Copper alloy for electronic equipment

Abstract

Abstract PURPOSE:To obtain a copper alloy for electronic equipment suitable for miniatuarized precision parts, by specifying a composition consisting of Sn, Ni, Co, Cr, Si, and Cu, limiting respective contents of O2 and S among impurities, and refining a precipitate. CONSTITUTION:A copper alloy for electronic equipment has a composition which consists of, by weight, 2.0-7.0% Sn, 1.0-6.0%, in total, of one or more elements among Ni, Co, and Cr, 0.1-2.0% Si, and the balance Cu with inevitable impurities and in which the contents of O2 and S among the above impurities are regulated to <=50ppm and <=20ppm, respectively, and the average grain size of a precipitate is also regulated to <=10mum, and this alloy has superior strength, workability, electric conductivity (thermal conductivity), corrosion resistance, heat resistance, etc. In the above copper alloy, it is preferable that the contents of Ni, Co, and Cr are regulated to 1.0-6.0%, <=1.5%, and 0.05-0.8%, respectively, and (Ni+Co+Cr)/Si=2-8 is satisfied, and it is also preferable to regulate the contents of O2 and S and the average grain size of the precipitate to <=30ppm, <=10ppm, and <=3mum, respectively. Moreover, the above copper alloy may further contain <=5.0%, in total, of prescribed amounts of Zn, Mn, Al, etc., if necessary.

Inventors

• 👤 Masato Asai
• 👤 Shoji Shiga
• 👤 Yoshimasa Oyama
• 👤 Shigeo Shinozaki

Bibliographic Details