Semiconductor device

Abstract

Abstract PURPOSE:To realize marking of ink jet system or printer system, etc. and improve marking efficiency, or manufacturing efficiency of semiconductor device by forming a marking portion with a substance which assures high water absorbing property. CONSTITUTION:A heat radiating fin 12 consisting of aluminum is attached to the surface opposed to the pellet 3 attaching surface of substrate 2 with a bonding agent 13 of silicon system, and the adhesive surface of paper segment 14 of a water absorbing paper segment 14 having the adhesive surface at the rear surface is attached to the side of fin at the fin surface of the heat radiating fin 12. This paper segment assures good wettability with water ink, namely the marking by water ink becomes possible because a contact angle is small. Thereby, the marking system by water ink, for example, the marking by ink jet system, printer system is not possible.

Inventors

• 👤 Junichi Suzuki
• 👤 順一 鈴木
• 👤 Junichi Takama
• 👤 高間　淳一
• 👤 Michiaki Furukawa
• 👤 古川　道明

Bibliographic Details