Liquid cooled module

Abstract

Abstract PURPOSE:To prevent the decrease of cooling power due to air infiltration by a method wherein a cooling plate with built-in fins is provided beneath the liquid surface of a coolant liquid, in the titled module wherein semiconductor elements are dipped in the liquid. CONSTITUTION:The semiconductor elements 21 are dipped in the liquid 22 sealed in the module 25, and the plate 24 is arranged beneath the liquid surface of the liquid 22. When heat is generated by the operation of the eements 21, the liquid 22 boils and then generates air bubbles 23 composed of the vapor of the liquid 22 by taking heat of vaporization. The air bubbles 23 rise while stirring the liquid 22, then being cooled and turning back to liquid. At this time, the air coming into an air layer 26 through infiltration to the module 25 does not dissolve in the liquid 22, therefore the decrease of the cooling power can be prevented.

Inventors

• 👤 Kishio Yokouchi
• 👤 貴志男 横内
• 👤 Koichi Niwa
• 👤 丹羽　紘一

Bibliographic Details