Patent EP0613076A1 successfully refreshed from Google Patents.
EP0613076A1
Expired / Lapsed
EP
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Circuit board receptacle and IC packages for multiple and single supply circuits
Assignee: National Semiconductor Corp
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Filing: 1994-01-19
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Granted: —
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Expires: 2014-01-19
Abstract
Abstract Complementary pad and pin configurations are provided for the pads of a system board receptacle (20) and the pins of alternative first and second IC packages (15,25) to be inserted in the receptacle. The system board accommodates multiple power supplies. The system board receptacle is constructed with a pad configuration having a first power supply pad and trace (VCCA) for coupling to a first power supply, and second and third power supply pads and traces (VCCB1,VCCB2) for coupling to a second power supply. A first IC package is constructed with a pin configuration for a first IC package (15) requiring multiple power supplies includes a first power supply pin (VCCA) coinciding with the first power supply pad and trace of the system board receptacle and a second power supply pin (VCCB1) coinciding with the second power supply pad and trace for supplying portions of the integrated circuit of the first IC package from different power supplies. The first IC package is formed with a third no-connect pin coinciding with a third power supply pad and trace (VCCB2) of the system board receptacle 20. A second IC package pin configuration includes a single power supply pin (VCCB2) coinciding with the third power supply pad and trace of the system board receptacle (20). The second IC package pin configuration is constructed without pins coinciding with the first and second power supply pads and traces (VCCA, VCCB1). Complementary ground pads and pins are also provided. The first and second IC packages may be used interchangeably in the same system board receptacle (20) without modification of the system board.
Inventors
- 👤 Jeffrey Davis
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 18:39
CPC Classifications
G; G06; G06F; G06F1/00; G06F1/26; H; H05; H05K; H05K1/00; H05K1/02; H05K1/0286; H05K1/0295; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09954; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
239 words
A circuit board receptacle for receiving at least first and second IC packages, said first IC package requiring at least first and second different power supplies for supplying first and second portions of the integrated circuit of the first IC package, said first IC package having a pin configuration comprising at least first and second power supply pins (VCCA,VCCB1) coupled to the first and second portions of the integrated circuit of the first IC package, said second IC package requiring a single power supply and having a pin configuration comprising a single power supply pin (VCCB2) coupled to the integrated circuit of the second IC package for supplying the single power supply, comprising: said system board receptacle (20) being constructed with a pad configuration comprising a first power supply pad and trace (VCCA) for coupling to a first power supply, said first power supply pad coinciding with the first power supply pin (VCCA).of the first IC package; said system board receptacle (20) pad configuration comprising a second power supply pad and trace (VCCB1) for coupling to a second power supply, said second power supply pad and trace coinciding with the second power supply pin (VCCB1) of the first IC package; said pad configuration comprising a third power supply pad and trace (VCCB2) for coupling to the second power supply, said third power supply pad and trace coinciding with the single power supply pin (VCCB2) of the second IC package.
Claim 2
Dependent Claim
61 words
The circuit board receptacle of claim 1 wherein the first IC package is constructed with a third power supply pin (VCCB2) without direct connection to the integrated circuit of the first IC package, said circuit board receptacle being constructed with a third power supply pad and trace (VCCB2) coinciding with said third power supply pin (VCCB2) of the first IC package.
Claim 3
Dependent Claim
91 words
The circuit board receptacle of claim 1 wherein the first IC package (15) comprises fourth, fifth, and sixth ground pins (GND4,GND5,GND6) for coupling to ground and wherein the second IC package comprises a single ground pin (GND4) for coupling to ground, said circuit board receptacle (20) pad configuration comprising fourth, fifth, and sixth ground pads and traces (GND4,GND5,GND6) coinciding with the fourth, fifth, and sixth ground pins of the first IC package, said fourth ground pad and trace (GND4) coinciding with the single ground pin (GND4) of the second IC package.
Claim 4
Dependent Claim
48 words
The circuit board receptacle of claim 3 wherein the system board receptacle (20) comprises two parallel rows of pads and traces and wherein the power supply pads and traces and ground pads and traces occupy respective ends of the parallel rows defining four corners of the receptacle (20).
