EP0684644A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method for manufacturing bump leaded film carrier type semiconductor device
Assignee: NEC Corp
•
Filing: 1995-05-24
•
Granted: —
•
Expires: 2015-05-24
Abstract
Abstract An insulating film (3) has conductive layers (6) on a first surface (Si) and conductive protrusions (9) on a second surface (S 2 ). The conductive layers (6) are connected to the conductive protrusions (9) via through holes provided in the insulating film. A semiconductor chip (1) having pads (2) is adhered by an adhesive layer (22) to the insulating film (3). Then, the conductive layers (6) are locally pressured, so that the conductive layers (6) are electrically connected to respective ones of the pads (2).
Inventors
- 👤 Keiichiro Kata
- 👤 Shuichi Matsuda
- 👤 Eiji Hagimoto
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 09:13
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W74/00; H10W74/10; H10W74/111; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W70/68; H10W70/681; H10W72/072; H10W72/07251; H10W72/073; H10W72/20; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 76
Claim 1
Independent Claim
105 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having a first surface (S i ) on which conductive layers (6) are formed and a second surface (S 2 ) on which conductive protrusions (9) connected through said insulating film to respective ones of said conductive layers are formed; adhering a semiconductor chip (1) having pads (2) to said insulating film by an adhesive layer (22) so that said conductive layers oppose respective ones of said pads; and locally pressing said conductive layers so that said conductive layers are electrically connected to said respective ones of said pads.
Claim 2
Independent Claim
105 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having a first surface (S i ) on which conductive layers (6) are formed and a second surface (S 2 ) on which conductive protrusions (9) connected through said insulating film to respective ones of said conductive layers are formed; adhering a semiconductor chip (1) having pads (2) to said insulating film by an adhesive layer (22) so that said conductive layers oppose respective ones of said pads; and locally pressing said conductive layers so that said conductive layers are electrically connected to said respective ones of said pads.
Claim 3
Dependent Claim
51 words
A method as set forth in claim 1, wherein conductive members (4) are inserted into through holes provided in said insulating film to electrically connect said conductive protrusions to respective ones of said conductive layers, and openings (21, 31) for locally pressing said conductive layers are provided in said insulating film.
Claim 4
Dependent Claim
19 words
A method as set forth in claim 2, wherein a filler (32) is fitted into each of said openings.
Claim 5
Dependent Claim
29 words
A method as set forth in claim 1, wherein said conductive layers extend over through holes provided in said insulating film to reach respective ones of said conductive protrusions.
Claim 6
Dependent Claim
29 words
A method as set forth in claim 1, further comprising a step of potting only sides of said semiconductor device by resin after said locally pressing step is completed.
Claim 7
Dependent Claim
24 words
A method as set forth in claim 1, further comprising a step of transfer-molding said semiconductor device after said local pressing step is completed.
Claim 8
Independent Claim
79 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having a first surface (S i ) on which conductive layers (6) are formed; adhering a semiconductor chip (1) having pads (2) to said insulating film by an adhesive layer (22) so that said conductive layers oppose respective ones of said pads; and locally pressing said conductive layers so that said conductive layers are electrically connected to said respective ones of said pads.
Claim 9
Independent Claim
79 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having a first surface (S i ) on which conductive layers (6) are formed; adhering a semiconductor chip (1) having pads (2) to said insulating film by an adhesive layer (22) so that said conductive layers oppose respective ones of said pads; and locally pressing said conductive layers so that said conductive layers are electrically connected to said respective ones of said pads.
Claim 10
Dependent Claim
44 words
A method as set forth in claim 7, further comprising a step of forming conductive protrusions (9) on a second surface (S 2 ) of said insulating film, said conductive protrusions being connected through said insulating film to respective ones of said conductive layers.
Claim 11
Dependent Claim
51 words
A method as set forth in claim 8, wherein conductive members (4) are inserted into through holes provided in said insulating film to electrically connect said conductive protrusions to respective ones of said conductive layers, and openings (21, 31) for locally pressing said conductive layers are provided in said insulating film.
Claim 12
Dependent Claim
19 words
A method as set forth in claim 9, wherein a filler (32) is fitted into each of said openings.
Claim 13
Dependent Claim
29 words
A method as set forth in claim 8, wherein said conductive layers extend over through holes provided in said insulating film to reach respective ones of said conductive protrusions.
Claim 14
Dependent Claim
29 words
A method as set forth in claim 8, further comprising a step of potting only sides of said semiconductor device by resin after said local pressing step is completed.
