Continuous surface treatment apparatus

Abstract

Abstract PURPOSE: To make a uniform and continuous treatment possible by alternately providing air feeding and exhausting systems on an upper electrode plate along the direction of transporting materials to be treated, in a surface-treatment apparatus for semiconductor wafers and the like. CONSTITUTION: In a vacuum or low-pressure chamber in a vacuum container 1, materials to be treated such as wafers and the like are placed on a lower electrode plate 3, which also serves as a transport means, and are transported in the direction of an arrow. In an upper electrode 4, which is oppositely arranged with a specified distance being provided from the electrode plate 3, slit-shaped air feeding holes 5 and air exhausting holes 6 are alternately formed and are connected to an air-feeding system 9 and an air-exhausting system 10, through air-feeding ducts 7 and air- exhausting ducts 8, respectively. A high-frequency power supply 11 is connected to the electrodes 3 and 4 generate plasma discharge between both electrodes. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Hideo Sakai

Bibliographic Details