Claim 5
Dependent Claim
148 words
The circuit board receptacle of claim 4 wherein the first and second power supply pads and traces (VCCA,VCCB1) occupy respective ends of the two parallel rows at one end and wherein the fifth and sixth ground pads and traces (GND5,GND6) occupy respective ends of the two parallel rows at the other end, wherein the third power supply pad and trace (VCCB2) is adjacent to one of the first and second power supply pads and traces, and wherein the fourth ground pad and trace (GND4) is adjacent to one of the fifth and sixth ground pads and traces (GND5,GND6), whereby the circuit board receptacle (20) is able to accommodate a second IC package (25) having a pin configuration with four less pins than the pin configuration of the first IC package (15), said first IC package (15) having four additional pins (VCCA,VCCB1,GND5,GND6) at said four ends or four corners.
Claim 6
Dependent Claim
190 words
A first integrated circuit (IC) package (15) requiring at least first and second different power supplies, said first IC package (15) to be inserted in a circuit board receptacle (20) having a pad configuration constructed with a first power supply pad and trace (VCCA) for coupling to a first power supply, a second power supply pad and trace (VCCB1) for coupling to a second power supply, and a third power supply pad and trace (VCCB2) for coupling to the second power supply, comprising: said first IC package being constructed with a pin configuration having a first power supply pin (VCCA) coinciding with the first power supply pad and trace of the circuit board receptacle (20) for coupling to the first power supply, a second power supply pin (VCCB1) coinciding with the second power supply pad and trace of the circuit board receptacle (20) for coupling to the second power supply, and a third pin (VCCB2) coinciding with the third power supply pad and trace of the system board receptacle (20), said third pin being a no connect pin without direct connection to the integrated circuit of the first IC package.
Claim 7
Dependent Claim
84 words
The IC package of claim 6 comprising a second IC package requiring only a single power supply, said second IC package being constructed with a pin configuration having a single power supply pin (VCCB2) coinciding with the third power supply pad and trace of the circuit board receptacle (20) for coupling to the second power supply, said second IC package (25) pin configuration being constructed without pins coinciding with the first and second power supply pads and traces (VCCA)(VCCB1) of the circuit board receptacle.
Claim 8
Dependent Claim
69 words
The integrated circuit package of claim 6 wherein the system board receptacle (20) to receive the first IC package comprises fourth, fifth, and sixth ground pads and traces (GND4,GND5, GND6) for coupling to ground, said first IC package (15) being constructed with a pin configuration having fourth, fifth, and sixth ground pins (GND4,GND5,GND6) coinciding with the fourth, fifth and sixth ground pads and traces of the system board receptacle.
Claim 9
Dependent Claim
125 words
The integrated circuit package of claim 7 wherein the circuit board receptacle (20) pad configuration is constructed with fourth, fifth, and sixth ground pads and traces (GND4,GND5,GND6) for coupling to ground, wherein the first IC package (15) is constructed with a pin configuration having fourth, fifth, and sixth ground pins (GND4,GND5,GND6) coinciding with the fourth, fifth, and sixth ground pads and traces of the system board receptacle (20), and wherein the second IC package (25) is constructed with a pin configuration having a single ground pin (GND4) coinciding with the fourth ground pad and trace of the system board receptacle (20), said second IC package (25) being constructed without ground pins coinciding with the ground pads and traces (GND5,GND6) of the system board receptacle (20).
Claim 10
Independent Claim
169 words
A system board receptacle (20) and at least one IC package (15,25) to be inserted in the receptacle (20), said system board accommodating multiple power supplies, comprising: said system board receptacle (20) being constructed with a pad configuration comprising a first power supply pad and trace (VCCA) for coupling to a first power supply, and second and third power supply pads and traces (VCCB1,VCCB2) for coupling to a second power supply; and at least a first IC package (15) having a pin configuration comprising a first power supply pin (VCCA) coinciding with the first power supply pad and trace of the system board receptacle (20) for supplying portions of the integrated circuit of said first IC package from a first power supply, and a second power supply pin (VCCB1) coinciding with the second power supply pad and trace of the system board receptacle (20) for supplying other portions of the integrated circuit of the first IC package (15) from a second power supply different from the first power supply.
Claim 11
Dependent Claim
46 words
The receptacle and package of claim 10 wherein the first IC package comprises a third pin coinciding with the third power supply pad and trace of the system board receptacle, said third pin not being connected directly to the integrated circuit of the first IC package.
