Patent EP0484180A1 successfully refreshed from Google Patents.
EP0484180A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Packaged semiconductor device having an optimized heat dissipation
Assignee: Fujitsu VLSI Ltd
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Filing: 1991-11-01
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Granted: —
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Expires: 2011-11-01
Abstract
Abstract A packaged semiconductor device comprises a semiconductor chip (1), a heat dissipating block (10) having a first major surface (B) of a first surface area and establishing a contact with said semiconductor chip and a second major surface (A) of a second surface area substantially larger than the first surface area, a resin package body (5) having first and second, opposing major surfaces and accommodating therein the semiconductor chip such that the second major surface of the heat dissipating block is exposed at the second major surface of the package body, an interconnection lead (3) held by the package body and extending outward therefrom for external electrical connection; and a bonding wire (4) extending inside the package body for connecting the interconnection lead to the semiconductor chip.
Inventors
- 👤 Kazuto Tsuji
- 👤 Yoshiyuki Yoneda
- 👤 Takuya c/o Fujitsu VLSI Limited Kachi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 12:36
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/01; H10W74/016; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
211 words
A packaged semiconductor device comprising: a chip assembly (1, 2) including a semiconductor chip (1) and a lead frame (2) that supports the semiconductor chip thereon, said chip assembly having a first major surface and a second, opposing major surface; characterized in that said packaged semiconductor device further comprises: a heat dissipating block (10) having a first major surface (B) and a second, opposing major surface (A), said first major surface of the heat dissipating block having a first surface area and establishing a contact with said first major surface of the chip assembly, said second major surface of the heat dissipating block having a second surface area substantially larger than said first surface area; a resin package body (5) having first and second, opposing major surfaces and accommodating therein said chip assembly between said first major surface and said second major surface of the package body; said heat dissipating block being provided such that said second major surface of the heat dissipating block being exposed at the second major surface of the package body; an interconnection lead (3) held by the package body and extending outward therefrom for external electrical connection; and a bonding wire (4) extending inside the package body for connecting the interconnection lead to the semiconductor chip.
Claim 2
Dependent Claim
54 words
A packaged semiconductor device as claimed in claim 1 characterized in that said second major surface (S) of the package body having a third surface area wherein said second surface area of said second surface (A) of the heat dissipating block is equal to or larger than 90 percent of the third surface area.
Claim 3
Dependent Claim
89 words
A packaged semiconductor device as claimed in claim 1 characterized in that said heat dissipating block (10) comprises a heat radiation part (10a) and a heat conduction part (10b), said heat radiation part having a first major surface and a second, opposing major surface that is coincident with said second major surface of the heat dissipating block, said heat conduction part having a first major surface coincident with said first major surface of the heat dissipating block and extending from the first major surface of the heat radiation part.
Claim 4
Dependent Claim
37 words
A packaged semiconductor device as claimed in claim 3 characterized in that said first major surface of the heat radiation part (10a) is separated from said lead (3) by a distance (ℓ) set larger than 1.0 mm.
Claim 5
Dependent Claim
101 words
A packaged semiconductor device as claimed in claim 1 characterized in that said packaged semiconductor device further comprises a second heat dissipating block (10₂) having a first major surface and a second, opposing major surface, said first major surface and said second major surface of said second heat dissipating block respectively having third and fourth surface areas wherein said fourth surface area is formed substantially larger than said third surface area, said second heat dissipating block being provided such that said second major surface of said second heat dissipating block is exposed at the first major surface of the package body.
Claim 6
Dependent Claim
45 words
A packaged semiconductor device as claimed in claim 5 characterized in that said second heat dissipating block (10₂) is provided such that said first major surface of said second heat dissipating block faces the second major surface of the chip assembly with a separation therefrom.
Claim 7
Dependent Claim
46 words
A packaged semiconductor device as claimed in claim 5 characterized in that said second heat dissipating block (10₂) is provided such that said first major surface of said second heat dissipating block establishes a contacting engagement with said first major surface of said chip assembly (1).
Claim 8
Dependent Claim
122 words
A packaged semiconductor device as claimed in claim 3 characterized in that said heat radiation part (10a) and said heat conduction part (10b) have respective first and second side walls, said first side wall of the heat radiation part extending between said first and second major surfaces of said heat radiation part and surrounding said heat radiation part, said second side wall of the heat conduction part extending between said first major surface of the heat radiation part and said first major surface of the heat conduction part and surrounding the heat conduction part, each of said first and second side walls being separated from said package body to form a space (11a) between the package body (5) and the side walls.
Claim 9
Dependent Claim
25 words
A packaged semiconductor device as claimed in claim 8 characterized in that said space (11a) is communicated with an exterior of the package body (5).
Claim 10
Dependent Claim
39 words
A packaged semiconductor device as claimed in claim 9 characterized in that said gap has a size of 50 µm - 500 µm when measured in a direction outward from said side wall of the heat radiation part (10a).
Claim 11
Dependent Claim
42 words
A packaged semiconductor device as claimed in claim 1 characterized in that said heat dissipating block (10₁) has a threaded hole (10d) opening at the exposed second major surface of the heat dissipating block for mounting an external heat radiation unit (10′).
Claim 12
Dependent Claim
64 words
A packaged semiconductor device as claimed in claim 1 characterized in that said chip assembly comprises the semiconductor chip (1) and a lead frame stage (2) for supporting the semiconductor chip, said lead frame stage having a first major surface for supporting the semiconductor chip thereon and a second, opposing major surface that is coincident with the first major surface of the chip assembly.
Claim 13
Dependent Claim
48 words
A packaged semiconductor device as claimed in claim 1 characterized in that said chip assembly comprises the semiconductor chip (1) and a lead frame stage (2) for supporting the semiconductor chip, said semiconductor chip having a major surface coincident with said first major surface of the chip assembly.
