Patent EP0475022A1 successfully refreshed from Google Patents.
EP0475022A1
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EP
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Direct attachment of semiconductor chips to a substrate with a thermoplastic interposer
Assignee: International Business Machines Corp
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Filing: 1991-07-19
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Granted: —
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Expires: 2011-07-19
Abstract
Abstract A method for the direct attachment of semiconductor chips (10) to a substrate or module (12) with a polymer interposer (16). Initially, an interposer sheet (16) is fabricated, which is to be positioned between the chips (10) and the substrate (12), with via patterns conforming to the contact patterns of the chips (10). The interposer sheet (16) comprises a sheet of dielectric thermoplastic material selected from an elastomer, a filled elastomer, a polymer, or a copolymer. The chips (10) are then placed on the interposer sheet (16) with each chip (10) being positioned on a conforming via pattern, and the chips (10) are attached to the interposer sheet (16), as with a suitable adhesive. The vias are then filled with a conductive attachment material (24) comprising a solution of a thermoplastic polymer, preferably a copolymer of polyimide and siloxane, and a fine metal, preferably gold, forming a paste. The interposer sheet (16) with the attached chips (10) is then diced into individual chips (10), with each chip (10) having a section of the interposer sheet (16) attached thereto. The chips (10) with attached interposer (16) are then directly attached to a substrate or module (12), with the interposer (16) therebetween, by applying heat and pressure, and the substrate (12) provides a controlled joint height and encapsulated joints.
Inventors
- 👤 Gary W. Grube
- 👤 Igor Y. Khandros
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 12:40
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W72/00; H10W72/60; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/01; H10W72/012; H10W72/01251; H10W72/01255; H10W72/013; H10W72/01331; H10W72/01336; H10W72/01351; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/073; H10W72/07331; H10W72/07337; H10W72/076; H10W72/07631; H10W72/07636; H10W72/20; H10W72/241; H10W72/30; H10W72/331; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49146
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
130 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12), comprising: a) fabricating a thermoplastic and dielectric interposer (16), which is to be positioned between the chip (10) and the substrate (12), with a via pattern matching the contact pattern of the chip (10); b) placing the chip (10) on the interposer (16) with the contact pattern of the chip (10) being positioned on the matching via pattern, and attaching the chip (10) to the interposer (16); c) filling the vias of the interposer (16) with a conductive attachment material; and d) directly attaching the chip (10) with attached interposer (16) to a substrate or module (12), with the interposer (16) therebetween, with the interposer (16) providing a controlled joint height and providing encapsulated joints.
Claim 2
Dependent Claim
145 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12) as claimed in claim 1, wherein: a) said step of fabricating comprises fabricating a thermoplastic and dielectric interposer sheet (16), which is to be positioned between a plurality of chips (10) and the substrate (12), with via patterns matching the contact patterns of the chips (10); b) said step of placing comprises placing the chips (10) on the interposer sheet (16) with each chip (10) being positioned on a matching via pattern, and attaching the chip (10) to the interposer sheet; c) said step of filling comprises filling the vias on the interposer sheet (16) with a conductive attachment material (24); and d) dicing the interposer sheet (16) with the attached chips (10) into individual chips (10), with each chip having a section of the interposer sheet (16) attached thereto.
Claim 3
Dependent Claim
58 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12) as claimed in claim 1 or claim 2, wherein the vias are filled with a conductive attachment material (24) comprising a solution of a thermoplastic polymer, preferably a copolymer of polyimide and siloxane, and a conductive fine metal, preferably gold, forming a paste.
Claim 4
Independent Claim
46 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12) as claimed in anyone of the preceding claims, wherein the interposer (16) is formed of a material selected from an elastomer, a filled elastomer, a thermoplastic polymer, and a thermoplastic copolymer.
Claim 5
Dependent Claim
40 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12) as claimed in claim 4, wherein the interposer (16) and conductive attachment materials are similar materials having matching properties and matching coefficients of thermal expansion.
Claim 6
Independent Claim
86 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12) as claimed in anyone of the preceding claims, wherein said step of fabricating the interposer (16) includes fabricating the interposer (16) with a layer of relatively weak adhesive (18) on one side for attaching the interposer (16) to a substrate or module (12), covered by a peel off sheet (20), and with a layer of relatively strong adhesive (22) on a second side for attaching chips (10) to the interposer (16).
Claim 7
Dependent Claim
45 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12) as claimed in claim 6, wherein said step of fabricating the interposer (16) includes laser ablating the interposer (16) to create via patterns matching the contact patterns of the chips.
Claim 8
Independent Claim
38 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12) as claimed in anyone of the preceding claims, wherein the chip (10) is attached to the interposer (16) with a first adhesive (22).
Claim 9
Dependent Claim
80 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12) as claimed in claim 8, wherein the chip (10) is attached to the substrate or module (12) with a second adhesive (18) which is not as strong in bonding strength as the first adhesive (22), to provide for rework in which the second adhesive (18) is ruptured to detach the chip (10) from the substrate or module (12) while the first adhesive (22) remains intact.
Claim 10
Dependent Claim
39 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12) as claimed in claim 9, wherein following rupture, a pattern of conductive attachment material (24) is applied locally onto the substrate or module (12).
Claim 11
Independent Claim
39 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12) as claimed in anyone of the preceding claims, wherein following the filling step, the chip (10) is burned-in by contacting a burn-in module (25).
Claim 12
Dependent Claim
77 words
A method of direct attachment of semiconductor chips (10) to a substrate or module (12) as claimed in claim 11, wherein the burn-in module (25) is provided with a bump (26) for each via, and the radius of each bump (26) on the burn-in module (25) is larger than the radius of bumps (28) of conductive attachment material (24) provided on the substrate or module (12) to ensure adequate composite flow during the step of directly attaching.
References Cited (Backward Citations)
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