Claim 12
Dependent Claim
93 words
The receptacle and package of claim 10 comprising a second IC package (25) having a pin configuration comprising a single power supply pin (VCCB2) coinciding with the third power supply pad and trace (VCCB2) of the system board receptacle (20), said second IC package (25) being constructed without pins coinciding with the first and second power supply pads and traces (VCCA, VCCB1) of the system board receptacle (20), whereby the first and second IC packages (15,25) may be used interchangeably in the same system board receptacle (20) without modification of the system board.
Claim 13
Dependent Claim
107 words
The receptacle and package of claim 12 wherein the system board receptacle (20) comprises fourth, fifth, and sixth ground pads and traces (GND4,GND5,GND6) for coupling to ground; wherein the first IC package (15) comprises fourth, fifth, and sixth ground pins (GND4,GND5,GND6) coinciding with the fourth, fifth and sixth ground pads and traces of the system board receptacle (20); and wherein the second IC package (25) is constructed with a fourth ground pin (GND4) coinciding with the fourth ground pad and trace of the receptacle (20) and is formed without pins coinciding with the fifth and sixth ground pads and traces (GND5,GND6) of the system board receptacle (20).
Claim 14
Dependent Claim
45 words
The receptacle and package of claim 13 wherein the first IC package (15) is constructed with four more pins than the second IC package (25), said four pins comprising the first and second power supply pins (VCCA,VCCB1) and the fifth and sixth ground pins (GND5,GND6).
Claim 15
Dependent Claim
90 words
The receptacle and package of claim 14 wherein the first IC package (15) comprises a dual inline package (DIP) of dual rows of pins; wherein the four more pins (VCCA,VCCB1,GND5,GND6) are positioned respectively at the four corners or four ends of the dual rows of pins of the first IC package DIP; and wherein the corresponding pads and traces of the system board receptacle (20) are positioned at four corners or four ends of dual rows of pads and traces corresponding to the dual rows of pins of the DIP.
Claim 16
Dependent Claim
35 words
The receptacle and package of claim 15 wherein the first IC package is a translator (15) requiring multiple different power supplies and the second IC package is a transceiver (25) requiring a single power supply.
Claim 17
Dependent Claim
44 words
The receptacle and package of claim 16 wherein the first power supply is a 3v standard power supply and the second power supply is a 5v standard power supply and wherein the first IC package is a 3v standard to 5v standard translator (15).
Claim 18
Dependent Claim
18 words
The receptacle and package of claim 17 wherein the second IC package is a 3v standard transceiver (25).
Claim 19
Dependent Claim
74 words
The receptacle and package of claim 18 wherein the system board comprises a PC motherboard for a microprocessor using a 3v standard power supply, said motherboard having a disk drive port coupled to a disk drive controller having a 5v standard power supply, said translator (15) and system board receptacle (20) being coupled between the microprocessor and disk drive port for translation between the 3v standard power supply and the 5v standard power supply.
Claim 20
Dependent Claim
37 words
The receptacle and package of claim 19 wherein the first IC package translator (15) is constructed using NWELL CMOS technology with NWELL's in a common grounded P type substrate (PSUB) for isolation of the multiple power supplies.
Claim 21
Independent Claim
257 words
A system board receptacle (20) and at least one IC package (15,25) to be inserted in the receptacle (20), for a system board accommodating multiple power supplies, comprising: said system board receptacle being constructed with a pad configuration comprising a first power supply pad and trace (VCCA) for coupling to a first power supply, a second power supply pad and trace (VCCB1) for coupling to a second power supply, and a third power supply pad and trace (VCCB2) for coupling to the second power supply, said system board receptacle (20) also comprising at least two data ports (A,B) of respective multiple pads and traces for receiving and transmitting input and output signals of logic high and low potential levels; and at least a first IC package (15) having a pin configuration having first and second data ports (A,B) of respective multiple pins (A0...A7, B0...B7) respectively operating from different first and second power supplies, said IC package (15) pin configuration comprising a first power supply pin (VCCA) coinciding with the first power supply pad and trace (VCCA) of the system board receptacle (20) for supplying portions of a circuit coupled to the first data port (A), and a second power supply pin (VCCB1) coinciding with the second power supply pad and trace (VCCB1) of the receptacle (20) for supplying portions of a circuit coupled to the second data port (B); said first IC package pin configuration being constructed with a no-connect pin coinciding with the third power supply pad and trace (VCCB2) of the system board receptacle (20).
