Optical semiconductor device and production thereof

Claim 2

The optical semiconductor device assembling method as claimed in claim 1, wherein said first step consists of firstly adjusting the relative positions of the optical semiconductor element and the lens in a direction perpendicular to an optical axis thereof, and of then fixing said lens holder on said mount by a laser welding, and said second step consists of adjusting the relative positions of the optical semiconductor element and the lens in the direction of the aforementioned optical axis by the laser irradiation on said part to be laser irradiated.

Claim 3

The optical semiconductor device assembling method as claimed in claim 1, wherein said first step consists of firstly adjusting the relative positions of the optical semiconductor element and the lens in a direction of an optical axis thereof and of then fixing said lens holder on said mount by a laser welding, and said second step consists of adjusting the relative positions of the optical semiconductor element and the lens in a direction perpendicular to the aforementioned optical axis by the laser irradiation on said part to be laser irradiated.

Claim 4

The optical semiconductor device assembling method as claimed in claim 1, wherein said lens holder holds the lens by a raised portion which is formed by a pair of slits in said holder, and said part to be laser irradiated is provided at a base portion of the aforementioned slits, said first step consisting of firstly adjusting the relative positions of the optical semiconductor element and the lens in a direction perpendicular to an optical axis thereof and of then fixing said lens holder on said mount by a laser welding, and said second step consisting of adjusting the relative positions of the optical semiconductor element and the lens in the direction of the aforementioned optical axis by the laser irradiation on said part to be laser irradiated.

Claim 5

The optical semiconductor device assembling method as claimed in claim 1, wherein said part to be laser irradiated is a groove provided in said lens holder, said second step consisting of adjusting the relative positions of the optical semiconductor element and the lens in a direction of an optical axis thereof by the laser irradiation on said groove.

Claim 6

The optical semiconductor device assembling method as claimed in claim 1, wherein a hole is provided in at least one of said mount and said lens holder, which has a shape with a corner, said part to be laser irradiated being provided at an arbitrary corner portion of said hole, and said second step consisting of adjusting the relative positions of the optical semiconductor element and the lens in a direction perpendicular to an optical axis thereof by the laser irradiation on said part to be laser irradiated.

Claim 7

The optical semiconductor device assembling method as claimed in claim 1, wherein said lens holder comprises a plurality of plate pairs which are connected, with the two plates of each plate pair which are connected at a base portion thereof to form an approximate V-shape, said lens is fixed to one plate of an arbitrary plate pair, said part to be laser irradiated is provided at the base portion of each plate pair, said second step consisting of adjusting the relative positions of the optical semiconductor element and the lens in a direction perpendicular to an optical axis thereof by the laser irradiation on said part to be laser irradiated.

Claim 8

The optical semiconductor device assembling method as claimed in any of the claims 1 to 7, wherein said first step includes a substep of accommodating said mount and said lens holder in a package structure which seals said mount and said lens holder.

Claim 9

The optical semiconductor device assembling method as claimed in claim 8, wherein said package structure has a window for laser irradiation provided at a portion in correspondence with said part to be laser irradiated, and said second step consists of making the laser irradiation of said part to be laser irradiated through the aforementioned window for laser irradiation.

Claim 10

The optical semiconductor device assembling method as claimed in claim 8, wherein said package structure has a window for the outgoing light beam which is emitted from the optical semiconductor element, and said second step consists of making the laser irradiation of said part to be laser irradiated through the aforementioned window for the outgoing light beam.

Claim 11

An optical semiconductor device comprising: a mount (72, 73, 79) holding an optical semiconductor element (40), a lens holder (80) which holds a lens (50) for converting the beam shape of the light emitted from the optical semiconductor element (40) and which is in a fixed relationship to said mount (72, 73, 79), and at least one adjusting part (Q) provided on at least one of said mount (72, 73, 79) or said lens holder (80), the at least one adjusting part (Q) being suitable for enabling the relative position of said semiconductor element (40) to said lens holder (80) to be adjusted, characterized in that said lens holder (80) comprises a plurality of plate pairs (82, 83, 84) which are connected in series, with each plate pair (82, 83, 84) having two elongate plates which are connected to each other at respective end portions thereof to form an approximate V-shape, a given plate pair being connected by its apex to the free end portion of one of the two plates of the preceding plate pair, that plate of the first plate pair which is not connected to the second plate pair being disposed in said fixed relationship to said mount, said lens (50) being fixed to one plate of the last plate pair (82, 83, 84), said adjusting part (Q) being provided on each V-shaped plate pair (82, 83, 84) near the apex thereof, and the relative positions of the optical semiconductor element (40) and the lens (50) being adjustable in a direction perpendicular to an optical axis thereof by laser irradiation on said adjusting part (Q).

Claim 12

The optical semiconductor device as claimed in claim 11, characterized in that there is further provided a package structure for sealing said mount (72, 73, 79) and said lens holder (80), and said package structure has a window (118) for laser irradiation provided at a portion in correspondence with said adjusting part (Q).

Claim 13

The optical semiconductor device as claimed in claim 12, characterized in that said window (118) for laser irradiation is commonly used as a window for an outgoing the light beam which is emitted from the optical semiconductor element (40).