Claim 15
Dependent Claim
24 words
A method as set forth in claim 8, further comprising a step of transfer-molding said semiconductor device after said local pressing step is completed.
Claim 16
Independent Claim
116 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having first and second surfaces (Si, S 2 ) and through holes (31) therethrough, conductive layers (6) being formed on said second surface, conductive protrusions (9) being formed on said conductive layers, conductive members (6a) being formed in said through holes and being connected to respective ones of said conductive layers; adhering a semiconductor chip (1) having pads (2) to said insulating film by an adhesive layer (22) so that said conductive members oppose respective ones of said pads; and locally pressing said conductive members so that said conductive members are electrically connected to said respective ones of said pads.
Claim 17
Independent Claim
116 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having first and second surfaces (Si, S 2 ) and through holes (31) therethrough, conductive layers (6) being formed on said second surface, conductive protrusions (9) being formed on said conductive layers, conductive members (6a) being formed in said through holes and being connected to respective ones of said conductive layers; adhering a semiconductor chip (1) having pads (2) to said insulating film by an adhesive layer (22) so that said conductive members oppose respective ones of said pads; and locally pressing said conductive members so that said conductive members are electrically connected to said respective ones of said pads.
Claim 18
Dependent Claim
26 words
A method as set forth in claim 14, wherein conductive protrusions (42, 43) are formed on said conductive members on a side of said first surface.
Claim 19
Dependent Claim
29 words
A method as set forth in claim 14, further comprising a step of potting only sides of said semiconductor device by resin after said local pressing step is completed.
Claim 20
Dependent Claim
24 words
A method as set forth in claim 14, further comprising a step of transfer-molding said semiconductor device after said local pressing step is completed.
Claim 21
Independent Claim
107 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having first and second surfaces (Si, S 2 ) and through holes (31) therethrough, conductive layers (6) being formed on said second surface, conductive members (6a) being formed in said through holes and being connected to respective ones of said conductive layers; adhering a semiconductor chip (1) having pads (2) to said insulating film by an adhesive layer (22) so that said conductive members oppose respective ones of said pads; and locally pressing said conductive members so that said conductive members are electrically connected to said respective ones of said pads.
Claim 22
Independent Claim
107 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having first and second surfaces (Si, S 2 ) and through holes (31) therethrough, conductive layers (6) being formed on said second surface, conductive members (6a) being formed in said through holes and being connected to respective ones of said conductive layers; adhering a semiconductor chip (1) having pads (2) to said insulating film by an adhesive layer (22) so that said conductive members oppose respective ones of said pads; and locally pressing said conductive members so that said conductive members are electrically connected to said respective ones of said pads.
Claim 23
Dependent Claim
22 words
A method as set forth in claim 18, further comprising a step of forming first conductive protrusions (9) on said conductive layers.
Claim 24
Dependent Claim
27 words
A method as set forth in claim 18, wherein second conductive protrusions (42, 43) are formed on said conductive members on a side of said first surface.
Claim 25
Dependent Claim
29 words
A method as set forth in claim 18, further comprising a step of potting only sides of said semiconductor device by resin after said local pressing step is completed.
Claim 26
Dependent Claim
24 words
A method as set forth in claim 18, further comprising a step of transfer-molding said semiconductor device after said local pressing step is completed.
Claim 27
Independent Claim
132 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having a first surface (S i ) on which conductive layers (6) are formed and a second surface (S 2 ) on which conductive protrusions (9) connected through said insulating film to respective ones of said conductive layers are formed, said insulating film having a resin injection opening (3a) at a center portion thereof; combining a semiconductor chip (1) having pads (2) with said insulating film so that said conductive layers oppose respective ones of said pads; locally pressing said conductive layers so that said conductive layers are electrically connected to said respective ones of said pads; and injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
Claim 28
Independent Claim
132 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having a first surface (S i ) on which conductive layers (6) are formed and a second surface (S 2 ) on which conductive protrusions (9) connected through said insulating film to respective ones of said conductive layers are formed, said insulating film having a resin injection opening (3a) at a center portion thereof; combining a semiconductor chip (1) having pads (2) with said insulating film so that said conductive layers oppose respective ones of said pads; locally pressing said conductive layers so that said conductive layers are electrically connected to said respective ones of said pads; and injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
Claim 29
Dependent Claim
51 words
A method as set forth in claim 23, wherein conductive members (4) are inserted into through holes provided in said insulating film to electrically connect said conductive protrusions to respective ones of said conductive layers, and openings (21, 31) for locally pressing said conductive layers are provided in said insulating film.
