Cooling structure for semiconductor device

Abstract

Abstract PURPOSE:To obtain a liquid-cooling structure having less ageing change of cooling capacity by providing a plurality of circuit substrates dipped in the coolant in a vessel and a heat exchanger arranged in the coolant. CONSTITUTION:A semiconductor chip 3 is connected by a method such as a flip-chip bonding to a circuit substrate 4 of multilayer ceramics, and the substrate is connected with an external circuit by connector-connecting attached to the bottom of a cooling vessel 5. The vessel 5 is formed in a double structure, coolant 6 of fluorocarbon having low boiling point is filled in the inside vessel, and a heat exchanger 7 is formed in the shape for dividing the coolant 6 into upper and lower sections. Coolant water passing the exchanger 7 is formed to flow outside the vessel 5 of double structure. With this structure, air bubbles generated from an LSI 3 are all trapped in the exchanger 7 to be cooled and liquefied, thereby improving the cooling capacity.

Inventors

• 👤 Kishio Yokouchi
• 👤 貴志男 横内

Bibliographic Details