Patent EP0325451A1 successfully refreshed from Google Patents.
EP0325451A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Soldering apparatus of a reflow type
Assignee: Nihon Den Netsu Keiki Co Ltd
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Filing: 1989-01-19
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Granted: —
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Expires: 2009-01-19
Abstract
Abstract A soldering apparatus (4) of a reflow type contains a preheating chamber (8, 9) and a reflow chamber (10) which are provided with a plurality of heaters (11) for heating printed circuit boards (1) with chips (2) temporarily mounted thereon with solder pastes (3) during conveyance by a conveyor (5). The heaters (11) are provided with a screening member (26) and/or a partition member (12) so as to prevent direct radiation of radiant heat from the heaters (11) into the chambers and onto the printed circuit boards (1) and to provide a unform air flow so as to be blown uniformly onto the printed circuit boards (1). The heaters (11) are arranged so as to heat them in such a manner as to ascend temperatures in the order from an inlet (6) to an outlet (7) so as to become higher with a predetermined temperature differential from the previous heater, thus removing bubbles generated upon fusion of the solder pastes (3) and minimizing a heat shock exerted on the chips (2) when they are heated. The soldering apparatus is further provided with a combustion unit (20) with a catalyst (23) for removing fume and odoring gases generated in the chamber and for circulating the heated air after removal of such fume and gases. These arrangement can provide printed circuit boards of higher quality and with high productivity.
Inventors
- 👤 Kenshi Kondo
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 11:52
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; B; B23; B23K; B23K1/00; B23K1/008
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
171 words
In a soldering apparatus of a reflow type comprising a conveyor means for conveying a printed circuit board on which a chip is temporarily mounted with a solder paste, a preheating chamber for preheating the printed circuit board, a reflow chamber for soldering the chip on the printed circuit board by fusion of the solder paste, and a fan for ventillating air in each of the chambers, the soldering apparatus comprises: a heater mounted on a side wall of the preheating chamber for heating air therein; a heater mounted on a side wall of the reflow chamber for heating air therein; a screening member mounted along the heater each in the preheating chamber and in the reflow chamber so as to prevent direct radiation of radiant heat each into the chambers and to the printed circuit board; and an air inlet and an air outlet disposed each in the preheating chamber and the reflow chamber for circulating air heated by the heater in the preheating chamber and in the reflow chamber.
Claim 2
Dependent Claim
171 words
In a soldering apparatus of a reflow type comprising a conveyor means for conveying a printed circuit board on which a chip is temporarily mounted with a solder paste, a preheating chamber for preheating the printed circuit board, a reflow chamber for soldering the chip on the printed circuit board by fusion of the solder paste, and a fan for ventillating air in each of the chambers, the soldering apparatus comprises: a heater mounted on a side wall of the preheating chamber for heating air therein; a heater mounted on a side wall of the reflow chamber for heating air therein; a screening member mounted along the heater each in the preheating chamber and in the reflow chamber so as to prevent direct radiation of radiant heat each into the chambers and to the printed circuit board; and an air inlet and an air outlet disposed each in the preheating chamber and the reflow chamber for circulating air heated by the heater in the preheating chamber and in the reflow chamber.
Claim 3
Dependent Claim
37 words
A soldering apparatus as claimed in claim 1, wherein the preheating chamber is provided at an air outlet portion with an air flow transforming member for providing a uniform flow of heated air in the preheating chamber.
Claim 4
Dependent Claim
37 words
A soldering apparatus as claimed in claim 1, wherein the reflow chamber is provided at an air outlet portion with an air flow transforming member for providing an uniform flow of heated air in the reflow chamber.
