vapor deposition (MOCVD).

Claim 52

Dependent Claim 110 words

47 . A chip module comprising: a monolithic photonic integrated circuit (PIC) chip, said chip including at least one array of electro-optic components integrated on said chip; a submount for mounting said chip; a first substrate formed on said submount and surrounding at least a portion of said chip; a second substrate supported on said first substrate and suspended at least in part over said chip forming an air gap between said chip and a bottom surface of said second substrate; and a plurality of metal lines formed on a surface of said second substrate and extending over said chip for electrical connection from said second substrate to said chip.

Claim 53

Dependent Claim 110 words

47 . A chip module comprising: a monolithic photonic integrated circuit (PIC) chip, said chip including at least one array of electro-optic components integrated on said chip; a submount for mounting said chip; a first substrate formed on said submount and surrounding at least a portion of said chip; a second substrate supported on said first substrate and suspended at least in part over said chip forming an air gap between said chip and a bottom surface of said second substrate; and a plurality of metal lines formed on a surface of said second substrate and extending over said chip for electrical connection from said second substrate to said chip.

Claim 54

Dependent Claim 46 words

48 . The chip module of claim 47 wherein said first substrate is formed along and adjacent to two sides of said chip so that two other edges of said second substrate overhand said chip forming said air gap between said second substrate and said chip.

Claim 55

Dependent Claim 20 words

49 . The chip module of claim 47 wherein said metal lines are RF striplines formed on said second substrate.

Claim 56

Dependent Claim 40 words

50 . The chip module of claim 47 wherein a thickness of said first substrate is greater than the thickness of said chip in order to provide said air gap upon positing of said second substrate on said first substrate.

Claim 57

Dependent Claim 24 words

51 . The chip module of claim 47 further comprising a cover formed over said second substrate to protect and shield said metal lines.

Claim 58

Dependent Claim 31 words

52 . The chip module of claim 51 wherein said cover includes recessed regions formed in said second substrate at opposite ends there to expose end portions of said metal lines.

Claim 59

Dependent Claim 15 words

53 . The chip module of claim 47 wherein said submount comprise AIN or BeO.

Claim 60

Dependent Claim 97 words

54 . The chip module of claim 47 wherein said monolithic photonic integrated circuit (PIC) chip comprises: an array of integrated light sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength and providing a respective light output comprising a signal channel; an optical combiner integrated on said chip, said combiner having inputs for coupled to each of said optical waveguides to receive channel signals and combine them as a combined channel signal on at least one optical output waveguide from said chip to an output facet thereof.

Claim 61

Dependent Claim 16 words

55 . The chip module of claim 54 wherein said light sources are semiconductor laser sources.

Claim 62

Dependent Claim 18 words

56 . The chip module of claim 55 wherein said laser sources are DFB lasers or DBR lasers.

Claim 63

Dependent Claim 26 words

57 . The chip module of claim 54 wherein said combiner for said chips is a power coupler, star coupler or an multi-mode interference (MMI) coupler.

Claim 64

Dependent Claim 19 words

58 . The chip module of claim 54 wherein said combiner for said chips is a wavelength selective multiplexer.

Claim 65

Dependent Claim 23 words

59 . The chip module of claim 58 wherein said wavelength selective multiplexer is an arrayed waveguide grating (AWG) or an Echelle grating.

Claim 66

Dependent Claim 87 words

60 . The chip module of claim 54 wherein said light sources are either directly modulated to provide a modulated output comprising a channel signal from each of said laser sources or an array of electro-optic modulators is integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output from a laser source to provide a modulated output comprising a channel signal; all of said modulated channel signals representative of a designated wavelength on a predetermined wavelength grid.

Claim 67

Dependent Claim 18 words

61 . The chip module of claim 60 wherein said electro-optic modulators are electro-absorption modulators or Mach-Zehnder modulators.

Claim 68

Dependent Claim 28 words

62 . The chip module of claim 47 wherein said chip is fabricated employing alloys of InGaAsP/InP or InAlGaAs/InP with growth accomplished by metalorganic chemical vapor deposition (MOCVD).

Claim 69

Dependent Claim 127 words

63 . A monolithic photonic integrated circuit (PIC) chip comprising: an array of light sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output comprising a channel signal; an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive said channel signals and combine them as a combined channel signal; and a plurality of vernier output waveguides formed on the chip from an output of said combiner, an optimum output waveguide selected of said vernier output waveguides providing an optimum overall wavelength grid response relative to said grid of wavelengths.

