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EP0302641A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Cooling structure for heat generating electronic components mounted on a substrate

Assignee: NEC Corp
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Filing: 1988-07-25
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Granted: —
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Expires: 2008-07-25
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Abstract

Abstract The cooling structure for heat-generating electronic com­ponents (2) mounted on a substrate (1) comprises a cold plate (7) fixed on the substrate and provided with through holes (5) opposed to the respective upper surfaces of the heat-generating electronic components. Flow paths (6) are formed within the cold plate (7) for circulating a coolant from an inlet (10) provided on a side of the cold plate to an outlet (11) provided on a side of the cold plate. Pistons or plugs (4) are inserted through and held within the through holes (5) so that the lower surfaces of these pistons or plugs come into contact with the upper surfaces of the heat-generating electronic components (2). An intermediate member (3) made of a heat-conductive material is interposed between the lower surfaces of the pistons (4) and the upper surfaces of the electronic components (2).

Inventors

  • 👤 Shinji C/O Nec Corporation Mine
  • 👤 Terumi C/O Nec Corporation Shimonishi

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-03 05:00
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/774; H10W40/40; H10W40/47

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 118 words
A cooling structure for heat generating electronic components mounted on a substrate comprising: a cold plate fixed on said substrate which is provided with first through holes opposed to the respective upper surfaces of said heat generating electronic components; flow paths formed within said cold plate for circulating a coolant; an inlet provided on a side of said cold plate for supplying said coolant into said flow paths; an outlet provided on a side of said cold plate for exhausing said coolant from said flow paths; and pistons inserted through and held within said first through holes so that the lower surfaces of said pistons come into contact with said upper surfaces of said heat generating electronic components.
Claim 2
Dependent Claim 118 words
A cooling structure for heat generating electronic components mounted on a substrate comprising: a cold plate fixed on said substrate which is provided with first through holes opposed to the respective upper surfaces of said heat generating electronic components; flow paths formed within said cold plate for circulating a coolant; an inlet provided on a side of said cold plate for supplying said coolant into said flow paths; an outlet provided on a side of said cold plate for exhausing said coolant from said flow paths; and pistons inserted through and held within said first through holes so that the lower surfaces of said pistons come into contact with said upper surfaces of said heat generating electronic components.
Claim 3
Dependent Claim 40 words
A cooling structure as claimed in Claim 1, wherein an intermediary member made of a heat-conductive material is interposed between each of said lower surfaces of said pistons and a corresponding one of said upper surfaces of said electronic components.
Claim 4
Dependent Claim 73 words
A cooling structure as claimed in Claim 1, wherein each of said pistons comprises: a longitudinal slit extending through the center thereof; a threaded hole formed within said slit; and a screw which is inserted into said threaded hole so as to expand said slit for causing the wall surface of the first through hole, in which the piston is inserted, to snugly come into contact with the outer surface of the piston.
Claim 5
Dependent Claim 116 words
A cooling structure as claimed in Claim 2, wherein said intermediary member has a first threaded hole; and each of said pistons comprises: a longitudinal slit extending through the center thereof; a second through hole provided at the center thereof; a first screw inserted through said second through hole to be engaged with said first threaded hole; a second threaded hole formed within said slit at a position near said second through hole; and a second screw inserted into said second threaded hole so as to expand said slit for causing the wall surface of the first through hole, in which the piston is inserted, to come into contact with the outer surface of the piston.
Claim 6
Dependent Claim 29 words
A cooling structure as claimed in Claim 1, wherein said first through holes are threaded holes and said pistons is screws to be engaged with said first through holes.
Claim 7
Dependent Claim 40 words
A cooling structure as claimed in Claim 5, wherein an intermediary member made of a heat-conductive material is interposed between each of the lower surfaces of said pistons and a corresponding one of the upper surfaces of said electronic components.
Claim 8
Dependent Claim 13 words
A cooling structure as claimed in Claim 1, wherein said pistons are cylindrical.
Claim 9
Dependent Claim 19 words
A cooling structure as claimed in Claim 2, wherein said heat-conductive material is one of metal and silicone rubber.
Claim 10
Dependent Claim 19 words
A cooling structure as claimed in Claim 6, wherein said heat-conductive material is one of metal and silicone rubber.

References Cited (Backward Citations)

US3405323A Cited
FR2569306A1 Cited

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