Patent EP0619555A2 successfully refreshed from Google Patents.
Patent EP0258098A1 successfully refreshed from Google Patents.
EP0258098A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Encapsulated semiconductor device and method of producing the same
Assignee: Fujitsu VLSI Ltd
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Filing: 1987-07-24
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Granted: —
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Expires: 2007-07-24
Abstract
Abstract A semiconductor device has such a construction that free tip ends (15a, 16a) of stage bars (15,16) extending from a stage (12) do not extend to side surfaces (17a, 17b) of a resin package (17), and the resin package (17) is constituted by an inner resin package portion (18) and an outer resin package portion (19). The free tip ends of the stage bars (15,16) are located inside the outer resin package portion (19) and are completely sealed. A method of producing the semiconductor device comprises the steps of providing wires for electrically connecting terminals of a semiconductor element (11) which is mounted on the stage (12) with corresponding leads, forming the inner resin package portion (18) over the semiconductor element (11) and its vicinity including portions of the leads and stage bars (15,16) which are connected to the stage, cutting free tip ends of the stage bars (15,16), and forming the outer resin package portions (19) over the inner resin package portion and the remaining portion of the semiconductor device so that the cut free tip ends of the stage bars are completely sealed inside the outer resin package portion.
Inventors
- 👤 Toshimi Kawahara
- 👤 Michio Sono
- 👤 Hiroaki Hayashi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-10 01:20
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W74/121; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
201 words
A semiconductor device comprising: a stage (12); a semiconductor element (11) mounted on said stage, said semiconductor element having a plurality of terminals; a stage bar (15,16) extending from said stage, said stage bar having a base end connected to said stage and at least a free top end (15a, 16a; 41-1, 42-1); a plurality of leads (13); a plurality of wires (14) connecting the terminals of said semiconductor element (11) to corresponding ones of said leads (13); and a resin package (17) for sealing at least said stage (12), said semiconductor element (11) and said wires (14), characterized in that said resin package (17) comprises an inner resin package portion (18) and an outer resin package portion (19), said inner resin package portion (18) sealing said stage (12), said semiconductor element (11), said wires (14) and a portion of said stage bar (15,16) and portions of said leads (13) in a vicinity of said stage (12), said outer resin package portion (19) sealing said inner resin package portion (18) and portions of the remaining portions of said leads (13), said free tip end (15a, 16a; 41-1, 42-1) of said stage bar being located inside said outer resin package portion (19).
Claim 2
Dependent Claim
201 words
A semiconductor device comprising: a stage (12); a semiconductor element (11) mounted on said stage, said semiconductor element having a plurality of terminals; a stage bar (15,16) extending from said stage, said stage bar having a base end connected to said stage and at least a free top end (15a, 16a; 41-1, 42-1); a plurality of leads (13); a plurality of wires (14) connecting the terminals of said semiconductor element (11) to corresponding ones of said leads (13); and a resin package (17) for sealing at least said stage (12), said semiconductor element (11) and said wires (14), characterized in that said resin package (17) comprises an inner resin package portion (18) and an outer resin package portion (19), said inner resin package portion (18) sealing said stage (12), said semiconductor element (11), said wires (14) and a portion of said stage bar (15,16) and portions of said leads (13) in a vicinity of said stage (12), said outer resin package portion (19) sealing said inner resin package portion (18) and portions of the remaining portions of said leads (13), said free tip end (15a, 16a; 41-1, 42-1) of said stage bar being located inside said outer resin package portion (19).
Claim 3
Dependent Claim
61 words
A semiconductor device as claimed in claim 1 in which said inner resin package portion (18) comprises a first portion having a generally flat rounded shape, said first portion sealing said stage (12), said semiconductor element (11), said wires (14) and a portion of said stage bar (15, 16) and portions of said leads (13) in the vicinity of said stage.
Claim 4
Dependent Claim
48 words
A semiconductor device as claimed in claim 2 in which said inner resin package (18) portion further comprises at least one second portion extending from said first portion and covering portions of said leads (13), said second portion ending at a side surface of said resin package (17).
Claim 5
Dependent Claim
28 words
A semiconductor device as claimed in any of claims 1 to 3, in which said inner and outer resin package portions (18,19) are made of a thermosetting resin.
Claim 6
Dependent Claim
28 words
A semiconductor device as claimed in any of claims 1 to 4 in which said inner and outer resin package portions (18,19) are made of the same resin.