Claim 70

Dependent Claim 127 words

63 . A monolithic photonic integrated circuit (PIC) chip comprising: an array of light sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output comprising a channel signal; an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive said channel signals and combine them as a combined channel signal; and a plurality of vernier output waveguides formed on the chip from an output of said combiner, an optimum output waveguide selected of said vernier output waveguides providing an optimum overall wavelength grid response relative to said grid of wavelengths.

Claim 71

Dependent Claim 75 words

64 . The monolithic photonic integrated circuit (PIC) chip of claim 63 wherein said light sources are either directly modulated to provide a modulated output comprising a channel signal from each of said light sources or an array of electro-optic modulators is integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output from a light source to provide a modulated output comprising a channel signal.

Claim 72

Dependent Claim 22 words

65 . The monolithic photonic integrated circuit (PIC) chip of claim 64 wherein said electro-optic modulators are electro-absorption modulators or Mach-Zehnder modulators.

Claim 73

Dependent Claim 20 words

66 . The monolithic photonic integrated circuit (PIC) chip of claim 63 wherein said light sources are semiconductor laser sources.

Claim 74

Dependent Claim 22 words

67 . The monolithic photonic integrated circuit (PIC) chip of claim 66 wherein said laser sources are DFB lasers or DBR lasers.

Claim 75

Dependent Claim 30 words

68 . The monolithic photonic integrated circuit (PIC) chip of claim 63 wherein said combiner for said chip is a power coupler, star coupler or an multi-mode interference (MMI) coupler.

Claim 76

Dependent Claim 23 words

69 . The monolithic photonic integrated circuit (PIC) chip of claim 63 wherein said combiner for said chip is a wavelength selective multiplexer.

Claim 77

Dependent Claim 27 words

70 . The monolithic photonic integrated circuit (PIC) chip of claim 69 wherein said wavelength selective multiplexer is an arrayed waveguide grating (AWG) or an Echelle grating.

Claim 78

Dependent Claim 32 words

71 . The monolithic photonic integrated circuit (PIC) chip of claim 63 wherein said chip is fabricated employing alloys of InGaAsP/InP or InAlGaAs/InP with growth accomplished by metalorganic chemical vapor deposition (MOCVD).

Claim 79

Dependent Claim 113 words

72 . A method of providing a monolithic photonic integrated circuit (PIC) chip having a plurality of different wavelength channels forming a grid of wavelengths on a predetermined wavelength grid, comprising the steps of: providing a plurality of integrated light sources on the chip having different wavelengths of operation and providing a plurality of on-chip light channels on the predetermined wavelength grid; combining with an optical combiner the light channels into a single output light signal; providing the single output light signal to a plurality of vernier outputs from the optical combiner; and selecting the optical combiner vernier output having a best wavelength grid response for taking the single output light signal off-chip.

Claim 80

Dependent Claim 113 words

72 . A method of providing a monolithic photonic integrated circuit (PIC) chip having a plurality of different wavelength channels forming a grid of wavelengths on a predetermined wavelength grid, comprising the steps of: providing a plurality of integrated light sources on the chip having different wavelengths of operation and providing a plurality of on-chip light channels on the predetermined wavelength grid; combining with an optical combiner the light channels into a single output light signal; providing the single output light signal to a plurality of vernier outputs from the optical combiner; and selecting the optical combiner vernier output having a best wavelength grid response for taking the single output light signal off-chip.

Claim 81

Dependent Claim 26 words

73 . The method of claim 72 further comprising the step of directly modulating said light sources to provide a plurality of different optical channel signals.

Claim 82

Dependent Claim 47 words

74 . The method of claim 72 further comprising the steps of: providing a plurality of electro-optic modulators integrated on the chip, one each for each of the light sources; and modulating each of the modulators with a signal to produce a plurality of optical channel signals.

Claim 83

Dependent Claim 29 words

75 . The method of claim 72 wherein said combiner is a wavelength selective combiner and said vernier outputs are in the first order Brillouin zone of said combiner.

Claim 84

Dependent Claim 22 words

76 . The method of claim 75 wherein said wavelength selective combiner is an arrayed waveguide grating (AWG) or an Echelle grating.

Claim 85

Dependent Claim 126 words

77 . A monolithic transmitter photonic integrated circuit (TXPIC) chip comprising: an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength and providing a respective light output; an array of Mach-Zehnder modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and provide a modulated output comprising a channel signal; and an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive said channel signals and combine them as a combined signal on at least one optical output waveguide from said chip to a chip output facet.

