Copper alloy for electronic and electrical equipment and its production

Abstract

Abstract PURPOSE:To manufacture the titled alloy excellent in thermal conductivity as well as in mechanical strength, by preparing an alloy in which specific percentages of Cr, Sn, P, Co, and S are incorporated to Cu and also the size of metallic and nonmetallic inclusions is specified. CONSTITUTION:A copper-alloy ingot which consists of, by weight, 0.1-0.4% Cr, 0.05-6.0% Sn, 0.0001-0.01% P, at least one kind among <=0.2% Mg, <=5% Zn, <=0.5% Mn, <=0.2% Si, <=0.1% B, <=0.2%Al, <=0.2% Ni, and <=0.5% CO and in which O2 and S contents are limited to <=0.0025% and <=0.0010%, respectively, is prepared. This ingot is heated to 850-950 deg.C to undergo hot working, cooled so that it is passed through a temp. region of 850-450 deg.C within 20min, and then subjected to cold working including, once at least, heat treatment at 400-500 deg.C for >=5min, so that size of metallic and nonmetallic inclusions can be regulated to <=10mu.

Inventors

• 👤 Yoshimasa Ooyama
• 👤 大山　好正
• 👤 Masato Asai
• 👤 真人 浅井
• 👤 Tsutomu Sato
• 👤 力 佐藤
• 👤 Shigeo Shinozaki
• 👤 篠崎　重雄
• 👤 Shoji Shiga
• 👤 志賀　章二

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