Claim 30
Dependent Claim
19 words
A method as set forth in claim 23, wherein a filler (32) is fitted into each of said openings.
Claim 31
Dependent Claim
29 words
A method as set forth in claim 23, wherein said conductive layers extend over through holes provided in said insulating film to reach respective ones of said conductive protrusions.
Claim 32
Dependent Claim
29 words
A method as set forth in claim 23, further comprising a step of potting only sides of said semiconductor device by resin after said local pressing step is completed.
Claim 33
Dependent Claim
24 words
A method as set forth in claim 23, further comprising a step of transfer-molding said semiconductor device after said local pressing step is completed.
Claim 34
Independent Claim
106 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having a first surface (S i ) on which conductive layers (6) are formed, said insulating film having a resin injection opening (3a) at a center portion thereof; combining a semiconductor chip (1) having pads (2) with said insulating film so that said conductive layers oppose respective ones of said pads; locally pressing said conductive layers so that said conductive layers are electrically connected to said respective ones of said pads; and injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
Claim 35
Independent Claim
106 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having a first surface (S i ) on which conductive layers (6) are formed, said insulating film having a resin injection opening (3a) at a center portion thereof; combining a semiconductor chip (1) having pads (2) with said insulating film so that said conductive layers oppose respective ones of said pads; locally pressing said conductive layers so that said conductive layers are electrically connected to said respective ones of said pads; and injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
Claim 36
Dependent Claim
44 words
A method as set forth in claim 29, further comprising a step of forming conductive protrusions (9) on a second surface (S 2 ) of said insulating film, said conductive protrusions being connected through said insulating film to respective ones of said conductive layers.
Claim 37
Dependent Claim
51 words
A method as set forth in claim 29, wherein conductive members (4) are inserted into through holes provided in said insulating film to electrically connect said conductive protrusions to respective ones of said conductive layers, and openings (21, 31) for locally pressing said conductive layers are provided in said insulating film.
Claim 38
Dependent Claim
19 words
A method as set forth in claim 29, wherein a filler (32) is fitted into each of said openings.
Claim 39
Dependent Claim
29 words
A method as set forth in claim 29, wherein said conductive layers extend over through holes provided in said insulating film to reach respective ones of said conductive protrusions.
Claim 40
Dependent Claim
29 words
A method as set forth in claim 29, further comprising a step of potting only sides of said semiconductor device by resin after said local pressing step is completed.
Claim 41
Dependent Claim
24 words
A method as set forth in claim 29, further comprising a step of transfer-molding said semiconductor device after said local pressing step is completed.
Claim 42
Independent Claim
143 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having first and second surfaces (Si, S 2 ) and through holes (31) therethrough, conductive layers (6) being formed on said second surface, conductive protrusions (9) being formed on said conductive layers, conductive members (6a) being formed in said through holes and being connected to respective ones of said conductive layers, said insulating film having a resin injection opening (3a) at a center portion thereof; combining a semiconductor chip (1) having pads (2) to said insulating film so that said conductive layers oppose respective ones of said pads; locally pressing said conductive members so that said conductive members are electrically connected to said respective ones of said pads; and injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
Claim 43
Independent Claim
143 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having first and second surfaces (Si, S 2 ) and through holes (31) therethrough, conductive layers (6) being formed on said second surface, conductive protrusions (9) being formed on said conductive layers, conductive members (6a) being formed in said through holes and being connected to respective ones of said conductive layers, said insulating film having a resin injection opening (3a) at a center portion thereof; combining a semiconductor chip (1) having pads (2) to said insulating film so that said conductive layers oppose respective ones of said pads; locally pressing said conductive members so that said conductive members are electrically connected to said respective ones of said pads; and injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
Claim 44
Dependent Claim
26 words
A method as set forth in claim 36, wherein conductive protrusions (42, 43) are formed on said conductive members on a side of said first surface.
Claim 45
Dependent Claim
29 words
A method as set forth in claim 36, further comprising a step of potting only sides of said semiconductor device by resin after said local pressing step is completed.
Claim 46
Dependent Claim
24 words
A method as set forth in claim 36, further comprising a step of transfer-molding said semiconductor device after said local pressing step is completed.