Claim 86

Dependent Claim 126 words

77 . A monolithic transmitter photonic integrated circuit (TXPIC) chip comprising: an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength and providing a respective light output; an array of Mach-Zehnder modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and provide a modulated output comprising a channel signal; and an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive said channel signals and combine them as a combined signal on at least one optical output waveguide from said chip to a chip output facet.

Claim 87

Dependent Claim 29 words

78 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 77 wherein said arrays and said combiner are formed in a ridge waveguide structure on said chip.

Claim 88

Dependent Claim 23 words

79 . The monolithic transmitter photonic integrated circuit (TXPIC) chip of claim 77 wherein said laser sources are DFB lasers or DBR lasers.

Claim 89

Dependent Claim 34 words

80 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 77 further comprising a semiconductor optical amplifier integrated in each of said optical waveguides between said laser source and said Mach-Zehnder modulator.

Claim 90

Dependent Claim 34 words

81 . The monolithic transmitter photonic integrated circuit (TXPIC) chip of claim 77 further comprising a semiconductor optical amplifier integrated in each of said optical waveguides between said Mach-Zehnder modulator and said optical combiner.

Claim 91

Dependent Claim 99 words

82 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 77 wherein each of said Mach-Zehnder modulators further comprises two legs forming a Y-shaped coupling region at its output, said output provided in two output arms, one of said arms functioning as a channel signal output of said modulator to said optical combiner and the other of said arms coupled to an absorber for receiving a portion of the channel signal not part of the output to said optical combiner from said modulator to prevent that portion from deleteriously coupling into other optical components on said chip.

Claim 92

Dependent Claim 34 words

83 . The monolithic transmitter photonic integrated circuit (TXPIC) chip of claim 82 further comprising a semiconductor optical amplifier integrated in each of said optical waveguides between said laser source and said Mach-Zehnder modulator.

Claim 93

Dependent Claim 96 words

84 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 77 wherein each of said Mach-Zehnder modulators further comprises two legs forming a Y-shaped coupling region at its output, said output provided in two output arms, one of said arms functioning as a channel signal output of said modulator to said optical combiner and the other of said arms coupled to a monitoring photodetector (MPD) for receiving a portion of the channel signal from said modulator not part of the output for monitoring the optical parameters of the channel signal output from the modulator.

Claim 94

Dependent Claim 34 words

85 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 84 further comprising a semiconductor optical amplifier integrated in each of said optical waveguides between said laser source and said Mach-Zehnder modulator.

Claim 95

Dependent Claim 33 words

86 . The monolithic transmitter photonic integrated circuit (TXPIC) chip of claim 77 wherein said chip is fabricated employing alloys of InGaAsP/InP or InAlGaAs/InP with growth accomplished by metalorganic chemical vapor deposition (MOCVD).

Claim 96

Dependent Claim 29 words

87 . The monolithic transmitter photonic integrated circuit (TXPIC) chip of claim 77 wherein said optical combiner is a power coupler, star coupler or a multi-mode interference (MMI) coupler.

Claim 97

Dependent Claim 22 words

88 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 77 wherein said optical combiner is a wavelength selective multiplexer.

Claim 98

Dependent Claim 28 words

89 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 88 wherein said wavelength selective multiplexer is an arrayed waveguide grating (AWG) or an Echelle grating.

Claim 99

Dependent Claim 191 words

90 . A monolithic transmitter photonic integrated circuit (TXPIC) chip comprising: an array of DFB laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength and providing a respective light output; an array of electro-absorption modulators (EAMs) integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a DFB laser source and provide a modulated output comprising a channel signal, all of said channel signals representative of a wavelength on a predetermined wavelength grid; an arrayed waveguide grating (AWG) integrated on said chip, said arrayed waveguide grating coupled to each of said optical waveguides of said waveguide array to receive said channel signal from each said modulators and combine them as a multiplexed channel signal on an optical waveguide output from said chip; an operational bias for each of said electro-absorption modulators (EAMs) chosen such that its band edge wavelength is close to a wavelength of operation of its corresponding DFB laser source so-that a small modulating electrical field across the modulator produces a large change in modulator light absorption.

Claim 100

Dependent Claim 191 words

90 . A monolithic transmitter photonic integrated circuit (TXPIC) chip comprising: an array of DFB laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength and providing a respective light output; an array of electro-absorption modulators (EAMs) integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a DFB laser source and provide a modulated output comprising a channel signal, all of said channel signals representative of a wavelength on a predetermined wavelength grid; an arrayed waveguide grating (AWG) integrated on said chip, said arrayed waveguide grating coupled to each of said optical waveguides of said waveguide array to receive said channel signal from each said modulators and combine them as a multiplexed channel signal on an optical waveguide output from said chip; an operational bias for each of said electro-absorption modulators (EAMs) chosen such that its band edge wavelength is close to a wavelength of operation of its corresponding DFB laser source so-that a small modulating electrical field across the modulator produces a large change in modulator light absorption.

