Semiconductor device

Abstract

Abstract Translated from Japanese (57)【要約】 【目的】半導体素子の発する熱を大気中に良好に放散さ せ、半導体素子を常に低温として長期間にわたり正常、 且つ安定に作動させることができる半導体装置を提供す ることにある。 【構成】絶縁基体１上に複数個の外部リード端子４と開 口Ｂを有する絶縁枠体２とを樹脂製接着剤５を介して順 次、取着し、前記絶縁枠体２の開口Ｂ内に半導体素子３ を収容するとともに該半導体素子３を絶縁枠体２の開口 Ｂ内に充填させた樹脂製充填剤７で気密に封止して成る 半導体装置であって、前記半導体素子３はその一部に、 一端が大気中に露出する熱伝導性部材８が当接されてい る。 (57) [Abstract] [Purpose] Dissipates the heat generated by a semiconductor device into the atmosphere well, keeping the semiconductor device at a low temperature for a long period of time, Another object is to provide a semiconductor device that can be stably operated. [Structure] A plurality of external lead terminals 4 and an insulating frame body 2 having an opening B are sequentially mounted on an insulating base body 1 with a resin adhesive 5 in between, and are placed in the opening B of the insulating frame body 2. Semiconductor element 3 And a semiconductor device 3 that is hermetically sealed with a resin filler 7 that fills the opening B of the insulating frame 2 with the semiconductor element 3 contained therein. The heat conductive member 8 whose one end is exposed to the atmosphere is in contact.

Inventors

• 👤 Shiyouji Uegaki
• 👤 祥司 植垣

Bibliographic Details