Claim 47
Independent Claim
134 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having first and second surfaces (Si, S 2 ) and through holes (31) therethrough, conductive layers (6) being formed on said second surface, conductive members (6a) being formed in said through holes and being connected to respective ones of said conductive layers, said insulating film having a resin injection opening (3a) at a center portion thereof; combining a semiconductor chip (1) having pads (2) with said insulating film so that said conductive members oppose respective ones of said pads; locally pressing said conductive members so that said conductive members are electrically connected to said respective ones of said pads; and injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
Claim 48
Independent Claim
134 words
A method for manufacturing a semiconductor device, comprising the steps of: preparing an insulating film (3) having first and second surfaces (Si, S 2 ) and through holes (31) therethrough, conductive layers (6) being formed on said second surface, conductive members (6a) being formed in said through holes and being connected to respective ones of said conductive layers, said insulating film having a resin injection opening (3a) at a center portion thereof; combining a semiconductor chip (1) having pads (2) with said insulating film so that said conductive members oppose respective ones of said pads; locally pressing said conductive members so that said conductive members are electrically connected to said respective ones of said pads; and injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
Claim 49
Dependent Claim
22 words
A method as set forth in claim 40, further comprising a step of forming first conductive protrutions (9) on said conductive layers.
Claim 50
Dependent Claim
27 words
A method as set forth in claim 40, wherein second conductive protrusions (42, 43) are formed on said conductive members on a side of said first surface.
Claim 51
Dependent Claim
29 words
A method as set forth in claim 40, further comprising a step of potting only sides of said semiconductor device by resin after said local pressing step is completed.
Claim 52
Dependent Claim
24 words
A method as set forth in claim 40, further comprising a step of transfer-molding said semiconductor device after said local pressing step is completed.
Claim 53
Dependent Claim
61 words
A semiconductor device comprising: a semiconductor chip (1) having pads (2); an insulating film (3) having a first surface (Si) on which conductive layers (6) are formed and a second surface (S 2 ); an adhesive layer (22) for adhering said semiconductor chip to said insulating film so that said conductive layers are electrically connected to respective ones of said pads.
Claim 54
Dependent Claim
61 words
A semiconductor device comprising: a semiconductor chip (1) having pads (2); an insulating film (3) having a first surface (Si) on which conductive layers (6) are formed and a second surface (S 2 ); an adhesive layer (22) for adhering said semiconductor chip to said insulating film so that said conductive layers are electrically connected to respective ones of said pads.
Claim 55
Dependent Claim
31 words
A device as set forth in claim 45, wherein conductive protrusions (9) are formed on said second surface and connected through said insulating film to respective ones of said conductive layers.
Claim 56
Dependent Claim
22 words
A device as set forth in claim 45, further comprising a resin mold member (52) by potting sides of said semiconductor chip.
Claim 57
Dependent Claim
22 words
A device as set forth in claim 45, further comprising a resin mold member (53) by transfer-molding covering entirely said semiconductor chip.
Claim 58
Dependent Claim
81 words
A semiconductor device comprising: a semiconductor chip (1) having pads (2); an insulating film (3) having conductive layers (6) which extend over first and second surfaces (Si, S 2 ) of said insulating film via through holes, and having conductive protro- sions (9) on said conductive layers on a side of said second surface; an adhesive layer (22) for adhering said semiconductor chip to said insulating film so that said conductive layers are electrically connected to respective ones of said pads.
Claim 59
Dependent Claim
81 words
A semiconductor device comprising: a semiconductor chip (1) having pads (2); an insulating film (3) having conductive layers (6) which extend over first and second surfaces (Si, S 2 ) of said insulating film via through holes, and having conductive protro- sions (9) on said conductive layers on a side of said second surface; an adhesive layer (22) for adhering said semiconductor chip to said insulating film so that said conductive layers are electrically connected to respective ones of said pads.
Claim 60
Dependent Claim
23 words
A device as set forth in claim 49, further comprising a resin mold member (52) formed by potting sides of said semiconductor chip.
Claim 61
Dependent Claim
22 words
A device as set forth in claim 49, further comprising a resin mold member (53) by transfer-molding covering entirely said semiconductor chip.
Claim 62
Dependent Claim
94 words
A semiconductor device, comprising: a semiconductor chip (1) having pads (2); an insulating film (3) having first and second surfaces (Si , S 2 ) and through holes therethrough, conductive layers (6) being formed on said second surface, conductive protrusions (9) being formed on said conductive layers, conductive members (4) being formed in said through holes and being connected to respective ones of said conductive layers; an adhesive layer (22) for adhering said semiconductor chip (1) to said insulating film so that said conductive members are electrically connected to respective ones of said pads.
