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EP0127794A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Method of making printed-circuit boards

Assignee: Bosch Telecom GmbH
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Filing: 1984-05-09
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Granted: —
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Expires: 2004-05-09
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Abstract

Abstract Translated from German Eine Verkürzung des Herstellungsverfahrens einer gedruckten Schaltung besteht darin, daß der als Ätzresist dienende Lack nach dem Ätzvorgang nicht von den Leiterbahnen entfernt wird, sondern auch beim späteren Lötvorgang als Lötstopplack ausgenutzt wird. A shortening of the manufacturing process of a printed circuit is that the lacquer serving as an etching resist is not removed from the conductor tracks after the etching process, but is also used as a solder resist during the later soldering process.

Inventors

  • 👤 Klaus Dipl.-Ing. Seeger

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-05 22:15
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/224; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0571; H05K2203/0597; H05K3/02; H05K3/06; H05K3/061; H05K3/064; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3473; H05K3/40; H05K3/42; H05K3/425; H05K3/427

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Total Claims: 0
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