Patent EP0285701A1 successfully refreshed from Google Patents.
EP0285701A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Printed wiring board
Assignee: Nippon CMK Corp
•
Filing: 1987-10-29
•
Granted: —
•
Expires: 2007-10-29
Abstract
Abstract A printed wiring board includes an insulated base plate (1), a circuit pattern at least on one surface of the base plate (1), and solder resist film (6) containing silicon series and/or fluorine series resin and covering the base plate (1) except desired soldering area of the circuit pattern. Such solder resist film (6) has desired property to prevent bridging of solder across adjacent circuits. However, the solder repelling property apts to form dots on the solder resist film (6). Accordingly, at least one flux accumulating means is formed on said one surface of the base plate (1) to accumulate flux repelled by the solder resist film. The flux accumulating means may be recess and/or through hole means arranged on the surface of the solder resist film.
Inventors
- 👤 Hideo Machida
- 👤 Shin Kawakami
- 👤 Satoshi Haruyama
- 👤 Hirotaka Okonogi
- 👤 Katutomo Nikaido
- 👤 Norito Mukai
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 18:51
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09063; H05K2201/09818; H05K2201/0989; H05K3/3489
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
81 words
A printed wiring board including an insulated base plate (1), a circuit pattern at least on one surface of the base plate (1), and solder resist film (6) containing silicon series and/or fluorine series resin and covering the base plate (1) except desired soldering area of the circuit pattern (2), characterized in that at least one flux accumulating means formed on said one surface of the base plate (1) to accumulate flux repelled by the solder resist film (6) is provided.
Claim 2
Dependent Claim
81 words
A printed wiring board including an insulated base plate (1), a circuit pattern at least on one surface of the base plate (1), and solder resist film (6) containing silicon series and/or fluorine series resin and covering the base plate (1) except desired soldering area of the circuit pattern (2), characterized in that at least one flux accumulating means formed on said one surface of the base plate (1) to accumulate flux repelled by the solder resist film (6) is provided.
Claim 3
Dependent Claim
40 words
A printed wiring board as set forth in claim 1, characterized in that said flux accumulating means includes at least one flux accumulating recess (8) formed on said one surface and is not covered by said solder resist film (6).
Claim 4
Dependent Claim
32 words
A printed wiring board as set forth in claim 1, characterized in that said flux accumulating means includes at least one flux accumulating through hole (4) formed through said base plate (1).
Claim 5
Dependent Claim
37 words
A printed wiring board as set forth in claim 2, characterized in that said flux accumulating means further includes a flux accumulating through hole (9) formed through said base plate (1) concentric with said flux accumulating recess.
Claim 6
Dependent Claim
28 words
A printed wiring board as set forth in claim 2, characterized in that said flux accumulating means further includes flux absorbing layer means covering said flux accumulating recess.
Claim 7
Dependent Claim
52 words
A printed wiring board as set forth in claim 4, characterized in that said base plate (1) having said solder resist film on each surface, in which said flux accumulating means includes at least one flux accumulating recess concentric with said through hole and without being covered by said solder resist film.
Claim 8
Dependent Claim
38 words
A printed wiring board as set forth in claim 3, characterized in that said base plate (1) having said solder resist film on each surface, in which said flux accumulating through hole passes through both solder resist films.
Claim 9
Dependent Claim
53 words
A printed wiring board as set forth in claim 3, characterized in that said base plate (1) having said solder resist film on each surface, in which said flux accumulating means further includes a flux accumulating recess concentric with each flux accumulating through hole and without being covered by said solder resist film.
Claim 10
Dependent Claim
40 words
A printed wiring board as set forth in claim 4, characterized in that said base plate (1) having said solder resist film on each surface, in which said flux accumulating through hole passes through solder resist film on other surface.
Claim 11
Dependent Claim
82 words
A printed wiring board as set forth in claim 1, characterized in that said flux accumulating means includes at least two sorts of, flux accumulating through hole through said base plate, flux accumulating recess formed on said one surface and without being covered by said solder resist film, flux accumulating recess formed on said one surface of the base plate and covered by flux absorbing layer, and flux accumulating recess formed on said one surface and having concentric flux accumulating through hole.
References Cited (Backward Citations)
DE8110967U1
Cited
EP0127794A2
Cited
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.