Claim 63
Dependent Claim
94 words
A semiconductor device, comprising: a semiconductor chip (1) having pads (2); an insulating film (3) having first and second surfaces (Si , S 2 ) and through holes therethrough, conductive layers (6) being formed on said second surface, conductive protrusions (9) being formed on said conductive layers, conductive members (4) being formed in said through holes and being connected to respective ones of said conductive layers; an adhesive layer (22) for adhering said semiconductor chip (1) to said insulating film so that said conductive members are electrically connected to respective ones of said pads.
Claim 64
Dependent Claim
24 words
A device as set forth in claim 52, further comprising a resin mold member (52) formed by potting covering sides of said semiconductor chip.
Claim 65
Dependent Claim
22 words
A device as set forth in claim 33, further comprising a resin mold member (53) by transfer-molding covering entirely said semiconductor chip.
Claim 66
Dependent Claim
94 words
A flexible film for mounting a semiconductor clip (1) having pads (2), comprising: an insulating film (3) having a first surface (Si) for mounting said semiconductor chip and a second surface (S 2 ); conductive layers (6) formed on said first surface; and conductive members (4) inserted into through holes of said insulating film, each of said conductive members linking between a respective one of said conductive layers and a respective one of said conductive protrusions, said insulating film being perforated to form openings (21) for locally pressing said conductive layers to said pads.
Claim 67
Dependent Claim
94 words
A flexible film for mounting a semiconductor clip (1) having pads (2), comprising: an insulating film (3) having a first surface (Si) for mounting said semiconductor chip and a second surface (S 2 ); conductive layers (6) formed on said first surface; and conductive members (4) inserted into through holes of said insulating film, each of said conductive members linking between a respective one of said conductive layers and a respective one of said conductive protrusions, said insulating film being perforated to form openings (21) for locally pressing said conductive layers to said pads.
Claim 68
Dependent Claim
18 words
A flexible film as set forth in claim 55, further comprising conductive protrusions (9) on said second surface.
Claim 69
Dependent Claim
25 words
A flexible film as set forth in claim 55, wherein an opening (3a) for injecting resin is formed in a center of said insulating film.
Claim 70
Dependent Claim
77 words
A flexible film for mounting a semiconductor chip (1) having pads (2), comprising: an insulating film (3) having a first surface (Si) for mounting said semiconductor chip and a second surface; conductive layers (6) extending on said first and second surfaces via through holes of said insulating film; conductive protrusions (9) formed on said conductive layers on a side of said second surface; said through holes being used for locally pressing said conductive layers to said pads.
Claim 71
Dependent Claim
77 words
A flexible film for mounting a semiconductor chip (1) having pads (2), comprising: an insulating film (3) having a first surface (Si) for mounting said semiconductor chip and a second surface; conductive layers (6) extending on said first and second surfaces via through holes of said insulating film; conductive protrusions (9) formed on said conductive layers on a side of said second surface; said through holes being used for locally pressing said conductive layers to said pads.
Claim 72
Dependent Claim
21 words
A flexible film as set forth in claim 58, wherein a filler (32) is fitted into each of said through holes.
Claim 73
Dependent Claim
25 words
A flexible film as set forth in claim 58, wherein an opening (3a) for injecting resin is formed in a center of said insulating film.
Claim 74
Dependent Claim
72 words
A flexible film for mounting a semiconductor clip (1) having pads (2), comprising: an insulating film (3) having a first surface for mounting said semiconductor clip and a second surface; conductive layers (6) formed on said second surface; conductive protrusions (9) formed on said conductive layers; conductive members (4) fitted into through holes of said insulating film and being connected said conductive layers, said conductive members being locally pressed to said pads.
Claim 75
Dependent Claim
72 words
A flexible film for mounting a semiconductor clip (1) having pads (2), comprising: an insulating film (3) having a first surface for mounting said semiconductor clip and a second surface; conductive layers (6) formed on said second surface; conductive protrusions (9) formed on said conductive layers; conductive members (4) fitted into through holes of said insulating film and being connected said conductive layers, said conductive members being locally pressed to said pads.
Claim 76
Dependent Claim
25 words
A flexible film as set forth in claim 61, wherein an opening (3a) for injecting resion is formed in a center of said insulating film.
References Cited (Backward Citations)
JPS5356969A
Cited
JPH02229445A
Cited
EP0459493A2
Cited
JPH04154136A
Cited
JPH04164344A
Cited
JPH0547847A
Cited
JPH0582586A
Cited
JPH05235091A
Cited
US5350947A
Cited
JPH06140462A
Cited
US5367435A
Cited
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