Claim 101

Dependent Claim 24 words

91 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 90 wherein said chip is fabricated employing alloys of InGaAsP/InP or InAlGaAs/InP.

Claim 102

Dependent Claim 200 words

92 . A method of in-chip testing of monolithic transmitter photonic integrated circuit (TxPIC) chips formed in a semiconductor wafer, each chip comprising an array of integrated laser sources and an array of integrated electro-optic modulators, one each for each of the laser sources, and an optical combiner to receive the modulated signal outputs from each of the electro-optic modulators comprising the steps of: providing a first integrated photodetector at a rear facet of each of said laser sources in each chip; providing a second integrated photodetector between each of said modulators and said optical combiner in each chip; sequentially operating each of the laser sources in a selected chip to monitor light output from a laser source via its first corresponding photodetector and calibrate its operating characteristics by detecting the laser source output via its second corresponding photodetector thereby providing first calibration data; sequentially operating each of the modulators in the selected chip to monitor signal output from a modulator via its second corresponding photodetector and adjusting its bias point of operation to achieve optimum extinsion ratio and chirp thereby providing second calibration data; and thereafter storing the first and second calibration data for each chip for future reference.

Claim 103

Dependent Claim 200 words

92 . A method of in-chip testing of monolithic transmitter photonic integrated circuit (TxPIC) chips formed in a semiconductor wafer, each chip comprising an array of integrated laser sources and an array of integrated electro-optic modulators, one each for each of the laser sources, and an optical combiner to receive the modulated signal outputs from each of the electro-optic modulators comprising the steps of: providing a first integrated photodetector at a rear facet of each of said laser sources in each chip; providing a second integrated photodetector between each of said modulators and said optical combiner in each chip; sequentially operating each of the laser sources in a selected chip to monitor light output from a laser source via its first corresponding photodetector and calibrate its operating characteristics by detecting the laser source output via its second corresponding photodetector thereby providing first calibration data; sequentially operating each of the modulators in the selected chip to monitor signal output from a modulator via its second corresponding photodetector and adjusting its bias point of operation to achieve optimum extinsion ratio and chirp thereby providing second calibration data; and thereafter storing the first and second calibration data for each chip for future reference.

Claim 104

Dependent Claim 27 words

93 . The method of claim 92 further comprising the steps of: cleaving each chip from the wafer; and cleaving from each chip the first integrated photodetectors.

Claim 105

Dependent Claim 34 words

94 . The method claim 92 further comprising the steps of: cleaving each chip from the wafer; and operating each second photodetector either as a monitoring photodiode of the signal light from each modulator.

Claim 106

Dependent Claim 34 words

95 . The method of claim 92 further comprising the steps of: cleaving each chip from the wafer; and biasing each second photodetector to be transparent to light generated from its corresponding laser source.

Claim 107

Dependent Claim 16 words

96 . The method claim 95 wherein the biasing is a small positive value or zero.

Claim 108

Dependent Claim 20 words

97 . The method of claim 92 wherein said first and second photodetectors are avalanche photodiodes (APDs) or PIN photodiodes.

Claim 109

Dependent Claim 181 words

98 . A method of in-chip testing of monolithic transmitter photonic integrated circuit (TxPIC) chips formed in a semiconductor wafer, each chip comprising an array of integrated laser sources and an array of integrated electro-optic modulators, one each for each of the laser sources, and an optical combiner to receive the modulated signal outputs from each of the electro-optic modulators comprising the steps of: providing an integrated photodetector between each of said laser sources and said modulators or between said modulators and said optical combiner in each chip; sequentially operating each of the laser sources in a selected chip to monitor light output from a laser source via its corresponding photodetector and calibrate its operating characteristics by detecting the laser source output via its corresponding photodetectors; sequentially operating each of the modulators in the selected chip to monitor signal output from a modulator via its corresponding photodetector and adjusting its bias point of operation to achieve optimum extinsion ratio and chirp thereby providing calibration data relating to the chip; and thereafter storing the calibration data for each chip for future reference.

