Patent EP0727818A1 successfully refreshed from Google Patents.
EP0727818A1
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EP
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Zirconia-added alumina substrate with direct bonding of copper
Assignee: Fuji Electric Co Ltd
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Filing: 1995-01-19
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Granted: —
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Expires: 2015-01-19
Abstract
Abstract A ceramic substrate (2a) is a fired body and has a material composition in which alumina is the main component and zirconia is added to it. Copper plates (2b,2c) are directly bonded to the front and back faces of the ceramic substrate (2a). In the material composition of the ceramic substrate (2a), the content of the alumina is 70-90 wt% and the content of zirconia is 10-30 wt%.
Inventors
- 👤 Shizuyasu c/o Fuji Electric Co. Ltd. Yoshida
- 👤 Shigemasa c/o Fuji Electric Co. Ltd. Saito
- 👤 Katumi c/o Fuji Electric Co. Ltd. Yamada
- 👤 Kazuya c/o Sumitomo Metal Ceramics Inc. Matuura
- 👤 Kazuhiko c/o Sumitomo Metal Ceramics Teramura
- 👤 Toshio c/o Sumitomo Metal Ceramics Inc. Nozaki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 13:53
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/01; C04B35/10; C04B35/111; C04B35/117; C04B35/119; C04B35/622; C04B35/626; C04B35/62605; C04B35/62625; C04B35/6263; C04B35/6264; C04B35/63; C04B35/632; C04B35/634; C04B35/63404; C04B35/6342; C04B37/00; C04B37/02; C04B37/021; H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/255; H10W70/00; H10W70/40; H10W70/481; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/40; H10W76/42; H10W76/47; C04B2235/00; C04B2235/02; C04B2235/30; C04B2235/32; C04B2235/3205; C04B2235/3206; C04B2235/3208; C04B2235/3224; C04B2235/3225; C04B2235/3229; C04B2235/50; C04B2235/54; C04B2235/5418; C04B2235/5436; C04B2235/5463; C04B2235/70; C04B2235/96; C04B2235/9607; C04B2237/00; C04B2237/30; C04B2237/32; C04B2237/34; C04B2237/343; C04B2237/40; C04B2237/407; C04B2237/50; C04B2237/70; C04B2237/704; H10W72/00; H10W72/50; H10W72/531; H10W72/5363
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
37 words
A substrate for a semiconductor device, comprising: a ceramic substrate having a material composition in which alumina is a main component and zirconia is added to it; and a copper plate directly bonded to the ceramic substrate.
Claim 2
Dependent Claim
29 words
The substrate of claim 1, wherein in the material composition of the ceramic substrate a content of alumina is 70-90 wt% and a content of zirconia is 10-30 wt%.
Claim 3
Dependent Claim
33 words
The substrate of claim 2, wherein the ceramic substrate further includes at least one of yttria, calcia, magnesia and ceria that is each added at a ratio of 0.5-2 wt% separately from zirconia.
Claim 4
Dependent Claim
26 words
The substrate of claim 1, wherein zirconia added to alumina is totally or partially stabilized by dispersing at least one of yttria, calcia, magnesia and ceria.
References Cited (Backward Citations)
US4497875A
Cited
JPS6315430A
Cited
WO1988003917A1
Cited
DE3728096C1
Cited
JPH02149464A
Cited
JPH0329349A
Cited
JPH0738014A
Cited
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