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JPS55140255A Expired / Lapsed JP ⏱️ 0.0 years remaining

Heat sink structure

Assignee: NEC Corp
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Filing: 1979-04-18
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Granted: —
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Expires: 1999-04-18
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Abstract

Abstract PURPOSE:To provide a heat sink having predetermined volume and sufficient surface area by bending a thin metal plate in comblike shape. CONSTITUTION:A copper plate having a thickness of approx. 0.15mm is so bent as to have an interval of fins 1 of approx. 3.8mm to form a heat sink having 15mm high, 50mm long and 51mm wide in volume. According to this configuration, it has approx. 1.5 times in surface area the conventional aluminum extruded type to increase the fin efficiency to higher than 95%. When the fin interval is decreased, the surface area is further increased, so that higher voltage may be applied thereto. In case slits 6 are formed when the heat sink is mounted on the surface of a heating element 4, it can reduce the thermal strain caused by the difference of thermal expansion coefficients thereof. The heat sink thus constructed takes place no crack nor isolation of a substrate 4.

Inventors

  • 👤 Yoichi Matsuo

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-06 01:16
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

JPS5338968B2 Cited

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