Claim 22
Dependent Claim
144 words
The receptacle and package of claim 21 comprising a second IC package (25) having a pin configuration with first and second data ports (A,B) of respective multiple pins (A0...A7,B0...B7) operating from a single power supply for receiving and transmitting respective input and output multi-bit signals at the same compatible logic high and low potential levels, said second IC package (25) comprising a single power supply pin (VCCB2) coinciding with the third power supply pad and trace (VCCB2) of the system board receptacle (20); said second IC package (25) being constructed without pins coinciding with the first and second power supply pads and traces (VCCA, VCCB1) of the system board receptacle (20); whereby the first IC package requiring multiple supplies and second IC package requiring a single supply may be used interchangeably in the same system board receptacle (20) without modification of the system board.
Claim 23
Dependent Claim
111 words
The receptacle and package of claim 22 wherein the system board receptacle (20) pad configuration comprises fourth, fifth and sixth ground pads and traces (GND4,GND5,GND6) for coupling to ground; wherein the first IC package (15) pin configuration comprises fourth, fifth and sixth ground pins (GND4,GND5,GND6) coinciding with the fourth, fifth and sixth ground pads and traces of the system board receptacle (20); and wherein the second IC package (25) pin configuration is constructed with a fourth ground pin (GND4) coinciding with the fourth ground pad and trace of the receptacle (20) and is formed without pins coinciding with the fifth and sixth ground pads and traces (GND5,GND6) of the receptacle (20).
Claim 24
Dependent Claim
60 words
The receptacle and package of claim 22 wherein the first power supply is a 5v standard power supply, wherein the second power supply is a JEDEC Standard 8-1A 3v standard power supply, wherein the first IC package is a 3v standard to 5v standard translator, and wherein the third power supply is a JEDEC Standard 8-1A 3v standard power supply.
Claim 25
Dependent Claim
50 words
The receptacle and package of claim 23 wherein the first IC package (15) pin configuration is constructed with four more pins than the second IC package (25) pin configuration, said four pins comprising the first and second power supply pins (VCCA, VCCB1) and the fifth and sixth ground pins (GND5,GND6).
Claim 26
Dependent Claim
94 words
The receptacle and package of claim 25 wherein the first IC package (15) pin configuration comprises a dual inline package (DIP) of dual rows of pins; wherein the four more pins (VCCA,VCCB1,GND5,GND6) are positioned respectively at the four corners or four ends of the dual rows of pins of the first IC package DIP; and wherein the corresponding pads and traces of the system board receptacle (20) pad configuration are positioned at four corners or four ends of dual rows of pads and traces corresponding to the dual rows of pins of the DIP.
Claim 27
Dependent Claim
34 words
The receptacle and package of claim 24 wherein the first IC package is constructed using NWELL CMOS technology with NWELL's in a common grounded P type substrate (PSUB) for isolation of multiple power supplies.
Claim 28
Dependent Claim
92 words
The receptacle and packages of claim 24 wherein the system board comprises a PC motherboard for a microprocessor using a 3v standard power supply, said motherboard having a disk drive port coupled to a disk drive controller having a 5v standard power supply, said translator (15) and system board receptacle (20) being coupled between the microprocessor and disk drive port for translation between the 3v standard power supply and corresponding logic high and low potential level signals and the 5v standard power supply and corresponding logic high and low potential level signals.
Claim 29
Dependent Claim
92 words
A circuit board receptacle having n pin receivers arranged to receive IC packages, said circuit board supporting multiple power supplies, said receptacle having a configuration of n pads and traces at the respective n pin receivers for supplying at least two different power supplies to a first IC package having n pins filling the n pin receivers of the receptacle, said configuration of n pads and traces being constructed for supplying a single power supply to a second IC package having n-m pins filling n-m pin receivers of the receptacle where m<n.
Claim 30
Dependent Claim
9 words
The circuit board receptacle of claim 29 where m=4.
References Cited (Backward Citations)
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