Claim 5
Dependent Claim
281 words
In a soldering apparatus of a reflow type comprising a conveyor means for conveying a printed circuit board from an inlet to an outlet, on which a chip is temporarily mounted with a solder paste, a preheating chamber for preheating the printed circuit board, a reflow chamber for soldering the chip on the printed circuit board by fusion of the solder paste, and a fan for ventillating air in each of the chambers, the soldering apparatus comprises: a plurality of heaters mounted at an air outlet portion of the preheating chamber in parallel to conveyance of the conveyor means for heating air to be blown onto the printed circuit board being conveyed by the conveyor means at higher temperatures in ascending manner from the inlet to the outlet of the conveyor means so as to heat the printed circuit board with a predetermined temperature differential; a plurality of heaters mounted at an air outlet portion of the reflow chamber in parallel to conveyance of the conveyor means for heating air to be blown onto the printed circuit board being conveyed by the conveyor means at higher temperatures in ascending manner from the inlet to the outlet of the conveyor means so as to heat the printed circuit board with a predetermined temperature differential; and a partition member mounted so as to separate each of the plurality of the heaters in the preheating chambers and in the reflow chambers so as to provide a flow of air heated therein to be blown onto the printed circuit board being conveyed by the conveyor means and to retain a predetermined temperature differntial between adjacent separate spaces in which each of the heaters is disposed.
Claim 6
Dependent Claim
281 words
In a soldering apparatus of a reflow type comprising a conveyor means for conveying a printed circuit board from an inlet to an outlet, on which a chip is temporarily mounted with a solder paste, a preheating chamber for preheating the printed circuit board, a reflow chamber for soldering the chip on the printed circuit board by fusion of the solder paste, and a fan for ventillating air in each of the chambers, the soldering apparatus comprises: a plurality of heaters mounted at an air outlet portion of the preheating chamber in parallel to conveyance of the conveyor means for heating air to be blown onto the printed circuit board being conveyed by the conveyor means at higher temperatures in ascending manner from the inlet to the outlet of the conveyor means so as to heat the printed circuit board with a predetermined temperature differential; a plurality of heaters mounted at an air outlet portion of the reflow chamber in parallel to conveyance of the conveyor means for heating air to be blown onto the printed circuit board being conveyed by the conveyor means at higher temperatures in ascending manner from the inlet to the outlet of the conveyor means so as to heat the printed circuit board with a predetermined temperature differential; and a partition member mounted so as to separate each of the plurality of the heaters in the preheating chambers and in the reflow chambers so as to provide a flow of air heated therein to be blown onto the printed circuit board being conveyed by the conveyor means and to retain a predetermined temperature differntial between adjacent separate spaces in which each of the heaters is disposed.
Claim 7
Dependent Claim
47 words
A soldering apparatus as claimed in claim 4, further comprising: a screening member mounted along the heater each in the preheating chamber and in the reflow chamber so as to prevent direct radiation of the radiant heat each into the chambers and to the printed circuit board.
Claim 8
Dependent Claim
35 words
A soldering apparatus as claimed in claim 1, further comprising a combustion unit with a catalyst for removing smoke and odoring gases generated in the preheating chamber and circulating heated air to the preheating chamber.
Claim 9
Dependent Claim
35 words
A soldering apparatus as claimed in claim 2, further comprising a combustion unit with a catalyst for removing smoke ang odoring gases generated in the preheating chamber and circulating heated air to the preheating chamber.
Claim 10
Dependent Claim
35 words
A soldering apparatus as claimed in claim 3, further comprising a combustion unit with a catalyst for removing smoke and odoring gases generated in the preheating chamber and circulating heated air to the preheating chamber.
Claim 11
Dependent Claim
35 words
A soldering apparatus as claimed in claim 4, further comprising a combustion unit with a catalyst for removing smoke and odoring gases generated in the preheating chamber and circulating heated air to the preheating chamber.
Claim 12
Dependent Claim
35 words
A soldering apparatus as claimed in claim 5, further comprising a combustion unit with a catalyst for removing smoke and odoring gases generated in the preheating chamber and circulating heated air to the preheating chamber.
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FR2149260A1
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DE2928156A1
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US4654502A
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US4654502B1
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EP0237151A1
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EP0251257A2
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