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EP0403688A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Improved thermal conductive material

Assignee: EIDP Inc
•
Filing: 1989-10-03
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Granted: —
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Expires: 2009-10-03
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Abstract

Abstract Carbon fibers which have a lamellar microstructure made from mesophase pitch are used to reinforce polymer resins to form a composite. The composite exhibits high thermal conductivity values.

Inventors

  • 👤 Clifford Karl Deakyne
  • 👤 John Gerard Lavin

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 19:12
CPC Classifications
D; D01; D01F; D01F9/00; D01F9/08; D01F9/12; D01F9/14; C; C08; C08K; C08K7/00; C08K7/02; C08K7/04; C08K7/06; H; H01; H01B; H01B1/00; H01B1/20; H01B1/24

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 18 words
A thermal conductive material comprising: a resin reinforced with a three-dimensional arrangement of mesophase pitch based carbon fibers.
Claim 2
Dependent Claim 18 words
A thermal conductive material comprising: a resin reinforced with a three-dimensional arrangement of mesophase pitch based carbon fibers.
Claim 3
Dependent Claim 14 words
The material of claim 1 wherein said carbon fibers have a predominately lamellar structure.
Claim 4
Dependent Claim 27 words
The material as defined in claim 1 or 2 wherein said fibers have a distribution of diameters ranging from about 1 micrometer to more than 10 micrometers.

References Cited (Backward Citations)

US4138525A Cited
WO1986000629A1 Cited
EP0206254A2 Cited
EP0257466A2 Cited

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