EP0503782A1
Expired / Lapsed
EP
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Integrated circuit card
Assignee: Avery Weigh Tronix Ltd
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Filing: 1992-02-20
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Granted: —
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Expires: 2012-02-20
Abstract
Abstract An integrated circuit card has a circuit bearing insert (1) therein with the electrical components (3 and 4) such as memory, processing circuit and capacitors mounted within dished portions of the substrate. This is typically achieved by heating the insert under pressure and elevated temperature with its reverse side against a resiliently-deformable pad.
Inventors
- 👤 Charles Richard Jarvis
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 18:13
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
52 words
An integrated circuit card containing a flexible insert consisting of a flexible circuit-forming substrate (2) upon which is adhered at least one electrical component (3, 4), the substrate being generally planar, characterised in that the or each electrical component (3, 4) is mounted within a generally concave portion of the substrate (2).
Claim 2
Dependent Claim
35 words
An integrated circuit card according to Claim 1, wherein the surface of the or each component opposite to that adhered to the substrate is in substantially the same plane as the remainder of the substrate.
Claim 3
Independent Claim
69 words
A method of manufacturing an integrated circuit card, comprising forming a flexible insert by adhesively mounting at least one electrical component (3, 4) on a flexible circuit-forming polymeric substrate (2), characterised by deforming the substrate to provide for the or each electrical component (3, 4) a generally concave portion (50) in which said component is mounted, and mounting the insert within a polymeric body (5) to form the card.
Claim 4
Dependent Claim
96 words
A method according to Claim 3, comprising placing the insert against a non-deformable surface (20) with the or each component (3, 4) in contact with the surface, and with a resiliently-deformable surface (21) in contact with the opposite face of the insert, applying pressure to the insert while heating the substrate (2) to a temperature above the glass transition temperature thereof, maintaining the insert at the elevated temperature for a predetermined period and then cooling the insert to below the glass transition temperature while maintaining the pressure, and removing the insert from between the two surfaces.
Claim 5
Dependent Claim
39 words
A method according to Claim 3, comprising deforming the substrate to form a concave portion (50) therein for the or each electrical component (3, 4), and then mounting the electrical component or components in the concave portion or portions.
Claim 6
Dependent Claim
17 words
A method according to Claim 4, wherein the resiliently-deformable surface (21) is formed of a silicone foam.
Claim 7
Dependent Claim
18 words
A method according to Claim 4 or 6, wherein the pressure is of the order of 50 psi.
Claim 8
Dependent Claim
16 words
A method according to Claim 4, 6 or 7, wherein the predetermined period is 10 seconds.
References Cited (Backward Citations)
EP0107061A2
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EP0140230B1
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EP0209791A2
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DE3528686A1
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GB2219960A
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GB2227209A
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DE3901402A1
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