Claim 110

Dependent Claim 181 words

98 . A method of in-chip testing of monolithic transmitter photonic integrated circuit (TxPIC) chips formed in a semiconductor wafer, each chip comprising an array of integrated laser sources and an array of integrated electro-optic modulators, one each for each of the laser sources, and an optical combiner to receive the modulated signal outputs from each of the electro-optic modulators comprising the steps of: providing an integrated photodetector between each of said laser sources and said modulators or between said modulators and said optical combiner in each chip; sequentially operating each of the laser sources in a selected chip to monitor light output from a laser source via its corresponding photodetector and calibrate its operating characteristics by detecting the laser source output via its corresponding photodetectors; sequentially operating each of the modulators in the selected chip to monitor signal output from a modulator via its corresponding photodetector and adjusting its bias point of operation to achieve optimum extinsion ratio and chirp thereby providing calibration data relating to the chip; and thereafter storing the calibration data for each chip for future reference.

Claim 111

Dependent Claim 49 words

99 . The method of claim 98 further comprising the steps of: determining that one or more of the laser sources or modulators in particular chips in the wafer do not function properly; cleaving the chips from the wafer; and thereafter discarding the chips that do not function properly.

Claim 112

Dependent Claim 57 words

100 . The method of claim 98 further comprising the steps of: determining that one or more of the laser sources or modulators in a substantial number of chips in the wafer do not function properly; and thereafter discarding the wafer thereby saving resources normally consumed where the chips are tested after being cleaved from the wafer.

Claim 113

Dependent Claim 317 words

101 . A monolithic transmitter photonic integrated circuit (TXPIC) chip comprising: an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different predetermined wavelength together forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output comprising a channel signal; a laser driver circuit connected to each on-chip laser source for driving each of said laser sources to provide said respective light output at a predetermined wavelength on said grid; a tone signal superimposed on each channel signal having a frequency different from a frequency of any other tone signals so that each laser source can be individually identified; an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive said light outputs and combine them as a combined optical signal for output from the chip; and an optical feedback circuit coupled to receive a small portion of the chip signal output for stabilization of each of said light sources, said feedback circuit comprising: a photodetector for converting the optical signal output portion into an electrical signal; a power splitter to divide the electrical signal into a plurality of separate paths, the number of paths totaling the number of laser sources on said chip; a tone filter provide in each path to filter a tone signal from all other tone signals so that each filter provides a corresponding laser source light output of one of said laser sources; a circuit to receive each of said laser source light outputs to determined its wavelength of operation; and said circuit providing a correction signal to each of said laser driver circuits to change its corresponding laser driver bias or applied current to correct for the wavelength of operation of a laser source that is not operating at a desired predetermined wavelength.

Claim 114

Dependent Claim 317 words

101 . A monolithic transmitter photonic integrated circuit (TXPIC) chip comprising: an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different predetermined wavelength together forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output comprising a channel signal; a laser driver circuit connected to each on-chip laser source for driving each of said laser sources to provide said respective light output at a predetermined wavelength on said grid; a tone signal superimposed on each channel signal having a frequency different from a frequency of any other tone signals so that each laser source can be individually identified; an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive said light outputs and combine them as a combined optical signal for output from the chip; and an optical feedback circuit coupled to receive a small portion of the chip signal output for stabilization of each of said light sources, said feedback circuit comprising: a photodetector for converting the optical signal output portion into an electrical signal; a power splitter to divide the electrical signal into a plurality of separate paths, the number of paths totaling the number of laser sources on said chip; a tone filter provide in each path to filter a tone signal from all other tone signals so that each filter provides a corresponding laser source light output of one of said laser sources; a circuit to receive each of said laser source light outputs to determined its wavelength of operation; and said circuit providing a correction signal to each of said laser driver circuits to change its corresponding laser driver bias or applied current to correct for the wavelength of operation of a laser source that is not operating at a desired predetermined wavelength.

Claim 115

Dependent Claim 53 words

102 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 101 further comprising an array of electro-optic modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and provide a modulated output comprising said channel signal.

Claim 116

Dependent Claim 157 words

103 . A monolithic transmitter photonic integrated circuit (TxPIC) chip comprising: an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength together forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output comprising a channel signal; an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive said light outputs and combine them as a combined optical signal for output from the chip; an optical feedback circuit coupled to receive a small tapped portion of the chip signal output for wavelength stabilization of each of said light sources; and optical means in a path of the chip signal output beyond the tapped portion of the chip signal output to extinguish or attenuate the chip signal output during a period of wavelength stabilization of said light sources.

Claim 117

Dependent Claim 157 words

103 . A monolithic transmitter photonic integrated circuit (TxPIC) chip comprising: an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength together forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output comprising a channel signal; an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive said light outputs and combine them as a combined optical signal for output from the chip; an optical feedback circuit coupled to receive a small tapped portion of the chip signal output for wavelength stabilization of each of said light sources; and optical means in a path of the chip signal output beyond the tapped portion of the chip signal output to extinguish or attenuate the chip signal output during a period of wavelength stabilization of said light sources.

