Patent EP0488641A1 successfully refreshed from Google Patents.
EP0488641A1
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Package for a semiconductor element or semiconductor elements
Assignee: NEC Corp
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Filing: 1991-11-26
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Granted: —
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Expires: 2011-11-26
Abstract
Abstract The invention discloses a package for a semiconductor element (1) or semiconductor elements in which the path of heat conduction from the heat source in the active layer of the semiconductor element to the heat releasing surface of the package is short and the heat-releasing area of the package substrate can be reduced. The package comprises a package substrate (2), at least one semiconductor element (1) mounted on the package substrate having an active layer in a surface which is directed away from the package substrate, a thin pliable electrically insulating resin layer (8) applied to the surface of each semiconductor element, a metal cap (6) which cooperates with the package substrate to hermetically enclose the space containing all of the one or more semiconductor elements, and a heat diffusing plate (9) of high thermal conductivity provided between the electrically insulating resin layer of each semiconductor element and the metal cap. A part of heat generated in the active layer is conducted through the heat diffusing plate to the metal cap and is released there, thereby shortening the heat path and reducing the heat-releasing surface of the package substrate.
Inventors
- 👤 Yasuhiro c/o NEC Corporation Kurokawa
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 13:31
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/251; H10W40/70; H10W40/77; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
81 words
A package for a semiconductor element or semiconductor elements, comprising: a package substrate, one or more semiconductor elements mounted on the package substrate, and having a surface which is directed away from the package substrate, a thin pliable electrically insulating layer applied to the said surface of each of the one or more semiconductor element(s), and one or more members of high thermal conductivity in contact with the thin pliable electrically insulating layer(s) to conduct heat away from the semiconductor element(s).
Claim 2
Dependent Claim
108 words
A package for a semiconductor element or semiconductor elements, comprising: a package substrate, one or more semiconductor elements mounted on the package substrate, each having an active layer in a surface which is directed away from the package substrate, a thin pliable electrically insulating resin layer applied to the surface of each of the one or more semiconductor elements, a metal cap which cooperates with the package substrate to hermetically enclose the space containing all of the one or more semiconductor elements, and one or more heat diffusing members of high thermal conductivity, each being provided between the metal cap and the thin pliable electrically insulating resin layer.
Claim 3
Dependent Claim
33 words
A package according to Claim 2, wherein the or each heat diffusing member is pressed against a semiconductor element through the electrically insulating resin layer by the elastic force of the metal cap.
Claim 4
Dependent Claim
63 words
A package according to any preceding claim, wherein the heat diffusing member(s) of high thermal conductivity are made of at least one metal selected from the group consisting of copper, silver, gold, aluminum, tungsten, molybdenum, nickel, and indium, or at least one electrically insulating material selected from the group consisting of diamond, boron nitride, silicon carbide, beryllium oxide, aluminum nitride and magnesium oxide.
Claim 5
Dependent Claim
36 words
A package according to any preceding claim, wherein the electrically insulating layer is formed from at least one rubber- or gel-like organic material selected from the group consisting of silicon resin, epoxy resin, and polyimide resin.
Claim 6
Dependent Claim
34 words
A package according to Claim 2 and any other preceding claims, wherein the metal cap is made of at least one material selected from the group consisting of kovar, 42 alloy, copper and iron.
Claim 7
Dependent Claim
41 words
A package according to Claim 5, wherein the electrically insulating layer contains, as a filler, powder of at least one electrically insulating material selected from the group consisting of diamond, boron nitride, silicon carbide, beryllium oxide, aluminum nitride and magnesium oxide.
Claim 8
Dependent Claim
20 words
A package according to Claim 5 or Claim 6, wherein the electrical insulating layer is 10 µm through 300µm thick.
Claim 9
Dependent Claim
51 words
A package according to Claims 2 and 5, wherein the electrically insulating resin layer is formed by compressing a rubber- or gel-like material previously applied to the surface of the semiconductor element with pressure applied against the surface of the semiconductor element by means of the elasticity of the metal cap.
Claim 10
Dependent Claim
93 words
A package for a semiconductor element or semiconductor elements, comprising: a package substrate, one or more semiconductor elements mounted on the package substrate, each having an active layer in a surface which is directed away from the package subtrate, a thin pliable electrically insulating resin layer applied to the surface of each of the one or more semiconductor elements, and a cap of high thermal conductivity which cooperates with the package substrate to enclose the space containing all of the one or more semiconductor elements and which contacts each electrically insulating resin layer.
Claim 11
Dependent Claim
59 words
A package according to Claim 10, wherein the cap of high thermal conductivity is made of at least one metal selected from the group consisting of copper, silver, gold, aluminum, tungsten, molybdenum, and nickel, or at least one electrically insulating material selected from the group consisting of diamond, boron nitride, silicon carbide, beryllium oxide, aluminum nitride and magnesium oxide.
Claim 12
Dependent Claim
38 words
A package according to Claim 10 or 11, wherein the electrically insulating resin layer is made of at least one rubber- or gel-like organic material selected from the group consisting of silicon resin, epoxy resin, and polyimide resin.
Claim 13
Dependent Claim
46 words
A package according to any of Claims 10 to 12, wherein the electrically insulating resin layer contains, as a filler, powder of at least one electrically insulating material selected from the group consisting of diamond, boron nitride, silicon carbide, beryllium oxide, aluminum nitride and magnesium oxide.
Claim 14
Dependent Claim
23 words
A package according to any of Claims 10 to 13, wherein the electrical insulating resin layer is 10 µm through 300 µm thick.
Claim 15
Dependent Claim
44 words
A package according to any of Claims 10 to 14, wherein the electrically insulating resin layer is formed by compressing a rubber or gel-like material previously applied onto the surface of the semiconductor element with pressure applied against the surface of the semiconductor element.
References Cited (Backward Citations)
FR2555812A1
Cited
EP0302641A1
Cited
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