EP0140230B1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Integrated circuit record carrier and process for making the same
Assignee: GAO Gesellschaft fuer Automation und Organisation mbH
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Filing: 1984-10-09
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Granted: 1990-01-10
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Expires: 2004-10-09
Abstract
Abstract A multilayer data carrier into which a carrier element supporting an IC module is incorporated comprises a flexible substrate on which contact surfaces are formed which are connected to the IC module via leads. The carrier element is deformed in such a way, when being incorporated into the data carrier, that the IC module, in the finished data carrier, is located in the center of the card protected by cover layers of the card and the contact surfaces are flush with the surface of the card. A method for producing the data carrier comprises laminating a substrate layer carrying an IC-module with its leads and contact pad surfaces on one surface thereof between outer protective layers and with a central core layer such that the IC-module is disposed centrally within the data carrier with the contact surfaces disposed in apertures in one of the outer protective layers flush with the surface of said one layer.
Inventors
- 👤 Joachim Hoppe
- 👤 Yahya Dipl.-Ing. Haghiri-Tehrani
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 06:56
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; H; H10; H10W; H10W70/00; H10W70/60; H10W70/699; Y; Y10; Y10S; Y10S283/00; Y10S283/904; Y10T; Y10T428/00; Y10T428/23; Y10T428/239; Y10T428/24; Y10T428/24802; Y10T428/24851; Y10T428/24868
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
199 words
Multi-layer data carrier consisting of - at least one core layer and an upper and lower covering layer, - an IC component for processing electrical signals and - contact surfaces and printed conductors for connecting the IC component to external apparatus - a flexible, film-like substrate with a recess for the IC component, - the IC component, contact surfaces and printed conductors all being jointly mounted on the substrate, the contact surfaces and printed conductors being made from a thin, electrically conductive coating of the substrate and the substrate being interposed between the core and covering layers in such a way that - the IC component is located in a recess in the core layer and -the contact surfaces are present in at least one recess in the upper covering layer, characterised in that -the substrate is deformed in the data carrier in such a way that the contact surfaces abut flush on the surface of the data carrier and the IC component is located in a central plane of the data carrier and - the printed conductors between the contact surfaces and the IC component are bent into the central plane only in the areas with underlying substrate.
Claim 2
Dependent Claim
199 words
Multi-layer data carrier consisting of - at least one core layer and an upper and lower covering layer, - an IC component for processing electrical signals and - contact surfaces and printed conductors for connecting the IC component to external apparatus - a flexible, film-like substrate with a recess for the IC component, - the IC component, contact surfaces and printed conductors all being jointly mounted on the substrate, the contact surfaces and printed conductors being made from a thin, electrically conductive coating of the substrate and the substrate being interposed between the core and covering layers in such a way that - the IC component is located in a recess in the core layer and -the contact surfaces are present in at least one recess in the upper covering layer, characterised in that -the substrate is deformed in the data carrier in such a way that the contact surfaces abut flush on the surface of the data carrier and the IC component is located in a central plane of the data carrier and - the printed conductors between the contact surfaces and the IC component are bent into the central plane only in the areas with underlying substrate.
Claim 3
Dependent Claim
48 words
Data carrier according to claim 1, characterised in that - a plurality of contact surfaces are assembled in groups, - both the areas of the substrate which carry the contact groups and the recesses in the upper covering layer are adapted to the contours of the contact groups.
Claim 4
Dependent Claim
58 words
Data carrier according to claim 1 or 2 characterised in that - the thickness of the upper covering layer is the same as or slightly greater then the thickness of the substrate including the contact surfaces and - the contact groups together with the associated parts of substrate are completely bent into the recesses in the covering layer.
Claim 5
Dependent Claim
45 words
Data carrier according to claim 1 or 3, characterised in that those areas of the substrate which underlie the contact surfaces project beyond said surfaces in the edge area thereof and the projecting parts are secured between the core layer and the upper covering layer.
Claim 6
Dependent Claim
72 words
Data carrier according to claim 1, characterised in that both the upper covering layer and also the substrate have recesses in the area of the contact surfaces, the contact surfaces are deformed in such a way that they meet the surface of the covering layer through the recesses in the upper covering layer and the space left by the recesses under the contact surfaces is filled with material from the core layer.
Claim 7
Dependent Claim
37 words
Data carrier according to one or more of claims 1 to 5, characterised in that those parts of the substrate which carry the contact groups are fixed to the core layer. by means of a fusible adhesive.
Claim 8
Dependent Claim
31 words
Data carrier according to one or more of claims 1 to 6, characterised in that the substrate is made from a film of high thermostability and high tensile strength, preferably polyamide.
Claim 9
Dependent Claim
39 words
Data carrier according to one or more of claims 1 to 7, characterised in that the contact groups are connected to the area of the substrate in which the IC component is mounted via narrow webs (12) of substrate.
Claim 10
Dependent Claim
68 words
Data carrier according to claim 1, characterised in that - the data carrier is rectangular, - the substrate is arranged in the data carrier so that the contact rows run parallel to the short edges of the data carrier and - at least those parts of the leads which run parallel to the long edges of the data carrier are fully supported by substrate and fixedly connected thereto.
Claim 11
Dependent Claim
38 words
Data carrier according to claim 9, characterised in that those parts of the leads which have no underlying substrate are guided to the contacting points of the IC component preferably parallel to the shortedges of the data carrier.
Claim 12
Dependent Claim
171 words
Process for producing a multi-layer data carrier consisting of at least one core layer and a covering layer with a carrier element consisting of a substrate on which are mounted an IC component, printed conductors and contact surfaces, characterised in that - the substrate consisting of a flexible film material with contact surfaces, printed conductors and the IC component mounted thereon is fixed to the core layer in such a way that the IC component is located in the region of a recess in the core layer, - the upper covering layer is positioned over the core layer in such a way that the recesses in this covering layer are located above the contact surfaces provided on the substrate and - the laminar construction is welded together, under the effect of pressure and heat, so that, as a result of the bending of the substrate, the contact surfaces are pressed against the surfaces of the upper covering layer and the IC component is pressed into the interior of the laminar structure.
Claim 13
Dependent Claim
171 words
Process for producing a multi-layer data carrier consisting of at least one core layer and a covering layer with a carrier element consisting of a substrate on which are mounted an IC component, printed conductors and contact surfaces, characterised in that - the substrate consisting of a flexible film material with contact surfaces, printed conductors and the IC component mounted thereon is fixed to the core layer in such a way that the IC component is located in the region of a recess in the core layer, - the upper covering layer is positioned over the core layer in such a way that the recesses in this covering layer are located above the contact surfaces provided on the substrate and - the laminar construction is welded together, under the effect of pressure and heat, so that, as a result of the bending of the substrate, the contact surfaces are pressed against the surfaces of the upper covering layer and the IC component is pressed into the interior of the laminar structure.
References Cited (Backward Citations)
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