Electrically conductive paste

Abstract

Abstract PURPOSE:To obtain an electrically conductive paste which does not cause the breaking of wires due to corrosion and has excellent adhesion, by blending a modified resin, a monofunctional epoxysilane monomer, a norbornene ring- contg. resin and electrically conductive powder. CONSTITUTION:An electrically conductive paste contains a modified resin composed of poly-p-hydroxystyrene and an epoxy resin, a monofunctional epoxysilane monomer, a norbornene ring-contg. resin and electrically conductive powder. Examples of the monofunctional epoxysilane monomers are beta-(3,4- epoxycyclohexyl) ethyltri-methoxysilane and gamma-glycidoxypropyltrimethoxysilane. Even when said paste is cured by heating at 200 deg.C, lead from a is not stainned, a bond strength of 0.5kg/mm<2> or above, required for semiconductor pellet bending can be obtd. and a wire bonding strength of 4-5g can be obtd.

Inventors

• 👤 Teru Okunoyama
• 👤 奥野山　輝

Bibliographic Details