Etching method

Abstract

Abstract PURPOSE: To make possible the formation of a precise pattern by means of a shielding body provided close to the substrated for even etching speed when a semiconductor substrate undergoes an etching liquid. CONSTITUTION: An etching tank 3 filled with an etching liquid is arranged into a water tank 2 having water 2 stored to prevent the rise in the temperature of the etching liquid. A carrier 4 holding a plurality of semiconductor substrates leaving a clearance therebetween is submerged into the tank 3 and a specified etching is performed. In this process, adjusting plates 8 serving as a shielding body are inserted into the clearance between the substrates to uniformize the etching speed between the peripheral and central portion of the substrate. In other words, a hole with a diameter about 1/2 as large as the substrate is punched at the central portion of the adjusting plate so that the amount of the etching liquid 7 is properly increased toward the central portion of the substrate 5 to eliminate uneven etching speed. With such an arrangement, a better etching is possible even to yield any fine pattern. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Katsuichi Kaminaka

Bibliographic Details