Claim 118

Dependent Claim 26 words

104 . The monolithic transmitter photonic integrated circuit (TxPIC) chip 103 wherein said optical means is an optical attenuator, an optical switch or a Mach-Zehnder interferometer.

Claim 119

Dependent Claim 26 words

104 . The monolithic transmitter photonic integrated circuit (TxPIC) chip 103 wherein said optical means is an optical attenuator, an optical switch or a Mach-Zehnder interferometer.

Claim 120

Dependent Claim 65 words

105 . The monolithic transmitter photonic integrated circuit (TXPIC) chip 103 further comprising an array of electro-optic modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and provide a modulated output comprising a channel signal, all of said channel signals representative of a wavelength on a predetermined wavelength grid.

Claim 121

Dependent Claim 65 words

105 . The monolithic transmitter photonic integrated circuit (TXPIC) chip 103 further comprising an array of electro-optic modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and provide a modulated output comprising a channel signal, all of said channel signals representative of a wavelength on a predetermined wavelength grid.

Claim 122

Dependent Claim 129 words

106 . A probe card for testing in-wafer photonic integrated circuits comprising a plurality of semiconductor chips formed in the wafer comprising: a probe card body having a plurality of rows of downwardly dependent, electrically conductive test probes; a plurality of test integrated chip circuits included with said probe card body, said test integrated chip circuits connected to selected of said test probes; means to translate said probe card body transversely over the surface of a wafer; means to move said probe card body up and down relative said wafer surface to permit engagement of said test probes in selected locations of a selected photonic integrated circuit for testing the operation of optical components in said selected photonic integrated circuit while said circuit is still integral with the wafer.

Claim 123

Dependent Claim 129 words

106 . A probe card for testing in-wafer photonic integrated circuits comprising a plurality of semiconductor chips formed in the wafer comprising: a probe card body having a plurality of rows of downwardly dependent, electrically conductive test probes; a plurality of test integrated chip circuits included with said probe card body, said test integrated chip circuits connected to selected of said test probes; means to translate said probe card body transversely over the surface of a wafer; means to move said probe card body up and down relative said wafer surface to permit engagement of said test probes in selected locations of a selected photonic integrated circuit for testing the operation of optical components in said selected photonic integrated circuit while said circuit is still integral with the wafer.

Claim 124

Dependent Claim 41 words

107 . The probe card of claim 106 wherein said test integrated circuit chips includes circuitry for identifying each selected photonic integrated circuit tested for later photonic integrated circuit chip identification relative to its obtained test data relating to the chip.

Claim 125

Dependent Claim 44 words

108 . The probe card of claim 106 wherein said photonic integrated circuits include electro-optic components including an array of laser sources, said probe card test integrated chip circuits operated to drive said laser sources to measure their light output intensity or operational wavelength.

Claim 126

Dependent Claim 47 words

109 . The probe card of claim 108 further comprising an array of electro-optic modulators included in said electro-optic components, said probe card test integrated chip circuits operated to modulate said electro-optic modulators with a test signal to measure their light output intensity, chirp or extinsion ratio.

Claim 127

Dependent Claim 123 words

110 . A monolithic transmitter photonic integrated circuit (TxPIC) chip comprising: an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output; an array of electro-optic modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and provide a modulated output comprising a channel signal; said modulators positioned in a staggered relationship on the chip so that metal striplines formed on the surface of the chip are aligned in a substantially parallel manner for direct connection to each modulator.

Claim 128

Dependent Claim 123 words

110 . A monolithic transmitter photonic integrated circuit (TxPIC) chip comprising: an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output; an array of electro-optic modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and provide a modulated output comprising a channel signal; said modulators positioned in a staggered relationship on the chip so that metal striplines formed on the surface of the chip are aligned in a substantially parallel manner for direct connection to each modulator.

Claim 129

Dependent Claim 57 words

111 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 110 further comprising an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive the channel signals from said electro-optic modulators and combine them as a combined optical signal for output from the chip.

Claim 130

Dependent Claim 29 words

112 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 111 wherein said optical combiner is a power coupler, star coupler or a multi-mode interference (MMI) coupler.

Claim 131

Dependent Claim 22 words

113 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 112 wherein said optical combiner is a wavelength selective multiplexer.

