Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To miniaturize and lighten a semiconductor device by using an insulating substrate, on both surfaces of which metallic plates are fixed previously, and utilizing one metallic plate as a heat sink between the metallic plate and a semiconductor pellet and the other metallic plate for a contact for heat conduction with an external radiator by exposure to the same surface as a sealing resin layer. CONSTITUTION:Both surfaces of a ceramic substrate 3 are metallized previously, and copper plates 2 and 8 are brazed. Both surfaces are brazed simultaneously, thus preventing the curvature of the ceramic substrate. The copper plates 2 on the upper surface side and metallized layers under the copper plates 2 are removed through selective etching, and the copper plates 2 are patterned so that only regions supporting semiconductor pellets 1 and terminal conductors 4 are left. A plurality of the semiconductor pellets 1 and the terminal conductors 4 are soldered onto the left copper plates, and electrodes on the pellets 1 and the terminal conductors 4 are connected by the bonding of conductors 5. The lower surface of the copper plate 8 is exposed, and the semiconductor pellets 1 are sealed by a resin layer 7 forming the same plane as the lower surface of the copper plate 8, thus completing a semiconductor device.

Inventors

• 👤 Susumu Kobayashi
• 👤 進 小林
• 👤 Atsushi Maruyama
• 👤 篤 丸山

Bibliographic Details