EP0209791A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electronic memory card
Assignee: Casio Computer Co Ltd
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Filing: 1986-07-08
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Granted: —
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Expires: 2006-07-08
Abstract
Abstract In an electronic memory card, a IC pellet (21 have a number of electrode pads (10) which are provided on one surface thereof and have a size larger than that of bonding terminals formed in the IC pellet (2). The IC pellet (2) is received in a storage section (12A) of a upper inner core (12) and is adhered on a wiring substrate (13) by an anisotropic conductive adhesive tape (19). Thus, internal connecting terminals (138) formed on the substrate are electrically connected through portions of the conductive tape (19) to the electrode pads (10). The wiring substrate (13) mounted on a lower inner core (15) and is received in a storage section (14A) of a intermediate inner core (14). Films (16, 17) are formed on the multi film structure of the inner core (12, 14, 15) and wiring substrate (13) and contact terminals (18A to 18H) are so provided in the film (16) and inner core (12) as to be connected to the internal connecting terminals (138).
Inventors
- 👤 Kazuya Patents Development Div. Hamura R&D Hara
- 👤 Kenji Patents Development Div. Hamura R&D Rikuna
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 10:24
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; Y; Y10; Y10S; Y10S283/00; Y10S283/904
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
133 words
A structure for carrying an integrated circuit pellet (2) using carrier means (12, 13, 14, 15, 16, 17, 34, 39, 40, 42, 43) on which a large number of conductive leads (4A, 4B, 13B, 13A, 1BA-18H) are formed, characterized in that said integrated circuit pellet (2) comprises: a surface region in which a semiconductor element (6A) is formed to have a predetermined circuit configuration; a number of electrode terminals provided on said surface region and connected to said semiconductor element (6A); an insulating layer (9) formed on said surface region and covering the same except in the area of said electrode terminals; and connection pads (10) extending on said insulating layer (9) and connected to said electrode terminals, a size of said connection pad (10) being larger than that of said electrode terminal.
Claim 2
Dependent Claim
133 words
A structure for carrying an integrated circuit pellet (2) using carrier means (12, 13, 14, 15, 16, 17, 34, 39, 40, 42, 43) on which a large number of conductive leads (4A, 4B, 13B, 13A, 1BA-18H) are formed, characterized in that said integrated circuit pellet (2) comprises: a surface region in which a semiconductor element (6A) is formed to have a predetermined circuit configuration; a number of electrode terminals provided on said surface region and connected to said semiconductor element (6A); an insulating layer (9) formed on said surface region and covering the same except in the area of said electrode terminals; and connection pads (10) extending on said insulating layer (9) and connected to said electrode terminals, a size of said connection pad (10) being larger than that of said electrode terminal.
Claim 3
Dependent Claim
28 words
A structure according to claim 1, further comprising an anisotropic adhesive (19) interposed between said integrated circuit pellet (2) and said carrier means (13) to bond them together.
Claim 4
Dependent Claim
144 words
A structure for carrying an integrated circuit (2, 35) having a plurality of electrode terminals (10, 22) using carrier means (12, 13, 14, 15, 39, 40, 43) on which a large number of conductive leads (13A, 13B) are formed, comprising: conductive leads (13A, 13B, 22, 36) having connecting portions connected to corresponding electrode terminals (10, 35A) and formed on said carrier means (12, 13, 39); insulating means (16, 42), arranged on said carrier means (12, 13, 39), for covering said conductive leads (13A, 13B, 21B, 37); and external contact terminals (18A~18H, 22, 36A) to be connected to an external device outside said structure, each of which has one end extending through said insulating means (16, 42) by an external force and being connected to the corresponding conductive lead (13A, 13B, 22, 36), and the other end being exposed outside said insulating means (16, 42).
Claim 5
Dependent Claim
144 words
A structure for carrying an integrated circuit (2, 35) having a plurality of electrode terminals (10, 22) using carrier means (12, 13, 14, 15, 39, 40, 43) on which a large number of conductive leads (13A, 13B) are formed, comprising: conductive leads (13A, 13B, 22, 36) having connecting portions connected to corresponding electrode terminals (10, 35A) and formed on said carrier means (12, 13, 39); insulating means (16, 42), arranged on said carrier means (12, 13, 39), for covering said conductive leads (13A, 13B, 21B, 37); and external contact terminals (18A~18H, 22, 36A) to be connected to an external device outside said structure, each of which has one end extending through said insulating means (16, 42) by an external force and being connected to the corresponding conductive lead (13A, 13B, 22, 36), and the other end being exposed outside said insulating means (16, 42).
Claim 6
Dependent Claim
35 words
A structure according to claim 3, characterized in that said external contact terminals (18A-18H, 22, 36) are urged to be inserted in said insulating means (16, 42) from outside of said insulating means (16, 42).
Claim 7
Dependent Claim
40 words
A structure according to claim 3, characterized in that said external contact terminals (18A 18H, 22, 36) are mounted on the corresponding conductive leads (13A, 13B, 21B, 37) and are urged to be inserted in said insulating means (16, 42).
References Cited (Backward Citations)
No citation records indexed.
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