Claim 132

Dependent Claim 28 words

114 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 113 wherein said wavelength selective multiplexer is an arrayed waveguide grating (AWG) or an Echelle grating.

Claim 133

Dependent Claim 23 words

115 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 110 wherein said electro-optic modulators are electro-absorption modulators or Mach-Zehnder modulators.

Claim 134

Dependent Claim 21 words

116 . The monolithic transmitter photonic integrated circuit (TxPIC) chip of claim 110 wherein said metal striplines are co-planar microwave striplines.

Claim 135

Dependent Claim 169 words

117 . A monolithic transmitter photonic integrated circuit (TXPIC) chip system comprising: an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output; an array of electro-optic modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and provide a modulated output comprising a channel signal; and an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive the channel signals from said electro-optic modulators and combine them as a combined optical signal for output from the chip; a submount for receiving and flip-chip mounting of the chip; a plurality integrated circuit control chips mounted on said submount and electrically coupled to said laser sources and said modulators for electrical operation of the same.

Claim 136

Dependent Claim 169 words

117 . A monolithic transmitter photonic integrated circuit (TXPIC) chip system comprising: an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output; an array of electro-optic modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and provide a modulated output comprising a channel signal; and an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive the channel signals from said electro-optic modulators and combine them as a combined optical signal for output from the chip; a submount for receiving and flip-chip mounting of the chip; a plurality integrated circuit control chips mounted on said submount and electrically coupled to said laser sources and said modulators for electrical operation of the same.

Claim 137

Dependent Claim 24 words

118 . The monolithic transmitter photonic integrated circuit (TXPIC) chip system of claim 117 wherein said laser sources are DFB lasers or DBR lasers.

Claim 138

Dependent Claim 24 words

119 . The monolithic transmitter photonic integrated circuit (TxPIC) chip system of claim 117 wherein said electro-optic modulators are electro-absorption modulators or Mach-Zehnder modulators.

Claim 139

Dependent Claim 30 words

120 . The monolithic transmitter photonic integrated circuit (TxPIC) chip system of claim 117 wherein said optical combiner is a power coupler, star coupler or a multi-mode interference (MMI) coupler.

Claim 140

Dependent Claim 23 words

121 . The monolithic transmitter photonic integrated circuit (TxPIC) chip system of claim 120 wherein said optical combiner is a wavelength selective multiplexer.

Claim 141

Dependent Claim 29 words

122 . The monolithic transmitter photonic integrated circuit (TxPIC) chip system of claim 121 wherein said wavelength selective multiplexer is an arrayed waveguide grating (AWG) or an Echelle grating.

Claim 142

Dependent Claim 250 words

123 . A monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system comprising: a submount on which the chip is mounted; at least one Rx/TxPIC chip comprising: an input coupled to an integrated decombiner for receiving an optical signal comprising a plurality of combined optical channel signals of different wavelengths together forming a grid of wavelengths on a predetermined wavelength grid; an array of integrated photodetectors on said chip and optically coupled to receive a plurality of decombined optical channel signals from said optical decombiner for conversion into first electrical channel signals; an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength together forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output comprising a channel signal; an array of electro-optic modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and coupled to receive second electrical channel signals and provide a modulated output comprising a channel signal; and an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive the channel signals from said electro-optic modulators and combine them as a combined optical signal to an output; and a plurality of integrated circuit control chips mounted on said submount and electrically coupled to said photodetectors, laser sources and said modulators for electrical operation thereof.

Claim 143

Dependent Claim 250 words

123 . A monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system comprising: a submount on which the chip is mounted; at least one Rx/TxPIC chip comprising: an input coupled to an integrated decombiner for receiving an optical signal comprising a plurality of combined optical channel signals of different wavelengths together forming a grid of wavelengths on a predetermined wavelength grid; an array of integrated photodetectors on said chip and optically coupled to receive a plurality of decombined optical channel signals from said optical decombiner for conversion into first electrical channel signals; an array of laser sources, each formed in an optical waveguide of an array of optical waveguides and operating at a different wavelength together forming a grid of wavelengths on a predetermined wavelength grid and each providing a respective light output comprising a channel signal; an array of electro-optic modulators integrated on said chip, one each in an optical waveguide of said waveguide array to receive the respective light output of a laser source and coupled to receive second electrical channel signals and provide a modulated output comprising a channel signal; and an optical combiner integrated on said chip, said combiner having an input for coupling to each of said optical waveguides to receive the channel signals from said electro-optic modulators and combine them as a combined optical signal to an output; and a plurality of integrated circuit control chips mounted on said submount and electrically coupled to said photodetectors, laser sources and said modulators for electrical operation thereof.

