EP0435155A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Radiating fin having improved life and thermal conductivity
Assignee: Sumitomo Electric Industries Ltd
•
Filing: 1990-12-19
•
Granted: —
•
Expires: 2010-12-19
Abstract
Abstract A radiating fin attached to a semiconductor packaging device for accommodating a semiconductor device for externally diffusing heat generated from the semiconductor device, which is light and having improved thermal conductivity is provided. The radiating fin includes a fin formed of an aluminum alloy, and a connecting portion formed of a Mo-Cu composite material for connecting the fin to the semiconductor packaging device. The fin and the connecting portion are friction welded and in tight contact at the boundary thereof.
Inventors
- 👤 Mitsuo Osada
- 👤 Yugaku Abe
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 04:17
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/25; H10W40/258; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
73 words
A radiating fin attached to a semiconductor packaging device for accommodating a semiconductor device for externally diffusing heat generated from said semiconductor device, comprising: a fin formed of an aluminum alloy; and a connecting portion formed of a composite material selected from the group consisting of Mo-Cu, Cu-W and Aℓ-Si for connecting said fin to said semiconductor packaging device; wherein said fin and said connecting portion are friction welded at the boundary therebetween.
Claim 2
Dependent Claim
22 words
A radiating fin according to claim 1, wherein content of Cu in said Mo-Cu composite material is 2 to 30 wt. %.
Claim 3
Dependent Claim
20 words
A radiating fin according to claim 1, wherein significant gravity of said Mo-Cu composite material is 9 to 10 g/cc.
Claim 4
Dependent Claim
22 words
A radiating fin according to claim 1, wherein said Mo-Cu composite material or said Cu-W composite material includes an iron family element.
Claim 5
Dependent Claim
20 words
A radiating fin according to claim 4, wherein content of said iron family element is not higher than 20 wt%.
Claim 6
Dependent Claim
21 words
A radiating fin according to claim 1, wherein content of Cu in said Cu-W composite material is 2 to 30 wt%.
Claim 7
Dependent Claim
18 words
A radiating fin according to claim 1, wherein boundary between said fin and said connecting portion is flat.
Claim 8
Dependent Claim
32 words
A radiating fin according to claim 1, wherein at the boundary between said fin and said connecting portion, an edge of said connecting portion is conical shape going in facing said fin.
Claim 9
Dependent Claim
21 words
A radiating fin according to claim 8, wherein angle of the edge of said conical shape is not higher than 160°.
Claim 10
Dependent Claim
14 words
A radiating fin according to claim 1, wherein said Aℓ alloy comprises pure Aℓ.
Claim 11
Dependent Claim
15 words
A radiating fin according to claim 1, wherein said Aℓ alloy comprises an Aℓ-Si alloy.
Claim 12
Dependent Claim
75 words
A radiating fin attached to a semiconductor packaging device for accommodating a semiconductor device for externally diffusing heat generated from said semiconductor device, comprising: a fin formed of an aluminum alloy; and a connecting portion formed of a composite material selected from the group consisting of Mo-Cu, Cu-W and Aℓ-Si for connecting said fin and said semiconductor packaging device; wherein said fin and said connecting portion are coupled by metallic bond at the boundary thereof.
References Cited (Backward Citations)
US4115837A
Cited
US4361720A
Cited
US4535384A
Cited
US4621304A
Cited
EP0124029A2
Cited
US4626960A
Cited
US4700273A
Cited
US4788627A
Cited
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.