Claim 7
Dependent Claim
28 words
A semiconductor device as claimed in any of claims 1 to 4 in which said inner and outer resin package portions (18,19) are made of mutually different resins.
Claim 8
Dependent Claim
47 words
A semiconductor device as claimed in any of claims 1 to 4 in which said inner resin package portion (18) is made of a material having a thermal stress against the semiconductor element (11) smaller than that of the material constituting said outer resin package portion (19).
Claim 9
Independent Claim
228 words
A method of producing a semiconductor device comprising the steps of: mounting a semiconductor element (11) on a stage (12), said stage (12) being connected to a lead frame (20) via a stage bar (26,27), said lead frame (20) having a plurality of leads (13) extending therefrom; providing a plurality of wires (14) connecting terminals of said semiconductor element (11) to corresponding ones of said leads (13); molding a resin package (17) over at least said stage (12), said semiconductor element (11) and said wires (14), and cutting and removing unwanted portions of said lead frame; characterized in that said molding step comprises the following steps of: molding an inner resin package portion (18) over said stage (12), said semiconductor element (11), said wires (14) and a portion of said stage bar (26,27) and portions of said leads (13) in a vicinity of said stage (12); cutting at least a portion of said stage bar (26,27) between said inner resin package portion and said lead frame; and molding an outer resin package portion (19) over said inner resin package portion (18), portions of the remaining portions of said leads (13) and the exposed stage bar (15,16; 41-1, 42-1) from the inner resin package portion (18) so that a free tip end of said stage bar extending from said stage is located inside said outer resin package portion (19).
Claim 10
Independent Claim
228 words
A method of producing a semiconductor device comprising the steps of: mounting a semiconductor element (11) on a stage (12), said stage (12) being connected to a lead frame (20) via a stage bar (26,27), said lead frame (20) having a plurality of leads (13) extending therefrom; providing a plurality of wires (14) connecting terminals of said semiconductor element (11) to corresponding ones of said leads (13); molding a resin package (17) over at least said stage (12), said semiconductor element (11) and said wires (14), and cutting and removing unwanted portions of said lead frame; characterized in that said molding step comprises the following steps of: molding an inner resin package portion (18) over said stage (12), said semiconductor element (11), said wires (14) and a portion of said stage bar (26,27) and portions of said leads (13) in a vicinity of said stage (12); cutting at least a portion of said stage bar (26,27) between said inner resin package portion and said lead frame; and molding an outer resin package portion (19) over said inner resin package portion (18), portions of the remaining portions of said leads (13) and the exposed stage bar (15,16; 41-1, 42-1) from the inner resin package portion (18) so that a free tip end of said stage bar extending from said stage is located inside said outer resin package portion (19).
Claim 11
Dependent Claim
75 words
A method of producing a semiconductor device as claimed in claim 8 in which said step of molding said inner resin package portion (18) molds a first portion having generally flat rounded shape and sealing said stage (12), said semiconductor element (11), said wires (14), and a portion of said stage bar (25,26) and portions of said leads (13) in the vicinity of said stage, said first portion constituting said inner resin package portion (18).
Claim 12
Dependent Claim
67 words
A method of producing a semiconductor device as claimed in claim 9 in which said step of molding said inner resin package portion (18) simultaneously molds at least one second portion together with said first portion, said second portion being connected to said first portion and covering portions of said leads (13), said second portion constituting said inner resin package portion (18) together with said first portion.
Claim 13
Independent Claim
35 words
A method of producing a semiconductor device as claimed in any of claims 8 to 10 in which said steps of molding said inner and outer resin package portions (18, 19) use a thermosetting resin.
Claim 14
Independent Claim
34 words
A method of producing a semiconductor device as claimed in any of claims 8 to 11 in which said steps of molding said inner and outer resin package portions (18,19) use the same resin.
Claim 15
Independent Claim
34 words
A method of producing a semiconductor device as claimed in any of claims 8 to 11 in which said steps of molding said inner and outer resin package portions (18,19) use mutually different resins.
Claim 16
Independent Claim
55 words
A method of producing a semiconductor device as claimed in any of claims 8 to 11 in which said steps of molding said inner and outer resin package portions (18,19) use first and second resins, respectively, said first resin having a thermal stress against the semiconductor element (11) smaller than that of said second resin.
References Cited (Backward Citations)
US3902148A
Cited
US3778685A
Cited
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