Claim 144

Dependent Claim 56 words

124 . The monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system of claim 123 wherein said integrated circuit control chips are electrically coupled to said photodetectors, laser sources and said modulators to bias the same and to receive said first electrical signals from said photodiodes and provide said second electrical signals to drive said electro-optic modulators.

Claim 145

Dependent Claim 67 words

125 . The monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system of claim 124 wherein said integrated circuit control chips include integrated control circuits for processing said first electrical channel signals to re-amplify, re-shape and regenerate said first electrical channel signals into second electrical channel signals; said second signals provided to said electro-optic modulators for regenerating corresponding optical channel signals for optical transmission from said chip output.

Claim 146

Dependent Claim 24 words

126 . The monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system of claim 123 wherein said photodetectors are avalanche photodiodes (APDs) or PIN photodiodes.

Claim 147

Dependent Claim 24 words

127 . The monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system of claim 123 wherein said laser sources are DFB lasers or DBR lasers.

Claim 148

Dependent Claim 24 words

128 . The monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system of claim 123 wherein said electro-optic modulators are electro-absorption modulators or Mach-Zehnder modulators.

Claim 149

Dependent Claim 30 words

129 . The monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system of claim 123 wherein said optical combiner is a power coupler, star coupler or a multimode interference (MMI) coupler.

Claim 150

Dependent Claim 23 words

130 . The monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system of claim 129 wherein said optical combiner is a wavelength selective multiplexer.

Claim 151

Dependent Claim 29 words

131 . The monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system of claim 130 wherein said wavelength selective multiplexer is an arrayed waveguide grating (AWG) or an Echelle grating.

Claim 152

Dependent Claim 55 words

132 . The monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system of claim 123 wherein said at least one Rx/TxPIC chip comprises two semiconductor chips mounted on said submount, one of said chips comprises said decombiner and said photodetector array and the other of said chips comprises laser source and modulator arrays and said combiner.

Claim 153

Dependent Claim 27 words

133 . The monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system of claim 123 wherein the first and second optical channel signals have different grids of wavelengths.

Claim 154

Dependent Claim 28 words

134 . The monolithic receiver/transmitter photonic integrated circuit (Rx/TxPIC) chip system of claim 123 wherein the first and second optical channel signals have the same grids of wavelengths.

Claim 155

Dependent Claim 122 words

135 . A method of calibrating a monolithic transmitter photonic integrated circuit (TxPIC) chip having integrated arrays of laser sources and electro-optic modulators forming a plurality of different wavelength signal channels, comprising the steps of: sequentially selecting a laser source and testing for the output intensity and operating wavelength of each laser source; generating calibration data that is an amount of output intensity of each laser output and any offset of each laser wavelength from a desired predetermined value; re-adjusting each laser source intensity to a desired amount and its operating wavelength to a desired predetermined wavelength value; and storing for future reference the calibration data representative of adjusted laser light intensity and adjusted wavelength for each laser source on the chip.

Claim 156

Dependent Claim 122 words

135 . A method of calibrating a monolithic transmitter photonic integrated circuit (TxPIC) chip having integrated arrays of laser sources and electro-optic modulators forming a plurality of different wavelength signal channels, comprising the steps of: sequentially selecting a laser source and testing for the output intensity and operating wavelength of each laser source; generating calibration data that is an amount of output intensity of each laser output and any offset of each laser wavelength from a desired predetermined value; re-adjusting each laser source intensity to a desired amount and its operating wavelength to a desired predetermined wavelength value; and storing for future reference the calibration data representative of adjusted laser light intensity and adjusted wavelength for each laser source on the chip.

Claim 157

Dependent Claim 56 words

136 . The method of calibrating of claim 135 further comprising the steps of: providing an array of integrated semiconductor optical amplifiers on the chip, one for each of said signal channels; and adjusting the intensity of each laser source by adjusting gain of its respective semiconductor optical amplifier to the desired amount of light intensity.

Claim 158

Dependent Claim 19 words

137 . The method of calibrating of claim 135 wherein said laser sources are DFB lasers or DBR lasers.

Claim 159

Dependent Claim 19 words

138 . The method of calibrating of claim 135 wherein said electro-optic modulators are electro-absorption modulators or Mach-Zehnder modulators.

Claim 160

Dependent Claim 32 words

139 . The method of calibrating of claim 135 comprising the further step of employing on-chip integrated photodetectors for generating the calibration data with respect to laser light intensity and operational wavelength.

Transmitter photonic integrated circuit ( TxPIC) chips

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