Claim 14
Independent Claim
223 words
A method for manufacturing a semiconductor device, said semiconductor device having a resin package body, characterized by the steps of: establishing an interconnection (4) between a semiconductor chip (1) mounted on a lead frame (2, 3) and an inner lead (3a) formed on said lead frame (3) to form a chip assembly, said chip assembly comprising said semiconductor chip and the lead frame; incorporating the chip assembly into a cavity (19c) of a mold (19), said cavity having a shape corresponding to the shape of a package body (5) to be formed, said chip assembly being so provided in said cavity such that a part of the chip assembly establishes an intimate contact with an inner surface of the mold; applying a suction via a vent (21) formed in the mold such that the chip assembly is held firmly against the inner surface of the cavity; pouring a molten resin into said cavity while holding firmly the chip assembly against the inner surface of the cavity; curing the molten resin to form the resin package body such that the chip assembly is embedded in the resin package body; and mounting a heat dissipating structure (10) on said resin package in correspondence to said part of the chip assembly that has been contacted with said mold in the step of pouring the molten resin.
Claim 15
Dependent Claim
61 words
A method as claimed in claim 14 characterized in that said mold (19) has a vent (21) for evacuating the cavity (19c), and said step of incorporating the chip assembly into the cavity is achieved such that said chip assembly establishes an intimate contact with the inner wall of the cavity in correspondence to a part where the vent is formed.
Claim 16
Independent Claim
207 words
A method for manufacturing a semiconductor device having a resin package body, characterized by the steps of: establishing an interconnection (4) between a semiconductor chip (1) mounted on a lead frame (2, 3) and an inner lead (3a) formed on said lead frame (3) to form a chip assembly, said chip assembly comprising said semiconductor chip and the lead frame; mounting a heat dissipating block (10, 10₁) for dissipating heat generated by the semiconductor device, on said chip assembly such that the heat dissipating block establishes a rigid connection with said chip assembly; incorporating the chip assembly into a cavity (19c) of a mold (19) together with said heat dissipating block, said cavity having a shape corresponding to the shape of a package body (5) to be formed, said chip assembly and heat dissipating block being so provided in said cavity that said heat dissipating block establishes an intimate contact with an inner surface of said cavity; applying a suction via an evacuation vent (21) formed in the mold such that the heat dissipating block is held firmly against the inner surface of the cavity; and pouring a molten resin into said cavity while holding firmly the heat dissipating block against the mold by applying the suction.
Claim 17
Dependent Claim
128 words
A semiconductor device as claimed in claim 16 in which said mold (19) comprises a first mold part (19b) having a first depression and a second mold part (19a) having a second depression, said first depression and said second depression forming said cavity (19C) when said first mold part and said second mold part are assembled with each other, said step of incorporating the chip assembly into the cavity of the mold comprises the steps of mounting the chip assembly on said first cavity of the first mold part in correspondence to a part where said evacuation vent (21) is formed for evacuating the cavity, and placing the second mold part on said first mold part such that said cavity is formed by the first and second depressions.
Claim 18
Dependent Claim
80 words
A semiconductor device as claimed in claim 17 characterized in that said method further comprises a step of mounting a second heat dissipating block (10₂) on said second depression in correspondence to a part in which a second evacuation vent (21′) is formed, said step of placing the second mold part being achieved while applying a suction through said second evacuation vent such that the second heat dissipating block is held firmly against the second depression of the second mold.
Claim 19
Independent Claim
234 words
A method for manufacturing a semiconductor device having a resin package body, characterized by the steps of: establishing an interconnection (4) between a semiconductor chip (1) mounted on a lead frame (2, 3) and an inner lead (3a) formed on said lead frame (3) to form a chip assembly, said chip assembly comprising said semiconductor chip and said lead frame; mounting a first heat dissipating block (10₁) for dissipating heat generated by the semiconductor device, on a lower mold part (19b) having a first depression, said first heat dissipating block being provided with a through hole (10d) and mounted on said first depression such that the through hole is aligned with an evacuation vent (21) formed in said first depression part; mounting the chip assembly on said first heat dissipating block held in the first depression such that the chip assembly closes the through hole in the first heat dissipating block; applying a suction via said evacuation vent (21) such that the chip assembly and the heat dissipating block are held firmly against an inner surface of the first depression; placing an upper mold part (19a) formed with a second depression such that the second depression faces the first depression to form a cavity corresponding to the shape of the resin package body by said first and second depressions; and pouring a molten resin into said cavity while applying the suction via the vent.
Claim 20
Independent Claim
234 words
A method for manufacturing a semiconductor device having a resin package body, characterized by the steps of: establishing an interconnection (4) between a semiconductor chip mounted on a lead frame (2, 3) and an inner lead (3a) formed on said lead frame (3) to form a chip assembly, said chip assembly comprising said semiconductor chip and said lead frame and having upper and lower major surfaces; mounting said chip assembly on a lower heat dissipating block (10₁) such that the lower major surface of the chip assembly is connected to the lower heat dissipating block rigidly, said lower heat dissipating block having a lower major surface; mounting an upper heat dissipating block (10₂) on said upper major surface of said chip assembly such that the upper heat dissipating block is connected to said chip assembly rigidly, said upper heat dissipating block having an upper major surface; placing the chip assembly together with the upper and lower heat dissipating blocks connected thereto, into a mold (19) that is formed with a cavity having upper and lower inner walls, such that the upper major surface of the upper heat dissipating block engages with the upper inner wall of the cavity and such that the lower major surface of the lower heat dissipating block engages with the lower inner wall of the cavity; and pouring a molten resin into said cavity to form the resin package body.
References Cited (Backward Citations)
DE2443988A1
Cited
EP0232837A2
Cited
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