Semiconductor device cooling apparatus

Abstract

Abstract PURPOSE:To obtain a cooling apparatus having excellent cooling performance per unit pressure loss by setting a plate thickness of cooling fins arranged in parallel in desired number and a pitch to the particular values. CONSTITUTION:Many cooling fins 1A are loaded in parallel at the upper surface of a semiconductor module 2 and a pitch P between the adjacent fins 1A is set to a value as small range as 1-3mm. so that it does not conciderably increase a pressure loss. A cooling fin 1A is made of a metal material having excellent thermal conductivity and is formed into a thin flat plate of 0.05-0.5mm.. A base 6 is formed by holding such plate through a metal spacer 5 having excellent thermal conductivity. Under this condition, the interface is joined by the means such as solder or diffused junction. Next, the bottom plate of base 6 is machined into a smooth surface and thereafter the base 6 is loaded to a semiconductor module 2.

Inventors

• 👤 Hitoshi Matsushima
• 👤 均 松島
• 👤 Takehiko Yanagida
• 👤 柳田　武彦
• 👤 Hisashi Nakayama
• 👤 中山　恒

Bibliographic Details